IC 32K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP28,.6 |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 100 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDIP-T28 |
| JESD-609代码 | e0 |
| 长度 | 37 mm |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | -20 °C |
| 组织 | 32KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP28,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.3 mm |
| 最大待机电流 | 0.00005 A |
| 最小待机电流 | 2 V |
| 最大压摆率 | 0.07 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| Base Number Matches | 1 |
| TC55257BPL-10(LT) | TC55257BPL-85(LT) | TC55257BFL-85(LT) | TC55257BFTL-85(LT) | TC55257BTRL-10(LT) | TC55257BSPL-10(LT) | TC55257BFL-10(LT) | TC55257BFTL-10(LT) | TC55257BSPL-85(LT) | TC55257BTRL-85(LT) | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC 32K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM | IC 32K X 8 STANDARD SRAM, 85 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM | IC 32K X 8 STANDARD SRAM, 85 ns, PDSO28, 0.450 INCH, PLASTIC, SOP-28, Static RAM | IC 32K X 8 STANDARD SRAM, 85 ns, PDSO28, PLASTIC, TSOP-28, Static RAM | IC 32K X 8 STANDARD SRAM, 100 ns, PDSO28, PLASTIC, REVERSE, TSOP-28, Static RAM | IC 32K X 8 STANDARD SRAM, 100 ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28, Static RAM | IC 32K X 8 STANDARD SRAM, 100 ns, PDSO28, 0.450 INCH, PLASTIC, SOP-28, Static RAM | IC 32K X 8 STANDARD SRAM, 100 ns, PDSO28, PLASTIC, TSOP-28, Static RAM | IC 32K X 8 STANDARD SRAM, 85 ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28, Static RAM | IC 32K X 8 STANDARD SRAM, 85 ns, PDSO28, PLASTIC, REVERSE, TSOP-28, Static RAM |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | DIP | SOIC | TSOP | TSOP | DIP | SOIC | TSOP | DIP | TSOP |
| 包装说明 | DIP, DIP28,.6 | DIP, DIP28,.6 | SOP, SOP28,.5 | TSOP1, TSSOP28,.53,22 | TSOP1-R, TSSOP28,.53,22 | DIP, DIP28,.1 | SOP, SOP28,.5 | PLASTIC, TSOP-28 | DIP, DIP28,.1 | TSOP1-R, TSSOP28,.53,22 |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 100 ns | 85 ns | 85 ns | 85 ns | 100 ns | 100 ns | 100 ns | 100 ns | 85 ns | 85 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 37 mm | 37 mm | 18.5 mm | 11.8 mm | 11.8 mm | 34.9 mm | 18.5 mm | 11.8 mm | 34.9 mm | 11.8 mm |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bi |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| 组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | SOP | TSOP1 | TSOP1-R | DIP | SOP | TSOP1 | DIP | TSOP1-R |
| 封装等效代码 | DIP28,.6 | DIP28,.6 | SOP28,.5 | TSSOP28,.53,22 | TSSOP28,.53,22 | DIP28,.1 | SOP28,.5 | TSSOP28,.53,22 | DIP28,.1 | TSSOP28,.53,22 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | IN-LINE | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.3 mm | 5.3 mm | 2.7 mm | 1.2 mm | 1.2 mm | 4.45 mm | 2.7 mm | 1.2 mm | 4.45 mm | 1.2 mm |
| 最大待机电流 | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A |
| 最小待机电流 | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| 最大压摆率 | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES | YES | NO | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 0.55 mm | 0.55 mm | 2.54 mm | 1.27 mm | 0.55 mm | 2.54 mm | 0.55 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 15.24 mm | 15.24 mm | 8.8 mm | 8 mm | 8 mm | 7.62 mm | 8.8 mm | 8 mm | 7.62 mm | 8 mm |
| 厂商名称 | - | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | - | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) |
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