CEMENT FIXED RESISTORS
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•
•
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Self extinguishing
Excellent flame and moisture resistance
Extremely small sturdy and mechanically safe
Non-inductive types available for all Royal Ohm Cement Resistors
Too low or too high ohmic values on Wire-wound & Power Film type can be supplied on a case to case basis
Ordering Procedure: (Ex.: PRW 5W, 5%, 100Ω, B/B)
P
R
W
0
5
W
J
P
1
0
1
B
0
0
Resistor Type:
PRW0 = PRW; PRWA = PRWA;
PRWC = PRWC; PRM0 = PRM;
PRMA = PRMA; PRMB = PRMB;
PRS0 = PRS;
PRVA = PRVA;
PRVB = PRVB; PZ1A = PRZA-1;
PZ2A = PRZA-2; PZ3A = PRZA-3;
PRZC = PRZC; PRZD = PRZD;
PRU0 = PRU;
PRT0 = PRT;
PDM0 = PDM; PRWI = PRWI
Wattage:
2W = 2W
3W = 3W
4W = 4W
5W = 5W
7W = 7W
AW = 10W
BW = 11W
HW = 17W
FW = 15W
20 = 20W
25 = 25W
30 = 30W
40 = 40W
Resistance Value:
E-24 series:
1
st
digit denotes type of the
product:
W = Wire - wound type
P = Power film type
2
nd
& 3
rd
digits are the significant
figures of the resistance
4
th
digit denotes number of zeros:
“J”- 0.1, “K”- 0.01, “L”- 0.001
Ex.
4Ω7 ~ W47J
Tolerance:
J = ±5%,
K = ±10%
Packing Type:
B =Bulk / Box
Packing Qty:
* More explanation on part no, please see details on pages 80-81.
0 = for Bulk / Box packing
Special Feature:
0 = Standard product
I = Non-Inductive
Temperature coefficient
Short-time overload
Dielectric withstanding voltage
Terminal strength
Solderability
Temperature cycling
Humidity (Steady State)
Load life in humidity
< 20Ω: ±400PPM/°C;
≥
20Ω: ±350PPM/°C
∆R/R ≤
±(5.0% + 0.05Ω), with no evidence of mechanical damage.
No evidence of flashover, mechanical damage, arcing or insulation breakdown.
No evidence of mechanical damage.
Min. 95% coverage
∆R/R ≤
±(2.0% + 0.05Ω), with no evidence of mechanical damage.
∆R/R ≤
±(5.0% + 0.05Ω), with no evidence of mechanical damage.
For Wire-wound range, the
∆R/R
is ±5%
For Power film range, <100KΩ, the
∆R/R
is ±5%
For Power film range,
≥100KΩ,
the
∆R/R
is ±10%
Load life
For Wire-wound range, the
∆R/R
is ±5%
For Power film range, <100KΩ, the
∆R/R
is ±5%
For Power film range,
≥100KΩ,
the
∆R/R
is ±10%
Resistance to soldering heat
∆R/R
±(1.0% + 0.05Ω), with no evidence of mechanical damage.
*More details, please see pages 78-79.
Page 36
2007 - 2008
嵌入式系统
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