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GS8322Z72C-225MT: 产品描述ZBT SRAM, 512KX72, 4.4ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, FPBGA-209; 产品类别存储存储; 文件大小632KB，共37页; 制造商GSI Technology; 官网地址http://www.gsitechnology.com/

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GS8322Z72C-225MT概述

ZBT SRAM, 512KX72, 4.4ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, FPBGA-209

GS8322Z72C-225MT规格参数

参数名称	属性值
是否Rohs认证	不符合
零件包装代码	BGA
包装说明	LBGA, BGA209,11X19,40
针数	209
Reach Compliance Code	compliant
ECCN代码	3A991.B.2.B
最长访问时间	4.4 ns
其他特性	FLOW-THROUGH OR PIPELINED ARCHITECTURE, LATE WRITE, IT ALSO OPERATES AT 3V SUPPLY
最大时钟频率 (fCLK)	225 MHz
I/O 类型	COMMON
JESD-30 代码	R-PBGA-B209
长度	22 mm
内存密度	37748736 bit
内存集成电路类型	ZBT SRAM
内存宽度	72
功能数量	1
端子数量	209
字数	524288 words
字数代码	512000
工作模式	SYNCHRONOUS
最高工作温度	125 °C
最低工作温度	-55 °C
组织	512KX72
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	LBGA
封装等效代码	BGA209,11X19,40
封装形状	RECTANGULAR
封装形式	GRID ARRAY, LOW PROFILE
并行/串行	PARALLEL
电源	2.5/3.3 V
认证状态	Not Qualified
座面最大高度	1.7 mm
最大待机电流	0.2 A
最小待机电流	2.3 V
最大压摆率	0.39 mA
最大供电电压 (Vsup)	2.7 V
最小供电电压 (Vsup)	2.3 V
标称供电电压 (Vsup)	2.5 V
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM
宽度	14 mm
Base Number Matches	1

GS8322Z72C-225MT相似产品对比

	GS8322Z72C-225MT	GS8322Z72C-225M	GS8322Z36E-225M	GS8322Z36E-225MT	GS8322Z18E-225M	GS8322Z18E-225MT	GS8322Z18B-225M	GS8322Z18B-225MT	GS8322Z36B-225M	GS8322Z36B-225MT
描述	ZBT SRAM, 512KX72, 4.4ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, FPBGA-209	ZBT SRAM, 512KX72, 4.4ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, FPBGA-209	ZBT SRAM, 1MX36, 2.7ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165	ZBT SRAM, 1MX36, 2.7ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165	ZBT SRAM, 2MX18, 2.7ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165	ZBT SRAM, 2MX18, 2.7ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165	ZBT SRAM, 2MX18, 2.7ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, FPBGA-119	ZBT SRAM, 2MX18, 2.7ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, FPBGA-119	ZBT SRAM, 1MX36, 2.7ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, FPBGA-119	ZBT SRAM, 1MX36, 2.7ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, FPBGA-119
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	LBGA, BGA209,11X19,40	LBGA, BGA209,11X19,40	15 X 17 MM, 1 MM PITCH, FPBGA-165	15 X 17 MM, 1 MM PITCH, FPBGA-165	15 X 17 MM, 1 MM PITCH, FPBGA-165	15 X 17 MM, 1 MM PITCH, FPBGA-165	BGA, BGA119,7X17,50	14 X 22 MM, 1.27 MM PITCH, FPBGA-119	14 X 22 MM, 1.27 MM PITCH, FPBGA-119	14 X 22 MM, 1.27 MM PITCH, FPBGA-119
针数	209	209	165	165	165	165	119	119	119	119
Reach Compliance Code	compliant	compliant	unknown	unknown	compliant	unknown	compliant	unknown	compliant	unknown
ECCN代码	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B
最长访问时间	4.4 ns	4.4 ns	2.7 ns	2.7 ns	2.7 ns	2.7 ns	2.7 ns	2.7 ns	2.7 ns	2.7 ns
其他特性	FLOW-THROUGH OR PIPELINED ARCHITECTURE, LATE WRITE, IT ALSO OPERATES AT 3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, LATE WRITE, IT ALSO OPERATES AT 3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, LATE WRITE, IT ALSO OPERATES AT 3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, LATE WRITE, IT ALSO OPERATES AT 3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, LATE WRITE, IT ALSO OPERATES AT 3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, LATE WRITE, IT ALSO OPERATES AT 3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, LATE WRITE, IT ALSO OPERATES AT 3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, LATE WRITE, IT ALSO OPERATES AT 3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, LATE WRITE, IT ALSO OPERATES AT 3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, LATE WRITE, IT ALSO OPERATES AT 3V SUPPLY
最大时钟频率 (fCLK)	225 MHz	225 MHz	225 MHz	225 MHz	225 MHz	225 MHz	225 MHz	225 MHz	225 MHz	225 MHz
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-PBGA-B209	R-PBGA-B209	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119
长度	22 mm	22 mm	17 mm	17 mm	17 mm	17 mm	22 mm	22 mm	22 mm	22 mm
内存密度	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit
内存集成电路类型	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM
内存宽度	72	72	36	36	18	18	18	18	36	36
功能数量	1	1	1	1	1	1	1	1	1	1
端子数量	209	209	165	165	165	165	119	119	119	119
字数	524288 words	524288 words	1048576 words	1048576 words	2097152 words	2097152 words	2097152 words	2097152 words	1048576 words	1048576 words
字数代码	512000	512000	1000000	1000000	2000000	2000000	2000000	2000000	1000000	1000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
组织	512KX72	512KX72	1MX36	1MX36	2MX18	2MX18	2MX18	2MX18	1MX36	1MX36
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA	BGA	BGA	BGA	BGA
封装等效代码	BGA209,11X19,40	BGA209,11X19,40	BGA165,11X15,40	BGA165,11X15,40	BGA165,11X15,40	BGA165,11X15,40	BGA119,7X17,50	BGA119,7X17,50	BGA119,7X17,50	BGA119,7X17,50
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
电源	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V	2.5/3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.7 mm	1.7 mm	1.5 mm	1.5 mm	1.5 mm	1.5 mm	1.99 mm	1.99 mm	1.99 mm	1.99 mm
最大待机电流	0.2 A	0.2 A	0.2 A	0.2 A	0.2 A	0.2 A	0.2 A	0.2 A	0.2 A	0.2 A
最小待机电流	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V
最大压摆率	0.39 mA	0.39 mA	0.36 mA	0.36 mA	0.28 mA	0.28 mA	0.28 mA	0.28 mA	0.36 mA	0.36 mA
最大供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
最小供电电压 (Vsup)	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V
标称供电电压 (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
宽度	14 mm	14 mm	15 mm	15 mm	15 mm	15 mm	14 mm	14 mm	14 mm	14 mm
厂商名称	-	-	GSI Technology	GSI Technology	GSI Technology	GSI Technology	GSI Technology	GSI Technology	GSI Technology	GSI Technology

GS8322Z72C-225MT

GS8322Z72C-225MT概述

GS8322Z72C-225MT规格参数

GS8322Z72C-225MT相似产品对比

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