WINBOND I/O
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Winbond(华邦电子) |
| 零件包装代码 | QFP |
| 包装说明 | PLASTIC, QFP-128 |
| 针数 | 128 |
| Reach Compliance Code | _compli |
| 地址总线宽度 | 16 |
| 边界扫描 | NO |
| 总线兼容性 | IBM XT; AT; ISA; PS/2 |
| 最大时钟频率 | 48 MHz |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | R-PQFP-G128 |
| JESD-609代码 | e0 |
| 长度 | 20 mm |
| I/O 线路数量 | 22 |
| 端子数量 | 128 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FQFP |
| 封装等效代码 | QFP128,.63X.87,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK, FINE PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.32 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 14 mm |
| W83977TF-A | W83977TF | W83977TF-P | W83977TF_98 | W83977TF-PW | W83977TF-AW | |
|---|---|---|---|---|---|---|
| 描述 | WINBOND I/O | WINBOND I/O | WINBOND I/O | WINBOND I/O | WINBOND I/O | WINBOND I/O |
| 厂商名称 | Winbond(华邦电子) | - | Winbond(华邦电子) | - | Winbond(华邦电子) | Winbond(华邦电子) |
| 零件包装代码 | QFP | - | QFP | - | QFP | QFP |
| 包装说明 | PLASTIC, QFP-128 | - | PLASTIC, QFP-128 | - | FQFP, QFP128,.63X.87,20 | FQFP, QFP128,.63X.87,20 |
| 针数 | 128 | - | 128 | - | 128 | 128 |
| Reach Compliance Code | _compli | - | _compli | - | unknow | unknow |
| 地址总线宽度 | 16 | - | 16 | - | 16 | 16 |
| 边界扫描 | NO | - | NO | - | NO | NO |
| 总线兼容性 | IBM XT; AT; ISA; PS/2 | - | IBM XT; AT; ISA; PS/2 | - | IBM XT; AT; ISA; PS/2 | IBM XT; AT; ISA; PS/2 |
| 最大时钟频率 | 48 MHz | - | 48 MHz | - | 48 MHz | 48 MHz |
| 外部数据总线宽度 | 8 | - | 8 | - | 8 | 8 |
| JESD-30 代码 | R-PQFP-G128 | - | R-PQFP-G128 | - | R-PQFP-G128 | R-PQFP-G128 |
| 长度 | 20 mm | - | 20 mm | - | 20 mm | 20 mm |
| I/O 线路数量 | 22 | - | 22 | - | 22 | 22 |
| 端子数量 | 128 | - | 128 | - | 128 | 128 |
| 最高工作温度 | 70 °C | - | 70 °C | - | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FQFP | - | FQFP | - | FQFP | FQFP |
| 封装等效代码 | QFP128,.63X.87,20 | - | QFP128,.63X.87,20 | - | QFP128,.63X.87,20 | QFP128,.63X.87,20 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK, FINE PITCH | - | FLATPACK, FINE PITCH | - | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH |
| 电源 | 5 V | - | 5 V | - | 5 V | 5 V |
| 认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 3.32 mm | - | 3.32 mm | - | 3.32 mm | 3.32 mm |
| 最大供电电压 | 5.5 V | - | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | - | 4.5 V | - | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | - | 5 V | - | 5 V | 5 V |
| 表面贴装 | YES | - | YES | - | YES | YES |
| 技术 | CMOS | - | CMOS | - | CMOS | CMOS |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | - | GULL WING | - | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | - | 0.5 mm | - | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | - | QUAD | - | QUAD | QUAD |
| 宽度 | 14 mm | - | 14 mm | - | 14 mm | 14 mm |
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