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UPD29F032202ALF9-B85TY-BS2

产品描述IC,EEPROM,NOR FLASH,2MX16/4MX8,CMOS,BGA,63PIN,PLASTIC
产品类别存储    存储   
文件大小189KB,共32页
制造商Renesas(瑞萨电子)
官网地址https://www.renesas.com/
下载文档 详细参数 选型对比 全文预览

UPD29F032202ALF9-B85TY-BS2概述

IC,EEPROM,NOR FLASH,2MX16/4MX8,CMOS,BGA,63PIN,PLASTIC

UPD29F032202ALF9-B85TY-BS2规格参数

参数名称属性值
Reach Compliance Codecompliant
最长访问时间85 ns
备用内存宽度8
启动块TOP
命令用户界面YES
通用闪存接口YES
数据轮询YES
JESD-30 代码R-PBGA-B63
内存密度33554432 bit
内存集成电路类型FLASH
内存宽度16
部门数/规模8,63
端子数量63
字数2097152 words
字数代码2000000
最高工作温度85 °C
最低工作温度-40 °C
组织2MX16
封装主体材料PLASTIC/EPOXY
封装代码FBGA
封装等效代码BGA63,8X12,32
封装形状RECTANGULAR
封装形式GRID ARRAY, FINE PITCH
并行/串行PARALLEL
电源3 V
认证状态Not Qualified
就绪/忙碌YES
部门规模8K,64K
最大待机电流0.000005 A
最大压摆率0.045 mA
标称供电电压 (Vsup)3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM
切换位YES
类型NOR TYPE
Base Number Matches1

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DATA SHEET
µ
PD29F032202AL-Y
32M-BIT CMOS LOW-VOLTAGE DUAL OPERATION FLASH MEMORY
4M-WORD BY 8-BIT (BYTE MODE) / 2M-WORD BY 16-BIT (WORD MODE)
MOS INTEGRATED CIRCUIT
Description
The
µ
PD29F032202AL-Y is a flash memory organized of 33,554,432 bits and 71 sectors. Sectors of this memory
can be erased at a low voltage (2.7 to 3.3 V, 3.0 to 3.6 V) supplied from a single power source, or the contents of the
entire chip can be erased. Two modes of memory organization, BYTE mode (4,194,304 words
×
8 bits) and WORD
mode (2,097,152 words
×
16 bits), are selectable so that the memory can be programmed in byte or word units.
The
µ
PD29F032202AL-Y can be read while its contents are being erased or programmed. The memory cell is
divided into two banks. While sectors in one bank are being erased or programmed, data can be read from the other
bank thanks to the simultaneous execution architecture. The banks are 4M bits and 28M bits.
This flash memory comes in two types. The T type has a boot sector located at the highest address (sector) and the
B type has a boot sector at the lowest address (sector).
Because the
µ
PD29F032202AL-Y enables the boot sector to be erased, it is ideal for storing a boot program. In
addition, program code that controls the flash memory can be also stored, and the program code can be
programmed or erased without the need to load it into RAM. Eight small sectors for storing parameters are provided,
each of which can be erased in 8K bytes units.
Once a program or erase command sequence has been executed, an automatic program or automatic erase
function internally executes program or erase and verification automatically.
Because the
µ
PD29F032202AL-Y can be electrically erased or programmed by writing an instruction, data can be
reprogrammed on-board after the flash memory has been installed in a system, making it suitable for a wide range of
applications.
This flash memory is packed in a 48-pin PLASTIC TSOP (I) and 63-pin TAPE FBGA.
Features
Two bank organization enabling simultaneous execution of program / erase and read
Bank organization: 2 banks (4M bits + 28M bits)
Memory organization : 4,194,304 words
×
8 bits (BYTE mode)
2,097,152 words
×
16 bits (WORD mode)
Sector organization : 71 sectors (8K bytes / 4K words
×
8 sectors, 64K bytes / 32K words
×
63 sectors)
2 types of sector organization
T type : Boot sector allocated to the highest address (sector)
B type : Boot sector allocated to the lowest address (sector)
3-state output
Automatic program
Program suspend / resume
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. M15515EJ5V0DS00 (5th edition)
Date Published September 2002 NS CP (K)
Printed in Japan
The mark
5
shows major revised points.
©
2001

UPD29F032202ALF9-B85TY-BS2相似产品对比

UPD29F032202ALF9-B85TY-BS2 UPD29F032202ALF9-B85BY-BS2 UPD29F032202ALGZ-A85BY-MJH
描述 IC,EEPROM,NOR FLASH,2MX16/4MX8,CMOS,BGA,63PIN,PLASTIC IC,EEPROM,NOR FLASH,2MX16/4MX8,CMOS,BGA,63PIN,PLASTIC IC,EEPROM,NOR FLASH,2MX16/4MX8,CMOS,TSSOP,48PIN,PLASTIC
Reach Compliance Code compliant compliant compliant
最长访问时间 85 ns 85 ns 85 ns
备用内存宽度 8 8 8
启动块 TOP BOTTOM BOTTOM
命令用户界面 YES YES YES
通用闪存接口 YES YES YES
数据轮询 YES YES YES
JESD-30 代码 R-PBGA-B63 R-PBGA-B63 R-PDSO-G48
内存密度 33554432 bit 33554432 bit 33554432 bit
内存集成电路类型 FLASH FLASH FLASH
内存宽度 16 16 16
部门数/规模 8,63 8,63 8,63
端子数量 63 63 48
字数 2097152 words 2097152 words 2097152 words
字数代码 2000000 2000000 2000000
最高工作温度 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C
组织 2MX16 2MX16 2MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 FBGA FBGA TSSOP
封装等效代码 BGA63,8X12,32 BGA63,8X12,32 TSSOP48,.8,20
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行 PARALLEL PARALLEL PARALLEL
电源 3 V 3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified
就绪/忙碌 YES YES YES
部门规模 8K,64K 8K,64K 8K,64K
最大待机电流 0.000005 A 0.000005 A 0.000005 A
最大压摆率 0.045 mA 0.045 mA 0.045 mA
标称供电电压 (Vsup) 3 V 3 V 3.3 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 BALL BALL GULL WING
端子节距 0.8 mm 0.8 mm 0.5 mm
端子位置 BOTTOM BOTTOM DUAL
切换位 YES YES YES
类型 NOR TYPE NOR TYPE NOR TYPE
厂商名称 - Renesas(瑞萨电子) Renesas(瑞萨电子)

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