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HY5V52LFP-H: 产品描述Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90, 11 X 13 MM, 0.80 MM PITCH, LEAD FREE, FBGA-90; 产品类别存储存储; 文件大小331KB，共13页; 制造商SK Hynix(海力士); 官网地址http://www.hynix.com/eng/; 标准

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HY5V52LFP-H概述

Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90, 11 X 13 MM, 0.80 MM PITCH, LEAD FREE, FBGA-90

HY5V52LFP-H规格参数

参数名称	属性值
是否Rohs认证	符合
零件包装代码	BGA
包装说明	TFBGA, BGA90,9X15,32
针数	90
Reach Compliance Code	compliant
ECCN代码	EAR99
访问模式	FOUR BANK PAGE BURST
最长访问时间	5.4 ns
其他特性	AUTO/SELF REFRESH
最大时钟频率 (fCLK)	133 MHz
I/O 类型	COMMON
交错的突发长度	1,2,4,8
JESD-30 代码	R-PBGA-B90
JESD-609代码	e1
长度	13 mm
内存密度	268435456 bit
内存集成电路类型	SYNCHRONOUS DRAM
内存宽度	32
功能数量	1
端口数量	1
端子数量	90
字数	8388608 words
字数代码	8000000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	8MX32
封装主体材料	PLASTIC/EPOXY
封装代码	TFBGA
封装等效代码	BGA90,9X15,32
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）	260
电源	3.3 V
认证状态	Not Qualified
刷新周期	4096
座面最大高度	1.2 mm
自我刷新	YES
连续突发长度	1,2,4,8,FP
最大待机电流	0.002 A
最大压摆率	0.4 mA
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	3 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式	BALL
端子节距	0.8 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	20
宽度	11 mm
Base Number Matches	1

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Preliminary

HY5V52(L)F(P) Series

4Banks x 2M x 32bits Synchronous DRAM

Document Title

4Bank x 2M x 32bits Synchronous DRAM

Revision History

Revision No.

0.1

History

Initial Draft

Draft Date

Jun. 2004

Remark

Preliminary

This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for

use of circuits described. No patent licenses are implied.

Rev. 0.1 / June. 2004

HY5V52LFP-H相似产品对比

	HY5V52LFP-H	HY5V52FP-P	HY5V52FP-S	HY5V52LF-H	HY5V52LF-P	HY5V52LFP-P	HY5V52LFP-S	HY5V52LF-S
描述	Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90, 11 X 13 MM, 0.80 MM PITCH, LEAD FREE, FBGA-90	Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, 11 X 13 MM, 0.80 MM PITCH, LEAD FREE, FBGA-90	Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, 11 X 13 MM, 0.80 MM PITCH, LEAD FREE, FBGA-90	Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90, 11 X 13 MM, 0.80 MM PITCH, FBGA-90	Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, 11 X 13 MM, 0.80 MM PITCH, FBGA-90	Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, 11 X 13 MM, 0.80 MM PITCH, LEAD FREE, FBGA-90	Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, 11 X 13 MM, 0.80 MM PITCH, LEAD FREE, FBGA-90	Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, 11 X 13 MM, 0.80 MM PITCH, FBGA-90
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	TFBGA, BGA90,9X15,32	TFBGA, BGA90,9X15,32	TFBGA, BGA90,9X15,32	TFBGA, BGA90,9X15,32	TFBGA, BGA90,9X15,32	TFBGA, BGA90,9X15,32	TFBGA, BGA90,9X15,32	TFBGA, BGA90,9X15,32
针数	90	90	90	90	90	90	90	90
Reach Compliance Code	compliant	unknown	unknown	compliant	compliant	compliant	compliant	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
访问模式	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
最长访问时间	5.4 ns	6 ns	6 ns	5.4 ns	6 ns	6 ns	6 ns	6 ns
其他特性	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
最大时钟频率 (fCLK)	133 MHz	100 MHz	100 MHz	133 MHz	100 MHz	100 MHz	100 MHz	100 MHz
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
交错的突发长度	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8	1,2,4,8
JESD-30 代码	R-PBGA-B90	R-PBGA-B90	R-PBGA-B90	R-PBGA-B90	R-PBGA-B90	R-PBGA-B90	R-PBGA-B90	R-PBGA-B90
长度	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm
内存密度	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bit	268435456 bit
内存集成电路类型	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM
内存宽度	32	32	32	32	32	32	32	32
功能数量	1	1	1	1	1	1	1	1
端口数量	1	1	1	1	1	1	1	1
端子数量	90	90	90	90	90	90	90	90
字数	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words
字数代码	8000000	8000000	8000000	8000000	8000000	8000000	8000000	8000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	8MX32	8MX32	8MX32	8MX32	8MX32	8MX32	8MX32	8MX32
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
封装等效代码	BGA90,9X15,32	BGA90,9X15,32	BGA90,9X15,32	BGA90,9X15,32	BGA90,9X15,32	BGA90,9X15,32	BGA90,9X15,32	BGA90,9X15,32
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
电源	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
刷新周期	4096	4096	4096	4096	4096	4096	4096	4096
座面最大高度	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
自我刷新	YES	YES	YES	YES	YES	YES	YES	YES
连续突发长度	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP
最大待机电流	0.002 A	0.002 A	0.002 A	0.002 A	0.002 A	0.002 A	0.002 A	0.002 A
最大压摆率	0.4 mA	0.4 mA	0.4 mA	0.44 mA	0.4 mA	0.4 mA	0.4 mA	0.4 mA
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
宽度	11 mm	11 mm	11 mm	11 mm	11 mm	11 mm	11 mm	11 mm
Base Number Matches	1	1	1	1	1	1	1	1
是否Rohs认证	符合	符合	符合	不符合	符合	符合	符合	-
JESD-609代码	e1	e1	e1	-	e1	e1	e1	e1
峰值回流温度（摄氏度）	260	260	260	NOT SPECIFIED	260	260	260	-
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	-	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	TIN SILVER COPPER
处于峰值回流温度下的最长时间	20	20	20	NOT SPECIFIED	20	20	20	-

HY5V52LFP-H

HY5V52LFP-H概述

HY5V52LFP-H规格参数

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