RISC Microprocessor, 533MHz, CMOS, PBGA544, PLASTIC, BGA-544
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | BGA |
包装说明 | HBGA, |
针数 | 544 |
Reach Compliance Code | compliant |
ECCN代码 | 3A001.A.3 |
其他特性 | ALSO REQUIRES 3.3V SUPPLY |
地址总线宽度 | 32 |
边界扫描 | YES |
最大时钟频率 | 66 MHz |
外部数据总线宽度 | 32 |
格式 | FIXED POINT |
集成缓存 | YES |
JESD-30 代码 | S-PBGA-B544 |
长度 | 35 mm |
低功率模式 | NO |
湿度敏感等级 | 1 |
端子数量 | 544 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HBGA |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, HEAT SINK/SLUG |
峰值回流温度(摄氏度) | 225 |
认证状态 | Not Qualified |
座面最大高度 | 2.51 mm |
速度 | 533 MHz |
最大供电电压 | 1.365 V |
最小供电电压 | 1.235 V |
标称供电电压 | 1.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | BALL |
端子节距 | 1.27 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 35 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC |
Base Number Matches | 1 |
GWIXP465AADT | GWIXP465AAD | GWIXP460AAD | GWIXP460AADT | EWIXP455AAC | EWIXP460AACT | AF124-JR-1397R6L | GWIXP455AAD | GWIXP455AACT | |
---|---|---|---|---|---|---|---|---|---|
描述 | RISC Microprocessor, 533MHz, CMOS, PBGA544, PLASTIC, BGA-544 | RISC Microprocessor, 533MHz, CMOS, PBGA544, PLASTIC, BGA-544 | RISC Microprocessor, 533MHz, CMOS, PBGA544, PLASTIC, BGA-544 | RISC Microprocessor, 533MHz, CMOS, PBGA544, PLASTIC, BGA-544 | RISC Microprocessor, 400MHz, CMOS, PBGA544, ROHS COMPLIANT, PLASTIC, BGA-544 | RISC Microprocessor, 400MHz, CMOS, PBGA544, ROHS COMPLIANT, PLASTIC, BGA-544 | ANTI-SULFURATED CHIP RESISTORS | RISC Microprocessor, 533MHz, CMOS, PBGA544, PLASTIC, BGA-544 | RISC Microprocessor, 400MHz, CMOS, PBGA544, PLASTIC, BGA-544 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 | 符合 | - | 不符合 | 不符合 |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | - | BGA | BGA |
包装说明 | HBGA, | HBGA, | HBGA, | HBGA, | BGA, | HBGA, | - | HBGA, | HBGA, |
针数 | 544 | 544 | 544 | 544 | 544 | 544 | - | 544 | 544 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | - | compliant | compliant |
ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | - | 3A001.A.3 | 3A001.A.3 |
其他特性 | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY | - | ALSO REQUIRES 3.3V SUPPLY | ALSO REQUIRES 3.3V SUPPLY |
地址总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | - | 32 | 32 |
边界扫描 | YES | YES | YES | YES | YES | YES | - | YES | YES |
最大时钟频率 | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | - | 66 MHz | 66 MHz |
外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | - | 32 | 32 |
格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | - | FIXED POINT | FIXED POINT |
集成缓存 | YES | YES | YES | YES | YES | YES | - | YES | YES |
JESD-30 代码 | S-PBGA-B544 | S-PBGA-B544 | S-PBGA-B544 | S-PBGA-B544 | S-PBGA-B544 | S-PBGA-B544 | - | S-PBGA-B544 | S-PBGA-B544 |
长度 | 35 mm | 35 mm | 35 mm | 35 mm | 35 mm | 35 mm | - | 35 mm | 35 mm |
低功率模式 | NO | NO | NO | NO | NO | NO | - | NO | NO |
湿度敏感等级 | 1 | 1 | 1 | 1 | - | - | - | 1 | - |
端子数量 | 544 | 544 | 544 | 544 | 544 | 544 | - | 544 | 544 |
最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | - | 70 °C | 85 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HBGA | HBGA | HBGA | HBGA | BGA | HBGA | - | HBGA | HBGA |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | - | SQUARE | SQUARE |
封装形式 | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG | - | GRID ARRAY, HEAT SINK/SLUG | GRID ARRAY, HEAT SINK/SLUG |
峰值回流温度(摄氏度) | 225 | 225 | 225 | 225 | 260 | 260 | - | 225 | 225 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
座面最大高度 | 2.51 mm | 2.51 mm | 2.51 mm | 2.51 mm | 2.51 mm | 2.51 mm | - | 2.51 mm | 2.51 mm |
速度 | 533 MHz | 533 MHz | 533 MHz | 533 MHz | 400 MHz | 400 MHz | - | 533 MHz | 400 MHz |
最大供电电压 | 1.365 V | 1.365 V | 1.365 V | 1.365 V | 1.365 V | 1.365 V | - | 1.365 V | 1.365 V |
最小供电电压 | 1.235 V | 1.235 V | 1.235 V | 1.235 V | 1.235 V | 1.235 V | - | 1.235 V | 1.235 V |
标称供电电压 | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V | - | 1.3 V | 1.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | - | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | - | COMMERCIAL | INDUSTRIAL |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | - | BALL | BALL |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm | 1.27 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 40 | 40 | - | NOT SPECIFIED | 30 |
宽度 | 35 mm | 35 mm | 35 mm | 35 mm | 35 mm | 35 mm | - | 35 mm | 35 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | - | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
厂商名称 | - | - | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | - | Intel(英特尔) | Intel(英特尔) |
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