To all our customers
Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Cautions
Keep safety first in your circuit designs!
1.
Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but
there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire
or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i)
placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or
mishap.
Notes regarding these materials
1.
These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation
product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any
other rights, belonging to Renesas Technology Corporation or a third party.
2.
Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights,
originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in
these materials.
3.
All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents
information on products at the time of publication of these materials, and are subject to change by Renesas Technology
Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these
inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various means, including the
Renesas Technology Corporation Semiconductor home page (http://www.renesas.com).
4.
When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and
algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of
the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other
loss resulting from the information contained herein.
5.
Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used
under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an
authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for
any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea
repeater use.
6.
The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these
materials.
7.
If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license
from the Japanese government and cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is
prohibited.
8.
Please contact Renesas Technology Corporation for further details on these materials or the products contained therein.
Hitachi Single-Chip Microcomputer
H8/3887 Series
H8/3887
HD6473887, HD6433887
H8/3886
HD6433886
H8/3885
HD6433885
H8/3884
HD6433884
H8/3883
HD6433883
H3/3882
HD6433882
H8/3847 Series
H8/3847
HD6473847, HD6433847
H8/3846
HD6433846
H8/3845
HD6433845
H8/3844
HD6433844
H8/3843
HD6433843
H8/3842
HD6433842
Hardware Manual
ADE-602-151A
Rev. 2.0
4/8/99
Hitachi, Ltd.
The revision list can be viewed directly by
clicking the title page.
The revision list summarizes the locations of
revisions and additions. Details should always
be checked by referring to the relevant text.
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s
patent, copyright, trademark, or other intellectual property rights for information contained in
this document. Hitachi bears no responsibility for problems that may arise with third party’s
rights, including intellectual property rights, in connection with use of the information
contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you
have received the latest product standards or specifications before final design, purchase or
use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.
However, contact Hitachi’s sales office before using the product in an application that
demands especially high quality and reliability or where its failure or malfunction may directly
threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear
power, combustion control, transportation, traffic, safety equipment or medical equipment for
life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi
particularly for maximum rating, operating supply voltage range, heat radiation characteristics,
installation conditions and other characteristics. Hitachi bears no responsibility for failure or
damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,
consider normally foreseeable failure rates or failure modes in semiconductor devices and
employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi
product does not cause bodily injury, fire or other consequential damage due to operation of
the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document
without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi
semiconductor products.
List of Items Revised or Added for This Version
Page
Item
Description
Addition of H8/3847 Series
Change in specification of operation speed
Modification
Addition
Addition
Addition
Addition of description and modification of
figure 1-1
Modification
General modification
2
2
3
4
5 and 6
7
8 and 9
10
14
15
49 to 54
56
Table 1-1 Features / CPU
Table 1-1 Features / Clock pulse
generators
Table 1-1 Features / Memory supply
Table 1-1 Features / LCD drive power
supply
Table 1-1 Features / Product lineup
1.2 Internal Block Diagram
Figure 1-2 and figure 1-3
Table 1-2 Pin Functions / Power source Modification
pins
Table 1-2 Pin Functions / LCD
controller/driver
2.1.1 Features
Figure 2-16 (1) to figure 2-16 (6) /
Memory Map
Figure 2-17 Data Size and Number of
States for Access to and from On-Chip
Peripheral Modules
Addition
Change in high-speed operation
Modification
Modification
89
Figure 4-2 Typical Connection to Crystal Modification
Oscillator
Table 4-1 Crystal Oscillator Parameters Modification
90
93
96
97
98
100
101
Figure 4-4 Typical Connection to
Ceramic Oscillator
Figure 4-9 Pin Connection when not
Using Subclock
Table 5-1 Operating Modes
Figure 5-1 Mode Transition Diagram
Table 5-2 Internal State in Each
Operating Mode
Bits 6 to 4
Bit 4
Modification
Modification
Addition of subsleep mode/watch mode
descriptions
Modification of mode transition condition (2)
Modification
Addition of Note
Modification of description
模拟与混合信号
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