EE PLD, 20ns, CMOS, PDIP24, PLASTIC, DIP-24
| 参数名称 | 属性值 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最大时钟频率 | 33.3 MHz |
| JESD-30 代码 | R-PDIP-T24 |
| 长度 | 31.75 mm |
| 专用输入次数 | 10 |
| I/O 线路数量 | 10 |
| 端子数量 | 24 |
| 最高工作温度 | 75 °C |
| 最低工作温度 | |
| 组织 | 10 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 可编程逻辑类型 | EE PLD |
| 传播延迟 | 20 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 | 5.25 V |
| 最小供电电压 | 4.75 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| GAL20RA10-20LPB | GAL20RA10-15LPB | GAL20RA10-20LPIB | GAL20RA10-15LJB | GAL20RA10-20LJB | GAL20RA10-20LJIB | |
|---|---|---|---|---|---|---|
| 描述 | EE PLD, 20ns, CMOS, PDIP24, PLASTIC, DIP-24 | EE PLD, 15ns, CMOS, PDIP24, PLASTIC, DIP-24 | EE PLD, 20ns, CMOS, PDIP24, PLASTIC, DIP-24 | EE PLD, 15ns, CMOS, PQCC28, PLASTIC, LCC-28 | EE PLD, 20ns, CMOS, PQCC28, PLASTIC, LCC-28 | EE PLD, 20ns, CMOS, PQCC28, PLASTIC, LCC-28 |
| 零件包装代码 | DIP | DIP | DIP | QLCC | QLCC | QLCC |
| 包装说明 | DIP, | DIP, | DIP, | QCCJ, | QCCJ, | QCCJ, |
| 针数 | 24 | 24 | 24 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 | 33.3 MHz | 45 MHz | 33.3 MHz | 45 MHz | 33.3 MHz | 33.3 MHz |
| JESD-30 代码 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | S-PQCC-J28 | S-PQCC-J28 | S-PQCC-J28 |
| 长度 | 31.75 mm | 31.75 mm | 31.75 mm | 11.5316 mm | 11.5316 mm | 11.5316 mm |
| 专用输入次数 | 10 | 10 | 10 | 10 | 10 | 10 |
| I/O 线路数量 | 10 | 10 | 10 | 10 | 10 | 10 |
| 端子数量 | 24 | 24 | 24 | 28 | 28 | 28 |
| 最高工作温度 | 75 °C | 75 °C | 85 °C | 75 °C | 75 °C | 85 °C |
| 组织 | 10 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | QCCJ | QCCJ | QCCJ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 20 ns | 15 ns | 20 ns | 15 ns | 20 ns | 20 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 4.57 mm | 4.57 mm | 4.57 mm |
| 最大供电电压 | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V |
| 最小供电电压 | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | INDUSTRIAL | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | J BEND |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 11.5316 mm | 11.5316 mm | 11.5316 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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