ACT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20
| 参数名称 | 属性值 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 系列 | ACT |
| JESD-30 代码 | R-GDIP-T20 |
| 长度 | 24.195 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 4 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟（tpd） | 10 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| SN54ACT244J | SN74ACT244PWLE | SN74ACT244DBLE | SN54ACT244FK | SN54ACT244W | |
|---|---|---|---|---|---|
| 描述 | ACT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20 | Octal Buffers/Drivers With 3-State Outputs 20-TSSOP -40 to 85 | Octal Buffers/Drivers With 3-State Outputs 20-SSOP -40 to 85 | ACT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, CC-20 | ACT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, DFP-20 |
| 零件包装代码 | DIP | TSSOP | SSOP | QFN | DFP |
| 包装说明 | DIP, | TSSOP, TSSOP20,.25 | SSOP, SSOP20,.3 | CERAMIC, CC-20 | CERAMIC, DFP-20 |
| 针数 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | not_compliant | not_compliant | unknown | unknown |
| 系列 | ACT | ACT | ACT | ACT | ACT |
| JESD-30 代码 | R-GDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | S-CQCC-N20 | R-GDFP-F20 |
| 长度 | 24.195 mm | 6.5 mm | 7.2 mm | 8.89 mm | 13.09 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | TSSOP | SSOP | QCCN | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER | FLATPACK |
| 传播延迟（tpd） | 10 ns | 10 ns | 10 ns | 10 ns | 10 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 1.2 mm | 2 mm | 2.03 mm | 2.54 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | NO LEAD | FLAT |
| 端子节距 | 2.54 mm | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | DUAL |
| 宽度 | 7.62 mm | 4.4 mm | 5.3 mm | 8.89 mm | 6.92 mm |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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