128 Mbit (8 Mb 】16, Multiple Bank, Multilevel interface, Burst) 1.8 V supply Flash memories
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | BGA |
| 包装说明 | 7.70 X 9 MM, 0.75 MM PITCH, ROHS COMPLIANT, VFBGA-56 |
| 针数 | 56 |
| Reach Compliance Code | compli |
| ECCN代码 | 3A991.B.1.A |
| 最长访问时间 | 85 ns |
| 其他特性 | SYNCHRONOUS BURST MODE OPERATION POSSIBLE |
| 启动块 | BOTTOM |
| 命令用户界面 | YES |
| 通用闪存接口 | YES |
| 数据轮询 | NO |
| JESD-30 代码 | R-PBGA-B56 |
| 长度 | 9 mm |
| 内存密度 | 134217728 bi |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 部门数/规模 | 4,127 |
| 端子数量 | 56 |
| 字数 | 8388608 words |
| 字数代码 | 8000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -25 °C |
| 组织 | 8MX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA56,7X8,30 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 页面大小 | 4 words |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 1.8 V |
| 编程电压 | 1.8 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 部门规模 | 16K,64K |
| 最大待机电流 | 0.00005 A |
| 最大压摆率 | 0.055 mA |
| 最大供电电压 (Vsup) | 2 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子形式 | BALL |
| 端子节距 | 0.75 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 切换位 | NO |
| 类型 | NOR TYPE |
| 宽度 | 7.7 mm |
| M58LR128HB85ZB5E | M58LR128HT85ZB5E | M58LR128HB85ZB5F | M58LR128HB | M58LR128HT85ZB5F | M58LR128HT | |
|---|---|---|---|---|---|---|
| 描述 | 128 Mbit (8 Mb 】16, Multiple Bank, Multilevel interface, Burst) 1.8 V supply Flash memories | 128 Mbit (8 Mb 】16, Multiple Bank, Multilevel interface, Burst) 1.8 V supply Flash memories | 128 Mbit (8 Mb 】16, Multiple Bank, Multilevel interface, Burst) 1.8 V supply Flash memories | 128 Mbit (8 Mb 】16, Multiple Bank, Multilevel interface, Burst) 1.8 V supply Flash memories | 128 Mbit (8 Mb 】16, Multiple Bank, Multilevel interface, Burst) 1.8 V supply Flash memories | 128 Mbit (8 Mb 】16, Multiple Bank, Multilevel interface, Burst) 1.8 V supply Flash memories |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - | 符合 | - |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | - | ST(意法半导体) | - |
| 零件包装代码 | BGA | BGA | BGA | - | BGA | - |
| 包装说明 | 7.70 X 9 MM, 0.75 MM PITCH, ROHS COMPLIANT, VFBGA-56 | 7.70 X 9 MM, 0.75 MM PITCH, ROHS COMPLIANT, VFBGA-56 | 7.70 X 9 MM, 0.75 MM PITCH, ROHS COMPLIANT, VFBGA-56 | - | 7.70 X 9 MM, 0.75 MM PITCH, ROHS COMPLIANT, VFBGA-56 | - |
| 针数 | 56 | 56 | 56 | - | 56 | - |
| Reach Compliance Code | compli | compli | compli | - | compli | - |
| ECCN代码 | 3A991.B.1.A | 3A991.B.1.A | EAR99 | - | 3A991.B.1.A | - |
| 最长访问时间 | 85 ns | 85 ns | 85 ns | - | 85 ns | - |
| 其他特性 | SYNCHRONOUS BURST MODE OPERATION POSSIBLE | SYNCHRONOUS BURST MODE OPERATION POSSIBLE | SYNCHRONOUS BURST MODE OPERATION POSSIBLE | - | SYNCHRONOUS BURST MODE OPERATION POSSIBLE | - |
| 启动块 | BOTTOM | TOP | BOTTOM | - | TOP | - |
| 命令用户界面 | YES | YES | YES | - | YES | - |
| 通用闪存接口 | YES | YES | YES | - | YES | - |
| 数据轮询 | NO | NO | NO | - | NO | - |
| JESD-30 代码 | R-PBGA-B56 | R-PBGA-B56 | R-PBGA-B56 | - | R-PBGA-B56 | - |
| 长度 | 9 mm | 9 mm | 9 mm | - | 9 mm | - |
| 内存密度 | 134217728 bi | 134217728 bi | 134217728 bi | - | 134217728 bi | - |
| 内存集成电路类型 | FLASH | FLASH | FLASH | - | FLASH | - |
| 内存宽度 | 16 | 16 | 16 | - | 16 | - |
| 功能数量 | 1 | 1 | 1 | - | 1 | - |
| 部门数/规模 | 4,127 | 4,127 | 4,127 | - | 4,127 | - |
| 端子数量 | 56 | 56 | 56 | - | 56 | - |
| 字数 | 8388608 words | 8388608 words | 8388608 words | - | 8388608 words | - |
| 字数代码 | 8000000 | 8000000 | 8000000 | - | 8000000 | - |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | - | 85 °C | - |
| 最低工作温度 | -25 °C | -25 °C | -25 °C | - | -25 °C | - |
| 组织 | 8MX16 | 8MX16 | 8MX16 | - | 8MX16 | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - |
| 封装代码 | VFBGA | VFBGA | VFBGA | - | VFBGA | - |
| 封装等效代码 | BGA56,7X8,30 | BGA56,7X8,30 | BGA56,7X8,30 | - | BGA56,7X8,30 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - |
| 页面大小 | 4 words | 4 words | 4 words | - | 4 words | - |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
| 电源 | 1.8 V | 1.8 V | 1.8 V | - | 1.8 V | - |
| 编程电压 | 1.8 V | 1.8 V | 1.8 V | - | 1.8 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - |
| 座面最大高度 | 1 mm | 1 mm | 1 mm | - | 1 mm | - |
| 部门规模 | 16K,64K | 16K,64K | 16K,64K | - | 16K,64K | - |
| 最大待机电流 | 0.00005 A | 0.00005 A | 0.00005 A | - | 0.00005 A | - |
| 最大压摆率 | 0.055 mA | 0.055 mA | 0.055 mA | - | 0.055 mA | - |
| 最大供电电压 (Vsup) | 2 V | 2 V | 2 V | - | 2 V | - |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | - | 1.7 V | - |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | - | 1.8 V | - |
| 表面贴装 | YES | YES | YES | - | YES | - |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | - |
| 温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | - | COMMERCIAL EXTENDED | - |
| 端子形式 | BALL | BALL | BALL | - | BALL | - |
| 端子节距 | 0.75 mm | 0.75 mm | 0.75 mm | - | 0.75 mm | - |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | - | BOTTOM | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
| 切换位 | NO | NO | NO | - | NO | - |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | - | NOR TYPE | - |
| 宽度 | 7.7 mm | 7.7 mm | 7.7 mm | - | 7.7 mm | - |
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