16M X 16 FLASH 1.8V PROM, PBGA64
16M × 16 FLASH 1.8V 可编程只读存储器, PBGA64
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | ST(意法半导体) |
零件包装代码 | BGA |
包装说明 | 10 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, TBGA-64 |
针数 | 64 |
Reach Compliance Code | compli |
ECCN代码 | 3A991.B.1.A |
最长访问时间 | 85 ns |
其他特性 | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
启动块 | TOP |
命令用户界面 | YES |
通用闪存接口 | YES |
数据轮询 | NO |
JESD-30 代码 | R-PBGA-B64 |
长度 | 13 mm |
内存密度 | 268435456 bi |
内存集成电路类型 | FLASH |
内存宽度 | 16 |
功能数量 | 1 |
部门数/规模 | 4,255 |
端子数量 | 64 |
字数 | 16777216 words |
字数代码 | 16000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -25 °C |
组织 | 16MX16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TBGA |
封装等效代码 | BGA64,8X8,40 |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY, THIN PROFILE |
页面大小 | 8 words |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 260 |
电源 | 1.8,3/3.3 V |
编程电压 | 1.8 V |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
部门规模 | 16K,64K |
最大待机电流 | 0.00011 A |
最大压摆率 | 0.077 mA |
最大供电电压 (Vsup) | 2 V |
最小供电电压 (Vsup) | 1.7 V |
标称供电电压 (Vsup) | 1.8 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL EXTENDED |
端子形式 | BALL |
端子节距 | 1 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | 40 |
切换位 | NO |
类型 | NOR TYPE |
宽度 | 10 mm |
M58LT256JST8ZA6F | M58LT256JST8ZA6T | M58LT256JST8ZA6E | M58LT256JST8ZA6 | M58LT256JST | M58LT256JSB8ZA6T | M58LT256JSB8ZA6F | M58LT256JSB8ZA6E | M58LT256JSB8ZA6 | M58LT256JSB | |
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描述 | 16M X 16 FLASH 1.8V PROM, PBGA64 | 16M X 16 FLASH 1.8V PROM, PBGA64 | 16M X 16 FLASH 1.8V PROM, PBGA64 | 16M X 16 FLASH 1.8V PROM, PBGA64 | 16M X 16 FLASH 1.8V PROM, PBGA64 | 16M X 16 FLASH 1.8V PROM, PBGA64 | 16M X 16 FLASH 1.8V PROM, PBGA64 | 16M X 16 FLASH 1.8V PROM, PBGA64 | 16M X 16 FLASH 1.8V PROM, PBGA64 | 16M X 16 FLASH 1.8V PROM, PBGA64 |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
组织 | 16MX16 | 16MX16 | 16MX16 | 16MX16 | 16M X 16 | 16MX16 | 16MX16 | 16MX16 | 16MX16 | 16M X 16 |
表面贴装 | YES | YES | YES | YES | Yes | YES | YES | YES | YES | Yes |
温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | INDUSTRIAL | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | INDUSTRIAL |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
是否Rohs认证 | 符合 | 不符合 | 符合 | 不符合 | - | 不符合 | 符合 | 符合 | 不符合 | - |
厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | - |
零件包装代码 | BGA | BGA | BGA | BGA | - | BGA | BGA | BGA | BGA | - |
包装说明 | 10 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, TBGA-64 | 10 X 13 MM, 1 MM PITCH, TBGA-64 | 10 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, TBGA-64 | 10 X 13 MM, 1 MM PITCH, TBGA-64 | - | 10 X 13 MM, 1 MM PITCH, TBGA-64 | 10 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, TBGA-64 | 10 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, TBGA-64 | 10 X 13 MM, 1 MM PITCH, TBGA-64 | - |
针数 | 64 | 64 | 64 | 64 | - | 64 | 64 | 64 | 64 | - |
Reach Compliance Code | compli | _compli | compli | _compli | - | _compli | compli | compli | _compli | - |
ECCN代码 | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | - | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | - |
最长访问时间 | 85 ns | 85 ns | 85 ns | 85 ns | - | 85 ns | 85 ns | 85 ns | 85 ns | - |
其他特性 | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | - | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | - |
启动块 | TOP | TOP | TOP | TOP | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - |
命令用户界面 | YES | YES | YES | YES | - | YES | YES | YES | YES | - |
通用闪存接口 | YES | YES | YES | YES | - | YES | YES | YES | YES | - |
数据轮询 | NO | NO | NO | NO | - | NO | NO | NO | NO | - |
JESD-30 代码 | R-PBGA-B64 | R-PBGA-B64 | R-PBGA-B64 | R-PBGA-B64 | - | R-PBGA-B64 | R-PBGA-B64 | R-PBGA-B64 | R-PBGA-B64 | - |
长度 | 13 mm | 13 mm | 13 mm | 13 mm | - | 13 mm | 13 mm | 13 mm | 13 mm | - |
内存密度 | 268435456 bi | 268435456 bi | 268435456 bi | 268435456 bi | - | 268435456 bi | 268435456 bi | 268435456 bi | 268435456 bi | - |
内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | - | FLASH | FLASH | FLASH | FLASH | - |
部门数/规模 | 4,255 | 4,255 | 4,255 | 4,255 | - | 4,255 | 4,255 | 4,255 | 4,255 | - |
字数 | 16777216 words | 16777216 words | 16777216 words | 16777216 words | - | 16777216 words | 16777216 words | 16777216 words | 16777216 words | - |
字数代码 | 16000000 | 16000000 | 16000000 | 16000000 | - | 16000000 | 16000000 | 16000000 | 16000000 | - |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | - |
最低工作温度 | -25 °C | -25 °C | -25 °C | -25 °C | - | -25 °C | -25 °C | -25 °C | -25 °C | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | TBGA | TBGA | TBGA | TBGA | - | TBGA | TBGA | TBGA | TBGA | - |
封装等效代码 | BGA64,8X8,40 | BGA64,8X8,40 | BGA64,8X8,40 | BGA64,8X8,40 | - | BGA64,8X8,40 | BGA64,8X8,40 | BGA64,8X8,40 | BGA64,8X8,40 | - |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
封装形式 | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | - | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | - |
页面大小 | 8 words | 8 words | 8 words | 8 words | - | 8 words | 8 words | 8 words | 8 words | - |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - |
峰值回流温度(摄氏度) | 260 | 240 | 260 | 240 | - | 240 | 260 | 260 | 240 | - |
电源 | 1.8,3/3.3 V | 1.8,3/3.3 V | 1.8,3/3.3 V | 1.8,3/3.3 V | - | 1.8,3/3.3 V | 1.8,3/3.3 V | 1.8,3/3.3 V | 1.8,3/3.3 V | - |
编程电压 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | - | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | - |
部门规模 | 16K,64K | 16K,64K | 16K,64K | 16K,64K | - | 16K,64K | 16K,64K | 16K,64K | 16K,64K | - |
最大待机电流 | 0.00011 A | 0.00011 A | 0.00011 A | 0.00011 A | - | 0.00011 A | 0.00011 A | 0.00011 A | 0.00011 A | - |
最大压摆率 | 0.077 mA | 0.077 mA | 0.077 mA | 0.077 mA | - | 0.077 mA | 0.077 mA | 0.077 mA | 0.077 mA | - |
最大供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | - | 2 V | 2 V | 2 V | 2 V | - |
最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | - | 1.7 V | 1.7 V | 1.7 V | 1.7 V | - |
标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - |
技术 | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | - |
端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | - | 1 mm | 1 mm | 1 mm | 1 mm | - |
处于峰值回流温度下的最长时间 | 40 | 30 | 40 | 30 | - | 30 | 40 | 40 | 30 | - |
切换位 | NO | NO | NO | NO | - | NO | NO | NO | NO | - |
类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | - | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | - |
宽度 | 10 mm | 10 mm | 10 mm | 10 mm | - | 10 mm | 10 mm | 10 mm | 10 mm | - |
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