UVPROM, 256X8, 550ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, CERDIP-24
参数名称 | 属性值 |
零件包装代码 | DIP |
包装说明 | HERMETIC SEALED, WINDOWED, CERDIP-24 |
针数 | 24 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最长访问时间 | 550 ns |
JESD-30 代码 | R-CDIP-T24 |
长度 | 31.9405 mm |
内存密度 | 2048 bit |
内存集成电路类型 | UVPROM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 24 |
字数 | 256 words |
字数代码 | 256 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 256X8 |
输出特性 | 3-STATE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | WDIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE, WINDOW |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
座面最大高度 | 5.715 mm |
最大供电电压 (Vsup) | 5.25 V |
最小供电电压 (Vsup) | 4.75 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | MOS |
温度等级 | MILITARY |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 15.24 mm |
Base Number Matches | 1 |
AM9702AL-1HDL | AM9702AL-2HDL | AM9702A-1HDL | AM9702ALHDL | AM9702A-2HDL | AM9702AHDL | |
---|---|---|---|---|---|---|
描述 | UVPROM, 256X8, 550ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, CERDIP-24 | UVPROM, 256X8, 650ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, CERDIP-24 | UVPROM, 256X8, 550ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, CERDIP-24 | UVPROM, 256X8, 1000ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, CERDIP-24 | UVPROM, 256X8, 650ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, CERDIP-24 | UVPROM, 256X8, 1000ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, CERDIP-24 |
零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
包装说明 | HERMETIC SEALED, WINDOWED, CERDIP-24 | WDIP, | WDIP, | WDIP, | WDIP, | WDIP, |
针数 | 24 | 24 | 24 | 24 | 24 | 24 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 550 ns | 650 ns | 550 ns | 1000 ns | 650 ns | 1000 ns |
JESD-30 代码 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 |
长度 | 31.9405 mm | 31.9405 mm | 31.9405 mm | 31.9405 mm | 31.9405 mm | 31.9405 mm |
内存密度 | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit | 2048 bit |
内存集成电路类型 | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 24 | 24 | 24 | 24 | 24 |
字数 | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words |
字数代码 | 256 | 256 | 256 | 256 | 256 | 256 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
组织 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | WDIP | WDIP | WDIP | WDIP | WDIP | WDIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.715 mm | 5.715 mm | 5.715 mm | 5.715 mm | 5.715 mm | 5.715 mm |
最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO |
技术 | MOS | MOS | MOS | MOS | MOS | MOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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