SURMOUNT
TM
5
µm
PIN Diodes—MADP-042305-130600,
MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
Features
•
•
•
•
•
•
•
Surface Mount, 5
µm
I-Region Length Device
No Wirebonds Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
Higher Average and Peak Power Handling
MADP-042005 Series
V2
Absolute Maximum Ratings
1
@ T
A
= +25 °C (unless otherwise
specified)
Parameter
Part
Forward
Current
Reverse
Voltage
Operating
Temperature
Storage
Temperature
Junction
Temperature
C.W. Inci-
dent Power
(dBm)
Mounting
Temperature
40
44
042
305
Absolute Maximum
042
405
250 mA
l -80 V l
-55 °C to +125 °C
-55 °C to +150 °C
+175 °C
43
35
042
505
042
905
Description and Applications
This device is a Silicon-Glass PIN diode chip fabricated
with M/A-COM’s patented HMIC
TM
process. This
device features two silicon pedestals embedded in a
low loss, low dispersion glass. The diode is formed
on the top of one pedestal and connections to the
backside of the device are facilitated by making the
pedestal sidewalls electrically conductive. Selective
backside metallization is applied producing a surface
mount device. This Vertical Topology provides for
Exceptional Heat Transfer. The topside is fully
encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact
protection. These protective coatings prevent
damage to the junction and the anode air-bridge
during handling and assembly.
These packageless devices are suitable for usage in
Moderate Incident Power ( 10 W C.W. ) and 50 W , 1
uS, 0.01 Duty Cycle, Peak Power, Series, Shunt, or
Series-Shunt Switches. Smaller Parasitic
Inductance, 0.4 nH, and Excellent RC Constant,
make the devices ideal for Higher Frequency Switch
Elements compared to their Plastic Device Counterparts.
+300 °C for 10 seconds
1. Operation of this device above any one of these parameters
may cause permanent damage.
Case Style
ODS-1306
A
B
C
Bottom Side Contacts are Circuit Side
Dim
A
B
C
D
E
F
G
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Inches
Min.
Max.
0.040
0.042
0.021
0.004
0.013
0.011
0.013
0.019
0.023
0.008
0.015
0.013
0.015
0.021
Millimeters
Min.
Max.
1.025
1.075
0.525
0.102
0.325
0.275
0.325
0.475
0.575
0.203
0.375
0.325
0.375
0.525
G
D
E
F
1. Backside Metal: 0.1microns thick.
2. Shaded Areas Indicate Backside Ohmic Gold Contacts.
3. Both Devices have Same Outline Dimensions ( A to G ).
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
SURMOUNT
TM
5
µm
PIN Diodes—MADP-042305-130600,
MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
Electrical Specifications @ + 25 °C
Parameter
Symbol
Conditions
Units
1
MADP-042005 Series
V2
Min
Typ
MADP-042505
Max
Min
Typ
MADP-042305
Max
Capacitance
Capacitance
Capacitance
Capacitance
Resistance
Resistance
Forward Voltage
Reverse Leakage
Current
Input Third Order
Intercept Point
C.W. Thermal
Resistance
Lifetime
C
T
C
T
C
T
C
T
R
S
R
S
V
F
I
R
- 10 V, 1 MHz
- 10 V, 1 GHz
1,3
- 40 V, 1 MHz
1
- 40 V, 1 GHz
1,3
+ 20 mA, 1 GHz
2,3
+ 50 mA, 1 GHz
2,3
+ 10 mA
| -80V |
F 1= 1000MHz
F2 = 1010MHz
Input Power = +20dBm
I bias = + 20 mA
I
H
=0.5A, I
L
=10 mA
+10 mA / -6 mA
( 50 % - 90 % V )
pF
pF
pF
pF
Ω
Ω
V
uA
0.14
0.15
0.13
0.14
1.32
1.18
0.87
0.22
0.22
1.00
10
0.28
0.28
0.27
0.27
0.83
0.76
0.84
0.40
0.40
1.00
10
IIP3
dBm
°
C/W
nS
Min
72
76
R
θJL
T
L
145
180
Typ
MADP-042405
Max
Min
115
210
Typ
MADP-042905
Max
Parameter
Symbol
Conditions
Units
1
Capacitance
Capacitance
Capacitance
Capacitance
Resistance
Resistance
Forward Voltage
Reverse Leakage
Current
Input Third Order
Intercept Point
C.W. Thermal
Resistance
Lifetime
1.
2.
3.
4.
2
C
T
C
T
C
T
C
T
R
S
R
S
V
F
I
R
- 10 V, 1 MHz
- 10 V, 1 GHz
1,3
- 40 V, 1 MHz
1
- 40 V, 1 GHz
1,3
+ 20 mA, 1 GHz
2,3
+ 50 mA, 1 GHz
2,3
+ 10 mA
| -80V |
F 1= 1000MHz
F2 = 1010MHz
Input Power = +20dBm
I bias = + 20 mA
I
H
=0.5A, I
L
=10 mA
+10 mA / -6 mA
( 50 % - 90 % V )
pF
pF
pF
pF
Ω
Ω
V
uA
0.61
0.61
0.57
0.58
0.62
0.58
0.82
0.75
0.75
1.00
10
0.06
0.06
0.06
0.06
3.14
2.60
0.93
0.18
0.18
1.00
10
IIP3
dBm
°
C/W
nS
80
65
R
θJL
T
L
100
255
185
140
Total capacitance, C
T
, is equivalent to the sum of Junction Capacitance ,Cj, and Parasitic Capacitance, Cpar.
Series resistance R
S
is equivalent to the total diode resistance : Rs = Rj ( Junction Resistance) + Rc ( Ohmic Resistance)
Rs and C
T
are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-1134 package with Sn 60/Pb 40 Solder
Steady-state R
θJL
measured with die mounted in an ODS-1134 package with Sn 60/Pb 40 Solder.
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
SURMOUNT
TM
5
µm
PIN Diodes—MADP-042305-130600,
MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
Handling Procedures
MADP-042005 Series
V2
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and
skin oils.
The use of plastic tipped tweezers or vacuum pickups is strongly recommended for
individual components. Bulk handling should insure that abrasion and mechanical shock are minimized.
Bonding Techniques
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active
junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of
80 Au / 20 Sn @ ~ + 280 °C or Sn 60 / Pb 40 ~ + 185 °C solder is recommended. Conductive silver epoxy for
die attachment ~ + 150 °C may also be used for lower Incident power ( < 1 W Average Power ) applications.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We re-commend utilizing a
vacuum tip and force of 60 to100 grams applied normal to the top surface of the device. When soldering to soft
substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so
that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the
circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top
surface of the die. The solder joint must Not be made one at a time, creating un-equal heat flow and thermal
stress. Solder reflow should Not be performed by causing heat to flow through the top surface of the die. Since
the HMIC glass is transparent, the edges of the mounting pads closest to each other can be visually inspected
through the die after attach is completed.
A typical profile for a Sn 60/ Pb 40 Soldering process is provided in Application Note, “ M538 ” , “ Surface
Mounting Instructions “ on the MA-COM website www.macom.com
3
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
SURMOUNT
TM
5
µm
PIN Diodes—MADP-042305-130600,
MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
MADP-042005 Series Typical Performance Curves @ +25 °C
Ct vs V
Ct @ 1GHz
0.800
0.700
0.600
0.500
Ct (pF)
0.400
0.300
0.200
0.100
0.000
0
5
10
15
20
Bias (V)
25
30
35
40
042505
042305
042905
0.100
0.001
042405
10.000
MADP-042005 Series
V2
Rs vs I
Rs @ 1GHz
042905
042305
1.000
042505
042405
Rs (ohm)
0.010
Bias (A)
0.100
Ct vs F
Ct @ 10V
0.700
042405
0.600
0.500
Ct (pF)
Ct vs F
Ct @ 40V
0.700
042405
0.600
0.500
Ct (pF)
0.400
0.300
0.200
0.100
042905
0.400
0.300
0.200
0.100
0.000
0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+
00
08
08
08
08
09
09
09
09
09
Freq (Hz)
042505
042505
042305
042305
042905
0.000
0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+
00
08
08
08
08
09
09
09
09
09
Freq (Hz)
Rs vs F
Rs @ 10mA
4.50E+00
042905
4.00E+00
3.50E+00
3.00E+00
Rs (ohm)
2.50E+00
2.00E+00
1.50E+00
042505
1.00E+00
5.00E-01
042405
042305
Rs vs F
Rs @ 20mA
4.00E+00
042905
3.50E+00
3.00E+00
Rs (ohm)
2.50E+00
2.00E+00
1.50E+00
1.00E+00
5.00E-01
042305
042505
0.00E+00
0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+
00
08
08
08
08
09
09
09
09
09
Freq (Hz)
042405
0.00E+00
0.00E+ 2.00E+ 4.00E+ 6.00E+ 8.00E+ 1.00E+ 1.20E+ 1.40E+ 1.60E+ 1.80E+
00
08
08
08
08
09
09
09
09
09
Freq (Hz)
4
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
•
North America
Tel: 800.366.2266 / Fax: 978.366.2266
•
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
•
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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