PD-91564H
IRHM7064
JANSR2N7431
RADIATION HARDENED
POWER MOSFET
THRU-HOLE (TO-254AA)
Product Summary
Part Number
IRHM7064
IRHM3064
IRHM4064
IRHM8064
Radiation Level
100 kRads(Si)
300 kRads(Si)
500 kRads(Si)
1000 kRads(Si)
RDS(on)
0.021
0.030
0.030
0.030
I
D
35A*
35A*
35A*
35A*
QPL Part Number
JANSR2N7431
JANSF2N7431
JANSG2N7431
JANSH2N7431
60V, N-CHANNEL
REF: MIL-PRF-19500/663
RAD-Hard HEXFET TECHNOLOGY
TO-254AA
Description
IRHM7064 is part of the International Rectifier HiRel family
of products. IR HiRel RAD-Hard HEXFET technology
provides high performance power MOSFETs for space
applications. This technology has over a decade of proven
performance and reliability in satellite applications. These
devices have been characterized for both Total Dose and
Single Event Effects (SEE). The combination of low Rdson
and low gate charge reduces the power losses in switching
applications such as DC to DC converters and motor
control. These devices retain all of the well established
advantages of MOSFETs such as voltage control, fast
switching, ease of paralleling and temperature stability of
electrical parameters.
Features
Single Event Effect (SEE) Hardened
Low RDS(on)
Low Total Gate Charge
Simple Drive Requirements
Ease of Paralleling
Hermetically Sealed
Electrically Isolated
Ceramic Package
Light Weight
ESD Rating: Class 3B per MIL-STD-750,
Method 1020
Absolute Maximum Ratings
Parameter
I
D
@ V
GS
= 12V, T
C
= 25°C
I
DM
P
D
@T
C
= 25°C
V
GS
E
AS
I
AR
E
AR
dv/dt
T
J
T
STG
Continuous Drain Current
Pulsed Drain Current
Maximum Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Lead Temperature
Weight
*Current is limited by package
For Footnotes refer to the page 2.
1
International Rectifier HiRel Products, Inc.
35*
35*
140
250
2.0
± 20
500
35
25
2.5
-55 to + 150
I
D
@ V
GS
= 12V, T
C
= 100°C Continuous Drain Current
Pre-Irradiation
Units
A
W
W/°C
V
mJ
A
mJ
V/ns
°C
300 (0.063 in. /1.6 mm from case for 10s)
9.3 (Typical)
g
2017-12-21
IRHM7064
JANSR2N7431
Pre-Irradiation
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter
BV
DSS
Drain-to-Source Breakdown Voltage
BV
DSS
/T
J
Breakdown Voltage Temp. Coefficient
R
DS(on)
V
GS(th)
Gfs
I
DSS
I
GSS
Q
G
Q
GS
Q
GD
t
d(on)
tr
t
d(off)
t
f
Ls +L
D
C
iss
C
oss
C
rss
Gate Threshold Voltage
Forward Transconductance
Zero Gate Voltage Drain Current
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain (‘Miller’) Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Inductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Min. Typ. Max. Units
60
–––
2.0
18
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
––– –––
0.056 –––
––– 0.021
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
6.8
4900
2800
860
4.0
–––
25
250
100
-100
270
60
110
27
120
120
100
–––
–––
–––
–––
V
V/°C
V
S
Test Conditions
V
GS
= 0V, I
D
= 1.0mA
Reference to 25°C, I
D
= 1.0mA
Static Drain-to-Source On-State Resistance –––
V
GS
= 12V, I
D
= 35A
V
DS
= V
GS
, I
D
= 1.0mA
V
DS
= 15V, I
D
= 35A
V
DS
= 48V, V
GS
= 0V
µA
V
DS
= 48V,V
GS
= 0V,T
J
=125°C
V
GS
= 20V
nA
V
GS
= -20V
I
D
= 35A
nC
V
DS
= 30V
V
GS
= 12V
V
DD
= 30V
I
D
= 35A
ns
R
G
= 2.35
V
GS
= 12V
nH
Measured from Drain lead (6mm / 0.25 in
from package) to Source lead (6mm/ 0.25
in from package) with Source wire internally
bonded from Source pin to Drain pad
V
GS
= 0V
pF
V
DS
= 25V
ƒ = 1.0MHz
Source-Drain Diode Ratings and Characteristics
Parameter
I
S
I
SM
V
SD
t
rr
Q
rr
t
on
Continuous Source Current (Body Diode)
Pulsed Source Current (Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
Min. Typ. Max. Units
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
35*
140
1.5
360
3.1
A
V
ns
µC
Test Conditions
T
J
= 25°C,I
S
= 35A, V
GS
= 0V
T
J
= 25°C, I
F
= 35A, V
DD
≤
50V
di/dt = 100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
* Current is limited by package
Thermal Resistance
Parameter
R
JC
R
CS
R
JA
Junction-to-Case
Case -to-Sink
Junction-to-Ambient (Typical socket mount)
Min.
–––
–––
–––
Typ.
–––
0.21
–––
Max.
0.50
–––
48
Units
°C/W
Footnotes:
Repetitive Rating; Pulse width limited by maximum junction temperature.
DD
= 25V, starting T
J
= 25°C, L =0.9mH, Peak I
L
= 35A, V
GS
= 12V
V
I
SD
35A, di/dt
150A/µs, V
DD
60V, T
J
150°C
Pulse width
300 µs; Duty Cycle
2%
Total Dose Irradiation with V
GS
Bias.
12 volt V
GS
applied and V
DS
= 0 during irradiation per MIL-STD-750, Method 1019, condition A.
Total Dose Irradiation with V
DS
Bias.
48 volt V
DS
applied and V
GS
= 0 during irradiation per MlL-STD-750, Method 1019, condition A.
2
International Rectifier HiRel Products, Inc.
2017-12-21
IRHM7064
JANSR2N7431
Radiation Characteristics
Pre-Irradiation
IR HiRel Radiation Hardened MOSFETs are tested to verify their radiation hardness capability. The hardness assurance
program at IR Hirel is comprised of two radiation environments. Every manufacturing lot is tested for total ionizing dose
(per notes 5 and 6) using the TO-3 package. Both pre- and post-irradiation performance are tested and specified using
the same drive circuitry and test conditions in order to provide a direct comparison.
Table1. Electrical Characteristics @ Tj = 25°C, Post Total Dose Irradiation
Parameter
BV
DSS
V
GS(th)
I
GSS
I
GSS
I
DSS
R
DS(on)
R
DS(on)
V
SD
Drain-to-Source Breakdown Voltage
Gate Threshold Voltage
Gate-to-Source Leakage Forward
Gate-to-Source Leakage Reverse
Zero Gate Voltage Drain Current
Static Drain-to-Source
On-State Resistance (TO-3)
Static Drain-to-Source
On-State Resistance (TO-254AA)
Diode Forward Voltage
100 kRads (Si)
1
Min.
60
2.0
–––
–––
–––
–––
–––
–––
Max.
–––
4.0
100
-100
25
0.021
0.021
1.5
300k - 1000 kRads (Si)
2
Min.
60
1.25
–––
–––
–––
–––
–––
–––
Max.
–––
4.5
100
-100
50
0.030
0.030
1.5
V
V
nA
nA
µA
V
V
GS
= 0V, I
D
= 1.0mA
V
DS
= V
GS
, I
D
= 1.0mA
V
GS
= 20V
V
GS
= -20V
V
DS
= 48V, V
GS
= 0V
V
GS
= 12V, I
D
= 35A
V
GS
= 12V, I
D
= 35A
V
GS
= 0V, I
D
= 35A
Units
Test Conditions
1. Part number IRHM7064 (JANSR2N7431)
2. Part numbers IRHM3064 (JANSF2N7431), IRHM4064 (JANSG2N7431) and IRHM8064 (JANSH2N7431)
IR HiRel radiation hardened MOSFETs have been characterized in heavy ion environment for Single Event Effects
(SEE). Single Event Effects characterization is illustrated in Fig. a and Table 2.
Table 2. Typical Single Event Effect Safe Operating Area
Ion
Br
I
LET
(MeV/(mg/cm
2
))
36.8
59.9
Energy
(MeV)
305
345
Range
(µm)
39
32.8
VDS (V)
@VGS=0V
60
40
@VGS=-5V
60
35
@VGS=-10V @VGS=-15V @VGS=-20V
45
30
40
25
30
20
70
60
50
40
30
20
10
0
0
-5
-10
Bias VGS (V)
-15
-20
Bias VDS (V)
I
Br
Fig a.
Typical Single Event Effect, Safe Operating Area
For Footnotes, refer to the page 2.
3
International Rectifier HiRel Products, Inc.
2017-12-21
IRHM7064
JANSR2N7431
Pre-Irradiation
Fig 1.
Typical Output Characteristics
1000
Fig 2.
Typical Output Characteristics
I
D
, Drain-to-Source Current (A)
T
J
= 25
°
C
100
T
J
= 150
°
C
10
V DS = 25V
20µs PULSE WIDTH
5
6
7
8
9
10
11
12
V
GS
, Gate-to-Source Voltage (V)
Fig 3.
Typical Transfer Characteristics
10000
Fig 4.
Normalized On-Resistance Vs. Temperature
20
V
GS
, Gate-to-Source Voltage (V)
8000
V
GS
C
iss
C
rss
C
oss
=
=
=
=
0V,
f = 1MHz
C
gs
+ C
gd ,
C
ds
SHORTED
C
gd
C
ds
+ C
gd
I
D
= 35A
V
DS
= 48V
V
DS
= 30V
V
DS
= 12V
16
C, Capacitance (pF)
6000
Ciss
Coss
12
4000
8
2000
Crss
4
0
1
10
100
0
FOR TEST CIRCUIT
SEE FIGURE 13
0
50
100
150
200
250
V
DS
, Drain-to-Source Voltage (V)
Q
G
, Total Gate Charge (nC)
Fig 5.
Typical Capacitance Vs.
Drain-to-Source Voltage
4
Fig 6.
Typical Gate Charge Vs.
Gate-to-Source Voltage
2017-12-21
International Rectifier HiRel Products, Inc.
IRHM7064
JANSR2N7431
Pre-Irradiation
1000
I
SD
, Reverse Drain Current (A)
T
J
= 25
°
C
T
J
= 150
°
C
100
10
1
0.0
V
GS
= 0 V
1.0
2.0
3.0
4.0
5.0
V
SD
,Source-to-Drain Voltage (V)
Fig 7.
Typical Source-Drain Diode Forward Voltage
E
AS
, Single Pulse Avalanche Energy (mJ)
80
Fig 8.
Maximum Safe Operating Area
1400
1200
1000
800
600
400
200
0
LIMITED BY PACKAGE
TOP
BOTTOM
I
D
, Drain Current (A)
60
ID
16A
22A
35A
40
20
0
25
50
75
100
125
150
T
C
, Case Temperature
( °C)
25
50
75
100
125
150
Starting T
J
Junction Temperature
,
(
°
C)
Fig 9.
Maximum Drain Current Vs. Case Temperature
Fig 10.
Maximum Avalanche Energy
Vs. Drain Current
1
Thermal Response (Z
thJC
)
0.50
0.20
0.10
0.05
0.02
0.01
SINGLE PULSE
(THERMAL RESPONSE)
P
DM
t
1
t
2
Notes:
1. Duty factor D = t
1
/ t
2
2. Peak T
J
= P
DM
x Z
thJC
+ T
C
0.0001
0.001
0.01
0.1
1
10
0.1
0.01
0.001
0.00001
t
1
, Rectangular Pulse Duration (sec)
Fig 11.
Maximum Effective Transient Thermal Impedance, Junction-to-Case
5
International Rectifier HiRel Products, Inc.
2017-12-21