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Datasheet
Backplane
2.00mm (.079") Pitch MFB™ (Futurebus+) Header, Vertical, 4- or 5-Row, Press-Fit Pin
85801
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Status
Application
Module
Orientation
Shielded
Product Name
Pitch / Center Spacing
Circuits / Positions
Rows
Modularity
Voltage-max [volts]
Current-max [amps]
Contact Resistance [ohms]
Withstanding Voltage
Insulation Resistance [ohms]
Product Specification
Packaging
Mates With
Designed In
Insertion Force to PCB-max.
(per circuit)
Contact Retention Force-min.
(per circuit)
Mating Force-max. (per circuit)
Unmating Force-min. (per
circuit)
Durability [mating cycles] min.
Active
Backplane
Signal
Vertical
No
MFB™
2.00mm (.079")
8, 10, 24, 30, 48, 60, 96, 120,
192, 240
q
Help
Features and Benefits
Eye-of-the-needle press-fit zone
provides high retention force
Selective loading available
High-temperature material withstands
wave soldering
4, 5
12mm
1000V
1.0A
50 milliohms max.
750V
5000 Megohms min.
PS-85801-002
Tube
54613, 54526, 54867, 54884,
54557, 54883
Millimeters
100.0N (22.48 lb)
q
q
20.00N (4.50 lb)
0.40N (0.09 lb)
0.15N (0.034 lb)
250
PCB Mounting
Surface Mount Compatible
(SMC)
PCB Thickness
Polarized to PCB
Housing - Material
Flammability
Color
Contact
Plating Thickness
Plating Contact
Plating Tail
Temperature Range
Coding Key
Stackable
Comment
Molex Series
Press-Fit
No
1.40mm (.055")
Yes
LCP, Glass-filled
UL 94V-0
Natural
Copper and Tin Alloy
0.8µm (31µ"), 1.27µm
(50µ"), 2.00µm (79µ")
Gold (Au) over Nickel (Ni)
Tin/Lead (Sn/Pb)
-55°C to +125°C
Yes
Side-to-Side
Backplane Header Module,
Signal, Open
85801
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