UVPROM, 2KX8, 200ns, NMOS, CQCC32, CERAMIC, LCC-32
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | QFJ |
| 包装说明 | QCCN, LCC32,.45X.55 |
| 针数 | 32 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 最长访问时间 | 200 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-CQCC-N32 |
| JESD-609代码 | e0 |
| 长度 | 13.97 mm |
| 内存密度 | 16384 bit |
| 内存集成电路类型 | UVPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 2048 words |
| 字数代码 | 2000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 2KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC32,.45X.55 |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 编程电压 | 12.5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.556 mm |
| 最大压摆率 | 0.1 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | NMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 11.43 mm |
| Base Number Matches | 1 |
| AM2716B-200LC | AM2716B-200DE | AM2716B-300DE | AM2716B-200DI | AM2732B-200DE | AM2732B-300LC | AM2732B-200LI | AM2716B-200LE | AM2716B-300LC | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | UVPROM, 2KX8, 200ns, NMOS, CQCC32, CERAMIC, LCC-32 | UVPROM, 2KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | UVPROM, 2KX8, 300ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | UVPROM, 2KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | UVPROM, 4KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | UVPROM, 4KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 | UVPROM, 4KX8, 200ns, NMOS, CQCC32, CERAMIC, LCC-32 | UVPROM, 2KX8, 200ns, NMOS, CQCC32, CERAMIC, LCC-32 | UVPROM, 2KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | QFJ | DIP | DIP | DIP | DIP | QFJ | QFJ | QFJ | QFJ |
| 包装说明 | QCCN, LCC32,.45X.55 | WDIP, DIP24,.6 | WDIP, DIP24,.6 | WDIP, DIP24,.6 | WDIP, DIP24,.6 | QCCN, LCC32,.45X.55 | QCCN, LCC32,.45X.55 | QCCN, LCC32,.45X.55 | QCCN, LCC32,.45X.55 |
| 针数 | 32 | 24 | 24 | 24 | 24 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 200 ns | 200 ns | 300 ns | 200 ns | 200 ns | 300 ns | 200 ns | 200 ns | 300 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-CQCC-N32 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-CQCC-N32 | R-CQCC-N32 | R-CQCC-N32 | R-CQCC-N32 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 13.97 mm | 32.0675 mm | 32.0675 mm | 32.0675 mm | 32.0675 mm | 13.97 mm | 13.97 mm | 13.97 mm | 13.97 mm |
| 内存密度 | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 32768 bit | 32768 bit | 32768 bit | 16384 bit | 16384 bit |
| 内存集成电路类型 | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 24 | 24 | 24 | 24 | 32 | 32 | 32 | 32 |
| 字数 | 2048 words | 2048 words | 2048 words | 2048 words | 4096 words | 4096 words | 4096 words | 2048 words | 2048 words |
| 字数代码 | 2000 | 2000 | 2000 | 2000 | 4000 | 4000 | 4000 | 2000 | 2000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 85 °C | 125 °C | 70 °C | 85 °C | 125 °C | 70 °C |
| 最低工作温度 | - | -55 °C | -55 °C | -40 °C | -55 °C | - | -40 °C | -55 °C | - |
| 组织 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 4KX8 | 4KX8 | 4KX8 | 2KX8 | 2KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | WDIP | WDIP | WDIP | WDIP | QCCN | QCCN | QCCN | QCCN |
| 封装等效代码 | LCC32,.45X.55 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | LCC32,.45X.55 | LCC32,.45X.55 | LCC32,.45X.55 | LCC32,.45X.55 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 编程电压 | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V | 12.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.556 mm | 5.588 mm | 5.588 mm | 5.588 mm | 5.588 mm | 3.556 mm | 3.556 mm | 3.556 mm | 3.556 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | NO | YES | YES | YES | YES |
| 技术 | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS | NMOS |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | INDUSTRIAL | MILITARY | COMMERCIAL | INDUSTRIAL | MILITARY | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 11.43 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 11.43 mm | 11.43 mm | 11.43 mm | 11.43 mm |
| 最大压摆率 | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | - | - | - | 0.1 mA | 0.1 mA |
| 厂商名称 | - | - | - | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
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