Modem, CMOS, PQFP64
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | QFP, QFP64,.47SQ,20 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| JESD-30 代码 | S-PQFP-G64 |
| JESD-609代码 | e0 |
| 端子数量 | 64 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QFP |
| 封装等效代码 | QFP64,.47SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大压摆率 | 25 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 电信集成电路类型 | MODEM |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| SSI73K224L-IGT | SSI73K224L-32IH | BTA04-700S | SSI73K224L-IP | SSI73K224L-28IH | SSI73K224L-IG | SSI73K224LS-IP | |
|---|---|---|---|---|---|---|---|
| 描述 | Modem, CMOS, PQFP64 | Modem, CMOS, PQCC32 | isc Thyristors | Telecom IC | Modem, CMOS, PQCC28 | Modem, CMOS, PQFP52 | Modem, CMOS, PDIP22 |
| 是否Rohs认证 | 不符合 | 不符合 | - | - | 不符合 | 不符合 | 不符合 |
| 包装说明 | QFP, QFP64,.47SQ,20 | QCCJ, LDCC32,.5X.6 | - | , | QCCJ, LDCC28,.5SQ | QFP, QFP52,.52SQ | DIP, DIP22,.4 |
| Reach Compliance Code | unknown | unknown | - | unknown | unknown | unknown | unknown |
| JESD-30 代码 | S-PQFP-G64 | R-PQCC-J32 | - | - | S-PQCC-J28 | S-PQFP-G52 | R-PDIP-T22 |
| JESD-609代码 | e0 | e0 | - | - | e0 | e0 | e0 |
| 端子数量 | 64 | 32 | - | - | 28 | 52 | 22 |
| 最高工作温度 | 85 °C | 85 °C | - | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QFP | QCCJ | - | - | QCCJ | QFP | DIP |
| 封装等效代码 | QFP64,.47SQ,20 | LDCC32,.5X.6 | - | - | LDCC28,.5SQ | QFP52,.52SQ | DIP22,.4 |
| 封装形状 | SQUARE | RECTANGULAR | - | - | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | FLATPACK | CHIP CARRIER | - | - | CHIP CARRIER | FLATPACK | IN-LINE |
| 电源 | 5 V | 5 V | - | - | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 25 mA | 25 mA | - | - | - | 25 mA | 25 mA |
| 标称供电电压 | 5 V | 5 V | - | - | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | - | - | YES | YES | NO |
| 技术 | CMOS | CMOS | - | - | CMOS | CMOS | CMOS |
| 电信集成电路类型 | MODEM | MODEM | - | - | MODEM | MODEM | MODEM |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | J BEND | - | - | J BEND | GULL WING | THROUGH-HOLE |
| 端子节距 | 0.5 mm | 1.27 mm | - | - | 1.27 mm | 0.635 mm | 2.54 mm |
| 端子位置 | QUAD | QUAD | - | - | QUAD | QUAD | DUAL |
| 厂商名称 | - | Silicon Systems Inc | - | - | Silicon Systems Inc | Silicon Systems Inc | Silicon Systems Inc |
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