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89HPES8NT2ZABX

产品描述PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, CABGA-324
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小490KB,共28页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

89HPES8NT2ZABX概述

PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, CABGA-324

89HPES8NT2ZABX规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
零件包装代码BGA
包装说明LBGA,
针数324
Reach Compliance Codecompliant
ECCN代码3A001.A.3
Is SamacsysN
地址总线宽度
总线兼容性PCI
最大时钟频率125 MHz
外部数据总线宽度
JESD-30 代码S-PBGA-B324
JESD-609代码e0
长度19 mm
湿度敏感等级3
端子数量324
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装形状SQUARE
封装形式GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度)225
认证状态Not Qualified
座面最大高度1.5 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层TIN LEAD
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间20
宽度19 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

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8-Lane 2-Port Non-Transparent
PCI Express® Switch
®
89HPES8NT2
Data Sheet
Advance Information*
Device Overview
The 89HPES8NT2 is a member of the IDT PRECISE™ family of PCI
Express® switching solutions offering the next-generation I/O intercon-
nect standard. The PES8NT2 is a 8-lane, 2-port peripheral chip that
provides high-performance switching and non-transparent bridging
(NTB) functions between a PCIe® upstream port and an NTB down-
stream port. The PES8NT2 is a part of the IDT PCIe System Intercon-
nect Products and is intended to be used with IDT PCIe System
Interconnect Switches. Together, the chipset targets multi-host and intel-
ligent I/O applications such as communications, storage, and blade
servers where inter-domain communication is required.
Features
High Performance PCI Express Switch
Eight PCI Express lanes (2.5Gbps), two switch ports
Delivers 32 Gbps (4 GBps) of aggregate switching capacity
Low latency cut-through switch architecture
Support for Max Payload size up to 2048 bytes
Supports one virtual channel and eight traffic classes
PCI Express Base specification Revision 1.0a compliant
Flexible Architecture with Numerous Configuration Options
Supports automatic per port link width negotiation (x8, x4, x2,
or x1)
Static lane reversal on all ports
Automatic polarity inversion on all lanes
Supports locked transactions, allowing use with legacy soft-
ware
Ability to load device configuration from serial EEPROM
Ability to control device via SMBus
Non-Transparent Port
Crosslink support on NTB port
Four mapping windows supported
Each may be configured as a 32-bit memory or I/O window
May be paired to form a 64-bit memory window
Interprocessor communication
Thirty-two inbound and outbound doorbells
Four inbound and outbound message registers
Two shared scratchpad registers
Allows up to sixteen masters to communicate through the non-
transparent port
No limit on the number of supported outstanding transactions
through the non-transparent bridge
Completely symmetric non-transparent bridge operation
allows similar/same configuration software to be run
Supports direct connection to a transparent or non-transparent
port of another switch
Highly Integrated Solution
Requires no external components
Incorporates on-chip internal memory for packet buffering and
queueing
Integrates eight 2.5 Gbps embedded full duplex SerDes, 8B/
10B encoder/decoder (no separate transceivers needed)
Block Diagram
2-Port Switch Core
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Non-
Transparent
Bridge
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
...
...
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
8 PCI Express Lanes
x4 Upstream Port and One x4 Downstream Port
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 28
©
2007 Integrated Device Technology, Inc.
*Notice: The information in this document is subject to change without notice
April 11, 2007
DSC 6925
Advance Information

89HPES8NT2ZABX相似产品对比

89HPES8NT2ZABX 89HPES8NT2ZABCG8 89HPES8NT2ZABC8 89HPES8NT2ZABXG
描述 PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, CABGA-324 Bus Controller, PBGA324 Bus Controller, PBGA324 PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, GREEN, CABGA-324
是否Rohs认证 不符合 符合 不符合 符合
Reach Compliance Code compliant compliant not_compliant compliant
JESD-30 代码 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324
JESD-609代码 e0 e1 e0 e1
湿度敏感等级 3 3 3 3
端子数量 324 324 324 324
最高工作温度 70 °C 70 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LBGA BGA BGA LBGA
封装形状 SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY, LOW PROFILE GRID ARRAY GRID ARRAY GRID ARRAY, LOW PROFILE
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 YES YES YES YES
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) TIN SILVER COPPER
端子形式 BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM
Base Number Matches 1 1 1 -
厂商名称 - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
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