Fast Page DRAM, 256KX1, 100ns, CMOS, CDFP16, FP-16
参数名称 | 属性值 |
零件包装代码 | DFP |
包装说明 | DFP, |
针数 | 16 |
Reach Compliance Code | compliant |
Is Samacsys | N |
访问模式 | FAST PAGE |
最长访问时间 | 100 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
JESD-30 代码 | R-CDFP-F16 |
内存密度 | 262144 bit |
内存集成电路类型 | FAST PAGE DRAM |
内存宽度 | 1 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 16 |
字数 | 262144 words |
字数代码 | 256000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 256KX1 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
筛选级别 | MIL-STD-883 |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | FLAT |
端子位置 | DUAL |
Base Number Matches | 1 |
AS4C1259F-10/883C | AS4C1259F-15/883C | AS4C1259C-15/883C | AS4C1259C-10/883C | AS4C1259EC-12/883C | AS4C1259C-12/883C | AS4C1259EC-10/883C | AS4C1259F-12/883C | AS4C1259EC-15/883C | |
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描述 | Fast Page DRAM, 256KX1, 100ns, CMOS, CDFP16, FP-16 | Fast Page DRAM, 256KX1, 150ns, CMOS, CDFP16, FP-16 | Fast Page DRAM, 256KX1, 150ns, CMOS, CDIP16, DIP-16 | Fast Page DRAM, 256KX1, 100ns, CMOS, CDIP16, DIP-16 | Fast Page DRAM, 256KX1, 120ns, CMOS, CQCC18, CERAMIC, LCC-18 | Fast Page DRAM, 256KX1, 120ns, CMOS, CDIP16, DIP-16 | Fast Page DRAM, 256KX1, 100ns, CMOS, CQCC18, CERAMIC, LCC-18 | Fast Page DRAM, 256KX1, 120ns, CMOS, CDFP16, FP-16 | Fast Page DRAM, 256KX1, 150ns, CMOS, CQCC18, CERAMIC, LCC-18 |
零件包装代码 | DFP | DFP | DIP | DIP | LCC | DIP | LCC | DFP | LCC |
包装说明 | DFP, | DFP, | DIP, | DIP-16 | QCCN, LCC18,.3X.5 | DIP, | QCCN, LCC18,.3X.5 | DFP, | CERAMIC, LCC-18 |
针数 | 16 | 16 | 16 | 16 | 18 | 16 | 18 | 16 | 18 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
最长访问时间 | 100 ns | 150 ns | 150 ns | 100 ns | 120 ns | 120 ns | 100 ns | 120 ns | 150 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
JESD-30 代码 | R-CDFP-F16 | R-CDFP-F16 | R-CDIP-T16 | R-CDIP-T16 | R-CQCC-N18 | R-CDIP-T16 | R-CQCC-N18 | R-CDFP-F16 | R-CQCC-N18 |
内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 | 18 | 16 | 18 | 16 | 18 |
字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
组织 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DFP | DFP | DIP | DIP | QCCN | DIP | QCCN | DFP | QCCN |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | FLATPACK | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | FLATPACK | CHIP CARRIER |
筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | NO | YES | NO | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD | FLAT | NO LEAD |
端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD | DUAL | QUAD |
Is Samacsys | N | N | N | N | N | N | N | - | - |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
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