Operating Temperature Range .................– 40°C to 85°C
Storage Temperature Range .................. –65°C to 150°C
GND
LS8 PACKAGE
8-PIN LEADLESS CHIP CARRIER (5mm
×
5mm)
*CONNECTED INTERNALLY.
D0 NOT CONNECT EXTERNAL
CIRCUITRY TO THESE PINS
**SEE APPLICATIONS
INFORMATION SECTION
T
JMAX
= 125°C,
θ
JA
= 120°C/W
PACKAGE LID IS GND
orDer inForMaTion
LEAD FREE FINISH
LT1236AILS8-5#PBF
†
LT1236BILS8-5#PBF
†
PART MARKING*
12365
12365
PACKAGE DESCRIPTION
8-Lead Ceramic LCC 5mm
×
5mm
8-Lead Ceramic LCC 5mm
×
5mm
SPECIFIED TEMPERATURE RANGE
–40°C to 85°C
–40°C to 85°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
†
This product is only offered in trays. For more information go to:
http://www.linear.com/packaging/
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. V
IN
= 10V, I
OUT
= 0, unless otherwise noted.
LT1236LS8-5
PARAMETER
Output Voltage (Note 2)
Output Voltage Temperature Coefficient (Note 3)
Line Regulation (Note 4)
CONDITIONS
LT1236ALS8
LT1236BLS8
LT1236ALS8
LT1236BLS8
7.2V ≤ V
IN
≤ 10V
l
elecTrical characTerisTics
MIN
4.9975
4.9950
TYP
5.000
5.000
2
5
4
2
MAX
5.0025
5.0050
5
10
12
20
6
10
25
40
UNITS
V
V
ppm/°C
ppm/°C
ppm/V
ppm/V
ppm/V
ppm/V
ppm/mA
ppm/mA
10V ≤ V
IN
≤ 40V
l
Load Regulation (Sourcing Current)
(Note 4)
0 ≤ I
OUT
≤ 10mA
l
15
1236ls8f
2
LT1236LS8
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. V
IN
= 10V, I
OUT
= 0, unless otherwise noted.
LT1236LS8-5
PARAMETER
Load Regulation (Sinking Current)
(Note 4)
Supply Current
l
elecTrical characTerisTics
CONDITIONS
0 ≤ I
OUT
≤ 10mA
l
MIN
TYP
60
0.8
MAX
100
150
1.2
1.5
3.5
UNITS
ppm/mA
ppm/mA
mA
mA
µV
P-P
µV
RMS
ppm
ppm
ppm
ppm
Output Voltage Noise
(Note 5)
Long-Term Stability of Output Voltage (Note 6)
Temperature Hysteresis of Output (Note 7)
0.1Hz ≤ f ≤ 10Hz
10Hz ≤ f ≤ 1kHz
∆t = 1000Hrs Non-Cumulative
∆T = ±25°C
∆T = 0°C to 70°C
∆T = –40°C to 85°C
3.0
2.2
20
3
8
60
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2:
Output voltage is measured immediately after turn-on. Changes
due to chip warm-up are typically less than 0.005%.
Note 3:
Temperature coefficient is measured by dividing the change in
output voltage over the temperature range by the change in temperature.
Incremental slope is also measured at 25°C.
Note 4:
Line and load regulation are measured on a pulse basis. Output
changes due to die temperature change must be taken into account
separately.
Note 5:
RMS noise is measured with a 2-pole highpass filter at 10Hz and a
2-pole lowpass filter at 1kHz. The resulting output is full-wave rectified and
then integrated for a fixed period, making the final reading an average as
opposed to RMS. Correction factors are used to convert from average to
RMS, and 0.88 is used to correct for the non-ideal bandbass of the filters.
Peak-to-peak noise is measured with a single highpass filter at 0.1Hz and a
2-pole lowpass filter at 10Hz. The unit is enclosed in a still-air environment
to eliminate thermocouple effects on the leads. Test time is 10 seconds.
Note 6:
Long-term stability typically has a logarithmic characteristic and
therefore, changes after 1000 hours tend to be much smaller than before
that time. Total drift in the second thousand hours is normally less than
one third that of the first thousand hours, with a continuing trend toward
reduced drift with time. Significant improvement in long-term drift can
be realized by preconditioning the IC with a 100-200 hour, 125°C burn in.
Long term stability will also be affected by differential stresses between
the IC and the board material created during board assembly. Temperature
cycling and baking of completed boards is often used to reduce these
stresses in critical applications.
Note 7:
Hysteresis in output voltage is created by package stress that
differs depending on whether the IC was previously at a higher or lower
temperature. Output voltage is always measured at 25°C, but the IC is
cycled to high or low temperature before successive measurements.
Hysteresis is roughly proportional to the square of temperature change.
Hysteresis is not normally a problem for operational temperature
excursions, but can be significant in critical narrow temperature range
applications where the instrument might be stored at high or low
temperatures. Hysteresis measurements are preconditioned by one
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