256KX16 STANDARD SRAM, 70ns, PBGA48, GREEN, BGA-48
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | BGA |
| 包装说明 | LFBGA, |
| 针数 | 48 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A991.B.2.A |
| Is Samacsys | N |
| 最长访问时间 | 70 ns |
| JESD-30 代码 | R-PBGA-B48 |
| JESD-609代码 | e1 |
| 长度 | 8 mm |
| 内存密度 | 4194304 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 48 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 256KX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFBGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.34 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.3 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.75 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 6 mm |
| Base Number Matches | 1 |
| N04L163WC2AB2-70I | N04L163WC2AB-70I | N04L163WC2AT-55I | N04L163WC2AB-55I | N04L163WC2AB2-55I | N04L163WC2AT2-55I | |
|---|---|---|---|---|---|---|
| 描述 | 256KX16 STANDARD SRAM, 70ns, PBGA48, GREEN, BGA-48 | 256KX16 STANDARD SRAM, 70ns, PBGA48, BGA-48 | 256KX16 STANDARD SRAM, 70ns, PDSO44, TSOP2-44 | 256KX16 STANDARD SRAM, 70ns, PBGA48, BGA-48 | IC 256K X 16 STANDARD SRAM, 70 ns, PBGA48, GREEN, BGA-48, Static RAM | 256KX16 STANDARD SRAM, 70ns, PDSO44, GREEN, TSOP2-44 |
| 零件包装代码 | BGA | BGA | TSOP2 | BGA | BGA | TSOP2 |
| 包装说明 | LFBGA, | BGA-48 | LSSOP, | LFBGA, | LFBGA, | LSSOP, |
| 针数 | 48 | 48 | 44 | 48 | 48 | 44 |
| Reach Compliance Code | unknown | not_compliant | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| Is Samacsys | N | N | N | N | N | N |
| 最长访问时间 | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns |
| JESD-30 代码 | R-PBGA-B48 | R-PBGA-B48 | R-PDSO-G44 | R-PBGA-B48 | R-PBGA-B48 | R-PDSO-G44 |
| 长度 | 8 mm | 8 mm | 18.41 mm | 8 mm | 8 mm | 18.41 mm |
| 内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 48 | 48 | 44 | 48 | 48 | 44 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | LFBGA | LSSOP | LFBGA | LFBGA | LSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.34 mm | 1.34 mm | 1.25 mm | 1.34 mm | 1.34 mm | 1.25 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | BALL | GULL WING | BALL | BALL | GULL WING |
| 端子节距 | 0.75 mm | 0.75 mm | 0.8 mm | 0.75 mm | 0.75 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | DUAL | BOTTOM | BOTTOM | DUAL |
| 宽度 | 6 mm | 6 mm | 10.16 mm | 6 mm | 6 mm | 10.16 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| JESD-609代码 | e1 | - | e0 | e0 | e1 | - |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | - | TIN LEAD | TIN LEAD | TIN SILVER COPPER | - |
开关电源学习小组
微控制器 MCU
聊聊、笑笑、闹闹
汽车电子
嵌入式系统
工作这点儿事
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
