EMS12GHB-50.000M
REGULATORY COMPLIANCE
2011/65 +
2015/863
(Data Sheet downloaded on Aug 25, 2020)
191 SVHC
ITEM DESCRIPTION
Spread Spectrum MEMS Clock Oscillators LVCMOS (CMOS) 2.5Vdc 4 Pad 5.0mm x 7.0mm Plastic Surface Mount (SMD)
50.000MHz ±100ppm Maximum over -40°C to +85°C Tri-State ±0.50% Center Spread
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
50.000MHz
±100ppm Maximum over -40°C to +85°C (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability
over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C,
260°C Reflow, Shock, and Vibration)
±1ppm Maximum First Year
2.5Vdc ±10%
-0.5Vdc to +3.65Vdc
35mA Maximum (Unloaded; Nominal Vdd)
90% of Vdd Minimum (IOH=-8mA)
10% of Vdd Maximum (IOL=+8mA)
2nSec Maximum (Measured from 20% to 80% of waveform)
50 ±5(%) (Measured at 50% of waveform)
15pF Maximum
CMOS
Tri-State (Disabled Output High Impedance)
70% of Vdd Minimum or No Connection to Enable Output, 30% of Vdd Maximum to Disable Output
20mA Maximum (Disabled Output: High Impedance) (Pad 1=Ground)
±0.50% Center Spread
30kHz Minimum, 32kHz Typical, 35kHz Maximum
40pSec Maximum (Cycle to Cycle; Spread Spectrum-On; Fo=133.333M, Vdd=2.5Vdc)
10mSec Maximum
-55°C to +125°C
Aging at 25°C
Supply Voltage
Maximum Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Output Control Function
Tri-State Input Voltage (Vih and Vil)
Disable Current
Spread Spectrum
Modulation Frequency
Period Jitter
Start Up Time
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Flammability
Mechanical Shock
Moisture Resistance
Moisture Sensitivity Level
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Thermal Shock
Vibration
MIL-STD-883, Method 3015, Class 2, HBM 2000V
UL94-V0
MIL-STD-883, Method 2002, Condition G, 30,000G
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003 (Four I/O Pads on bottom of package only)
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 1011, Condition B
MIL-STD-883, Method 2007, Condition A, 20G
www.ecliptek.com | Specification Subject to Change Without Notice | Revision E 08/20/2012 | Page 1 of 6
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EMS12GHB-50.000M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
CONNECTION
Tri-State (High
Impedance)
Ground
Output
Supply Voltage
5.00
±0.15
0.85
±0.15
0.08
MAX
4
5.08
±0.10
3
R0.70 ±0.10
2.60 ±0.15
1.20 ±0.10 (x4)
2.1
1
C0.25 ±0.10
1
2
3
4
MARKING
ORIENTATION
7.00
±0.15
A
2
1.70
LINE MARKING
1
XXXX or XXXXX
XXXX or XXXXX=Ecliptek
Manufacturing Identifier
1.40
±0.10 (x4)
Note A: Center paddle is connected
internally to oscillator ground (Pad 2).
Suggested Solder Pad Layout
All Dimensions in Millimeters
2.0 (X4)
2.2 (X4)
2.88
Solder Land
(X4)
1.81
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Revision E 08/20/2012 | Page 2 of 6
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EMS12GHB-50.000M
Test Circuit for CMOS Output
Oscilloscope
Frequency
Counter
+
+
Power
Supply
_
+
Voltage
Meter
_
Current
Meter
_
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
0.01µF
(Note 1)
0.1µF
(Note 1)
Ground
C
L
(Note 3)
Tri-State or
Power Down or
Spread Disable
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass
capacitor close (less than 2mm) to the package ground and supply voltage pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value C
L
includes sum of all probe and fixture capacitance.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision E 08/20/2012 | Page 4 of 6
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EMS12GHB-50.000M
Recommended Solder Reflow Methods
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/Second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/Second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 Seconds
6°C/Second Maximum
8 Minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Revision E 08/20/2012 | Page 5 of 6
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
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