5962F0254601VPA放大器基础信息:
5962F0254601VPA是一款OPERATIONAL AMPLIFIER。常用的包装方式为DIP,
5962F0254601VPA放大器核心信息:
其峰值回流温度为NOT SPECIFIED
5962F0254601VPA的宽度为:7.62 mm。
5962F0254601VPA的相关尺寸:
5962F0254601VPA拥有8个端子.其端子位置类型为:DUAL。端子节距为2.54 mm。
5962F0254601VPA放大器其他信息:
其温度等级为:MILITARY。5962F0254601VPA不符合Rohs认证。其对应的的JESD-30代码为:R-GDIP-T8。其对应的的JESD-609代码为:e0。5962F0254601VPA的封装代码是:DIP。
5962F0254601VPA封装的材料多为CERAMIC, GLASS-SEALED。而其封装形状为RECTANGULAR。5962F0254601VPA封装引脚的形式有:IN-LINE。其端子形式有:THROUGH-HOLE。座面最大高度为5.08 mm。
5962F0254601VPA放大器基础信息:
5962F0254601VPA是一款OPERATIONAL AMPLIFIER。常用的包装方式为DIP,
5962F0254601VPA放大器核心信息:
其峰值回流温度为NOT SPECIFIED
5962F0254601VPA的宽度为:7.62 mm。
5962F0254601VPA的相关尺寸:
5962F0254601VPA拥有8个端子.其端子位置类型为:DUAL。端子节距为2.54 mm。
5962F0254601VPA放大器其他信息:
其温度等级为:MILITARY。5962F0254601VPA不符合Rohs认证。其对应的的JESD-30代码为:R-GDIP-T8。其对应的的JESD-609代码为:e0。5962F0254601VPA的封装代码是:DIP。
5962F0254601VPA封装的材料多为CERAMIC, GLASS-SEALED。而其封装形状为RECTANGULAR。5962F0254601VPA封装引脚的形式有:IN-LINE。其端子形式有:THROUGH-HOLE。座面最大高度为5.08 mm。
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor(TI ) |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| JESD-30 代码 | R-GDIP-T8 |
| JESD-609代码 | e0 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class V |
| 座面最大高度 | 5.08 mm |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 总剂量 | 300k Rad(Si) V |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962F0254601VPA | LMH6702WG-QMLV | LMH6702J-QMLV | 5962F0254601VZA | 5962-0254601VZA | 5962-0254601VPA | |
|---|---|---|---|---|---|---|
| 描述 | IC 1 CHANNEL, VIDEO AMPLIFIER, CDIP8, CERAMIC, DIP-8, Audio/Video Amplifier | IC 1 CHANNEL, VIDEO AMPLIFIER, CDSO10, CERAMIC, SOIC-10, Audio/Video Amplifier | IC 1 CHANNEL, VIDEO AMPLIFIER, CDIP8, CERAMIC, DIP-8, Audio/Video Amplifier | IC 1 CHANNEL, VIDEO AMPLIFIER, CDSO10, CERAMIC, SOIC-10, Audio/Video Amplifier | IC 1 CHANNEL, VIDEO AMPLIFIER, CDSO10, CERAMIC, SOIC-10, Audio/Video Amplifier | IC 1 CHANNEL, VIDEO AMPLIFIER, CDIP8, CERAMIC, DIP-8, Audio/Video Amplifier |
| 厂商名称 | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
| 包装说明 | DIP, | SOP, | DIP, | SOP, | SOP, | DIP, |
| Reach Compliance Code | unknown | not_compliant | not_compliant | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Is Samacsys | N | N | N | N | N | N |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| JESD-30 代码 | R-GDIP-T8 | R-GDSO-G10 | R-GDIP-T8 | R-GDSO-G10 | R-GDSO-G10 | R-GDIP-T8 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 10 | 8 | 10 | 10 | 8 |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | SOP | DIP | SOP | SOP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V |
| 座面最大高度 | 5.08 mm | 2.33 mm | 5.08 mm | 2.33 mm | 2.33 mm | 5.08 mm |
| 表面贴装 | NO | YES | NO | YES | YES | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn/Pb) - hot dipped | TIN LEAD | TIN LEAD |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 6.12 mm | 7.62 mm | 6.12 mm | 6.12 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | - |
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