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MMSZ5250ET1

产品描述Zener Voltage Regulators 500 mW SOD−123 Surface Mount
产品类别分立半导体    二极管   
文件大小73KB,共6页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
下载文档 详细参数 全文预览

MMSZ5250ET1概述

Zener Voltage Regulators 500 mW SOD−123 Surface Mount

MMSZ5250ET1规格参数

参数名称属性值
Brand NameON Semiconduc
是否无铅含铅
厂商名称ON Semiconductor(安森美)
包装说明PLASTIC, CASE 425-04, 2 PIN
针数2
制造商包装代码425-04
Reach Compliance Code_compli
ECCN代码EAR99
Is SamacsysN
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
最大动态阻抗25 Ω
JESD-30 代码R-PDSO-G2
JESD-609代码e0
元件数量1
端子数量2
最高工作温度150 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)240
极性UNIDIRECTIONAL
最大功率耗散0.5 W
认证状态Not Qualified
标称参考电压20 V
表面贴装YES
技术ZENER
端子面层Tin/Lead (Sn80Pb20)
端子形式GULL WING
端子位置DUAL
处于峰值回流温度下的最长时间30
最大电压容差5%
工作测试电流6.2 mA
Base Number Matches1

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下载PDF文档
MMSZ5221ET1 Series
Preferred Device
Zener Voltage Regulators
500 mW SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
Features
http://onsemi.com
500 mW Rating on FR−4 or FR−5 Board
Wide Zener Reverse Voltage Range − 2.4 V to 110 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
General Purpose, Medium Current
ESD Rating of Class 3 (>16 kV) per Human Body Model
Peak Power − 225 W (8
x
20
ms)
Pb−Free Packages are Available
1
Cathode
2
Anode
2
1
SOD−123
CASE 425
STYLE 1
Mechanical Characteristics:
CASE:
Void-free, transfer-molded, thermosetting plastic case
FINISH:
Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
MARKING DIAGRAM
260°C for 10 Seconds
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
MAXIMUM RATINGS
Rating
Peak Power Dissipation @ 20
ms
(Note 1)
@ T
L
25°C
Total Power Dissipation on FR−5 Board,
(Note 3) @ T
L
= 75°C
Derated above 75°C
Thermal Resistance, (Note 2)
Junction−to−Ambient
Thermal Resistance, (Note 2)
Junction−to−Lead
Junction and Storage Temperature Range
Symbol
P
pk
P
D
500
6.7
R
qJA
R
qJL
T
J
, T
stg
340
150
−55 to
+150
mW
mW/°C
°C/W
Device
MMSZ52xxET1
Max
225
Unit
W
1
xxx M
G
G
xxx = Device Code (Refer to page 2)
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Package
SOD−123
SOD−123
(Pb−Free)
SOD−123
SOD−123
(Pb−Free)
Shipping
3000/Tape & Reel
3000/Tape & Reel
10000/Tape & Reel
10000/Tape & Reel
MMSZ52xxET1G
°C/W
MMSZ52xxET3
°C
MMSZ52xxET3G
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Nonrepetitive current pulse per Figure 11.
2. Thermal Resistance measurement obtained via infrared Scan Method.
3. FR−5 = 3.5 x 1.5 inches, using the minimum recommended footprint.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
Devices listed in
bold, italic
are ON Semiconductor
Preferred
devices.
Preferred
devices are recommended
choices for future use and best overall value.
©
Semiconductor Components Industries, LLC, 2006
1
March, 2006 − Rev. 6
Publication Order Number:
MMSZ5221ET1/D
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