32-BIT, FLASH, 132 MHz, MICROCONTROLLER, PBGA416
32位, FLASH, 132 MHz, 单片机, PBGA416
| 参数名称 | 属性值 |
| 功能数量 | 1 |
| 端子数量 | 416 |
| 最大工作温度 | 125 Cel |
| 最小工作温度 | -40 Cel |
| 最大供电/工作电压 | 1.65 V |
| 最小供电/工作电压 | 1.35 V |
| 额定供电电压 | 1.5 V |
| 外部数据总线宽度 | 32 |
| 线速度 | 132 MHz |
| 加工封装描述 | 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, BGA-416 |
| 状态 | ACTIVE |
| 工艺 | CMOS |
| 包装形状 | SQUARE |
| 包装尺寸 | GRID ARRAY |
| 表面贴装 | Yes |
| 端子形式 | BALL |
| 端子间距 | 1 mm |
| 端子涂层 | TIN SILVER COPPER |
| 端子位置 | BOTTOM |
| 包装材料 | PLASTIC/EPOXY |
| 温度等级 | AUTOMOTIVE |
| ADC通道 | Yes |
| 地址总线宽度 | 24 |
| 位数 | 32 |
| 最大FCLK时钟频率 | 20 MHz |
| 微处理器类型 | MICROCONTROLLER |
| PWM通道 | Yes |
| ROM编程 | FLASH |
| MPC5553MVR80 | MPC5553MVR132 | MPC5553_07 | MPC5553MZQ80 | MPC5553MVZ132 | |
|---|---|---|---|---|---|
| 描述 | 32-BIT, FLASH, 132 MHz, MICROCONTROLLER, PBGA416 | 32-BIT, FLASH, 132 MHz, MICROCONTROLLER, PBGA416 | 32-BIT, FLASH, 132 MHz, MICROCONTROLLER, PBGA416 | 32-BIT, FLASH, 80MHz, MICROCONTROLLER, PBGA324, 23 X 23 MM, 1 MM PITCH, PLASTIC, MS-034AAJ-1, BGA-324 | 32-BIT, FLASH, 132 MHz, MICROCONTROLLER, PBGA324 |
| 端子数量 | 416 | 416 | 416 | 324 | 324 |
| 外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 |
| 表面贴装 | Yes | Yes | Yes | YES | Yes |
| 端子形式 | BALL | BALL | BALL | BALL | BALL |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 地址总线宽度 | 24 | 24 | 24 | 24 | 24 |
| 功能数量 | 1 | 1 | 1 | - | 1 |
| 最大工作温度 | 125 Cel | 125 Cel | 125 Cel | - | 125 Cel |
| 最小工作温度 | -40 Cel | -40 Cel | -40 Cel | - | -40 Cel |
| 最大供电/工作电压 | 1.65 V | 1.65 V | 1.65 V | - | 1.65 V |
| 最小供电/工作电压 | 1.35 V | 1.35 V | 1.35 V | - | 1.35 V |
| 额定供电电压 | 1.5 V | 1.5 V | 1.5 V | - | 1.5 V |
| 线速度 | 132 MHz | 132 MHz | 132 MHz | - | 132 MHz |
| 加工封装描述 | 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, BGA-416 | 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, BGA-416 | 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, BGA-416 | - | 23 X 23 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAJ-1, BGA-324 |
| 状态 | ACTIVE | ACTIVE | ACTIVE | - | ACTIVE |
| 工艺 | CMOS | CMOS | CMOS | - | CMOS |
| 包装形状 | SQUARE | SQUARE | SQUARE | - | SQUARE |
| 包装尺寸 | GRID ARRAY | GRID ARRAY | GRID ARRAY | - | GRID ARRAY |
| 端子间距 | 1 mm | 1 mm | 1 mm | - | 1 mm |
| 端子涂层 | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | - | TIN SILVER COPPER |
| 包装材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| ADC通道 | Yes | Yes | Yes | - | Yes |
| 位数 | 32 | 32 | 32 | - | 32 |
| 最大FCLK时钟频率 | 20 MHz | 20 MHz | 20 MHz | - | 20 MHz |
| 微处理器类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | - | MICROCONTROLLER |
| PWM通道 | Yes | Yes | Yes | - | Yes |
| ROM编程 | FLASH | FLASH | FLASH | - | FLASH |
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