MASK ROM, 256KX8, 150ns, CMOS, PDSO48, 12 X 18 MM, PLASTIC, REVERSE, TSOP1-48
| 参数名称 | 属性值 |
| 厂商名称 | SHARP |
| 包装说明 | 12 X 18 MM, PLASTIC, REVERSE, TSOP1-48 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 最长访问时间 | 150 ns |
| JESD-30 代码 | R-PDSO-G48 |
| 内存密度 | 2097152 bit |
| 内存集成电路类型 | MASK ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 48 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.6 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| LH532000BTR-S | LH532000BT-S | LH532000BD-S | LH532000BN-S | |
|---|---|---|---|---|
| 描述 | MASK ROM, 256KX8, 150ns, CMOS, PDSO48, 12 X 18 MM, PLASTIC, REVERSE, TSOP1-48 | MASK ROM, 256KX8, 150ns, CMOS, PDSO48, 12 X 18 MM, PLASTIC, TSOP1-48 | MASK ROM, 256KX8, 150ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | MASK ROM, 256KX8, 150ns, CMOS, PDSO40, 0.525 INCH, PLASTIC, SOP-40 |
| 包装说明 | 12 X 18 MM, PLASTIC, REVERSE, TSOP1-48 | 12 X 18 MM, PLASTIC, TSOP1-48 | 0.600 INCH, PLASTIC, DIP-40 | 0.525 INCH, PLASTIC, SOP-40 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 最长访问时间 | 150 ns | 150 ns | 150 ns | 150 ns |
| JESD-30 代码 | R-PDSO-G48 | R-PDSO-G48 | R-PDIP-T40 | R-PDSO-G40 |
| 内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| 内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| 内存宽度 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 48 | 48 | 40 | 40 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | DIP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.6 V | 2.6 V | 2.6 V | 2.6 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | SHARP | - | SHARP | SHARP |
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