74AHC(T)2G241 - Dual buffer/line driver; 3-state SON 8-Pin
| 参数名称 | 属性值 |
| Brand Name | Nexperia |
| 厂商名称 | Nexperia |
| 零件包装代码 | SON |
| 包装说明 | 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT-996-2, UTLP-8 |
| 针数 | 8 |
| 制造商包装代码 | SOT996-2 |
| Reach Compliance Code | compliant |
| Is Samacsys | N |
| Base Number Matches | 1 |
| 74AHC2G241GD,125 | 74AHC2G241DC,125 | 74AHC2G241DP,125 | |
|---|---|---|---|
| 描述 | 74AHC(T)2G241 - Dual buffer/line driver; 3-state SON 8-Pin | 74AHC(T)2G241 - Dual buffer/line driver; 3-state SSOP 8-Pin | 74AHC(T)2G241 - Dual buffer/line driver; 3-state TSSOP 8-Pin |
| Brand Name | Nexperia | Nexperia | Nexperia |
| 厂商名称 | Nexperia | Nexperia | Nexperia |
| 零件包装代码 | SON | SSOP | TSSOP |
| 包装说明 | 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT-996-2, UTLP-8 | VSSOP, | TSSOP, |
| 针数 | 8 | 8 | 8 |
| 制造商包装代码 | SOT996-2 | SOT765-1 | SOT505-2 |
| Reach Compliance Code | compliant | compliant | compliant |
| Is Samacsys | N | N | N |
| Base Number Matches | 1 | 1 | 1 |
| Samacsys Confidence | - | 2 | 2 |
| Samacsys Status | - | Released | Released |
| Samacsys PartID | - | 4691856 | 4691832 |
| Samacsys Pin Count | - | 8 | 8 |
| Samacsys Part Category | - | Integrated Circuit | Integrated Circuit |
| Samacsys Package Category | - | Small Outline Packages | Small Outline Packages |
| Samacsys Footprint Name | - | SOT765-1 | SOT505-2 |
| Samacsys Released Date | - | 2019-11-04 20:21:44 | 2019-11-04 20:21:44 |
| 系列 | - | AHC/VHC/H/U/V | AHC/VHC/H/U/V |
| JESD-30 代码 | - | R-PDSO-G8 | S-PDSO-G8 |
| JESD-609代码 | - | e4 | e4 |
| 长度 | - | 2.3 mm | 3 mm |
| 逻辑集成电路类型 | - | BUS DRIVER | BUS DRIVER |
| 湿度敏感等级 | - | 1 | 1 |
| 位数 | - | 1 | 1 |
| 功能数量 | - | 2 | 2 |
| 端口数量 | - | 2 | 2 |
| 端子数量 | - | 8 | 8 |
| 最高工作温度 | - | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | -40 °C |
| 输出特性 | - | 3-STATE | 3-STATE |
| 输出极性 | - | TRUE | TRUE |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | VSSOP | TSSOP |
| 封装形状 | - | RECTANGULAR | SQUARE |
| 封装形式 | - | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | - | 260 | 260 |
| 传播延迟（tpd） | - | 14.5 ns | 14.5 ns |
| 认证状态 | - | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1 mm | 1.1 mm |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 2 V | 2 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V |
| 表面贴装 | - | YES | YES |
| 技术 | - | CMOS | CMOS |
| 温度等级 | - | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | - | GULL WING | GULL WING |
| 端子节距 | - | 0.5 mm | 0.65 mm |
| 端子位置 | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | 30 | 30 |
| 宽度 | - | 2 mm | 3 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
