IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CQCC20, CERAMIC, LCC-20, Multiplexer or Switch
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | QLCC |
| 包装说明 | CERAMIC, LCC-20 |
| 针数 | 20 |
| Reach Compliance Code | compliant |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | S-CQCC-N20 |
| JESD-609代码 | e4 |
| 长度 | 8.89 mm |
| 信道数量 | 1 |
| 功能数量 | 4 |
| 端子数量 | 20 |
| 标称断态隔离度 | 72 dB |
| 通态电阻匹配规范 | 3 Ω |
| 最大通态电阻 (Ron) | 50 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.54 mm |
| 最大供电电流 (Isup) | 10 mA |
| 表面贴装 | YES |
| 最长断开时间 | 50 ns |
| 最长接通时间 | 50 ns |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | GOLD |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| 5962-86716012C | 5962-8671601EC | 5962-8671601EB | 5962-8671601EA | 5962-86716012A | 5962-86716012B | |
|---|---|---|---|---|---|---|
| 描述 | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CQCC20, CERAMIC, LCC-20, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP16, CERDIP-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP16, CERDIP-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP16, CERDIP-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CQCC20, CERAMIC, LCC-20, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, CQCC20, CERAMIC, LCC-20, Multiplexer or Switch |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | QLCC | DIP | DIP | DIP | QLCC | QLCC |
| 包装说明 | CERAMIC, LCC-20 | CERDIP-16 | CERDIP-16 | CERDIP-16 | CERAMIC, LCC-20 | CERAMIC, LCC-20 |
| 针数 | 20 | 16 | 16 | 16 | 20 | 20 |
| Reach Compliance Code | compliant | compli | compli | compli | compliant | compliant |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST | SPST |
| JESD-30 代码 | S-CQCC-N20 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | S-CQCC-N20 | S-CQCC-N20 |
| JESD-609代码 | e4 | e4 | e0 | e0 | e0 | e0 |
| 长度 | 8.89 mm | 19.05 mm | 19.05 mm | 19.05 mm | 8.89 mm | 8.89 mm |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 20 | 16 | 16 | 16 | 20 | 20 |
| 标称断态隔离度 | 72 dB | 72 dB | 72 dB | 72 dB | 72 dB | 72 dB |
| 通态电阻匹配规范 | 3 Ω | 3 Ω | 3 Ω | 3 Ω | 3 Ω | 3 Ω |
| 最大通态电阻 (Ron) | 50 Ω | 50 Ω | 50 Ω | 50 Ω | 50 Ω | 50 Ω |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | DIP | DIP | DIP | QCCN | QCCN |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 220 | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.54 mm | 5.08 mm | 5.08 mm | 5.08 mm | 2.54 mm | 2.54 mm |
| 最大供电电流 (Isup) | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA |
| 表面贴装 | YES | NO | NO | NO | YES | YES |
| 最长断开时间 | 50 ns | 50 ns | 50 ns | 50 ns | 50 ns | 50 ns |
| 最长接通时间 | 50 ns | 50 ns | 50 ns | 50 ns | 50 ns | 50 ns |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | GOLD | GOLD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED |
| 宽度 | 8.89 mm | 7.62 mm | 7.62 mm | 7.62 mm | 8.89 mm | 8.89 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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