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MX1N5768

产品描述Trans Voltage Suppressor Diode, Unidirectional, 8 Element, Silicon, HERMETIC SEALED, CERAMIC, DFP-10
产品类别分立半导体    二极管   
文件大小79KB,共2页
制造商Microsemi
官网地址https://www.microsemi.com
下载文档 详细参数 选型对比 全文预览

MX1N5768概述

Trans Voltage Suppressor Diode, Unidirectional, 8 Element, Silicon, HERMETIC SEALED, CERAMIC, DFP-10

MX1N5768规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
零件包装代码DFP
包装说明R-CDFP-F10
针数10
Reach Compliance Codecompliant
ECCN代码EAR99
Is SamacsysN
其他特性HIGH RELIABILITY, LOW CAPACITANCE
最小击穿电压60 V
配置COMMON ANODE, 8 ELEMENTS
二极管元件材料SILICON
二极管类型TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码R-CDFP-F10
JESD-609代码e0
元件数量8
端子数量10
最高工作温度150 °C
最低工作温度-65 °C
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装形状RECTANGULAR
封装形式FLATPACK
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散0.5 W
认证状态Not Qualified
参考标准MIL-19500/474
表面贴装YES
技术AVALANCHE
端子面层TIN LEAD
端子形式FLAT
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
Base Number Matches1

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1N5768
Isolated Diode Array with
HiRel MQ, MX, MV, and MSP Screening Options
SCOTTSDALE DIVISION
DESCRIPTION
These low capacitance diode arrays with common cathode are multiple, discrete, isolated
junctions fabricated by a planar process and mounted in a 10-PIN package for use as
steering diodes protecting up to eight I/O ports from ESD, EFT, or surge by directing
them to the positive side of the power supply line (see figure 1). This circuit application is
further complimented by the 1N5770 (separate data sheet) that has a common anode.
An external TVS diode may be added between the positive supply line and ground to
prevent overvoltage on the supply rail. They may also be used in fast switching core-
driver applications. This includes computers and peripheral equipment such as magnetic
cores, thin-film memories, plated-wire memories, etc., as well as decoding or encoding
applications. These arrays offer many advantages of integrated circuits such as high-
density packaging and improved reliability. This is a result of fewer pick and place
operations, smaller footprint, smaller weight, and elimination of various discrete
packages that may not be as user friendly in PC board mounting.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
10-PIN Ceramic
Flat Pack
FEATURES
Hermetic Ceramic Package
Isolated Diodes To Eliminate Cross-Talk Voltages
High Breakdown Voltage V
BR
> 60 V at 10
μA
Low Leakage I
R
< 100nA at 40 V
Low Capacitance C < 4.0 pF
Options for screening in accordance with MIL-PRF-
19500/474 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers. For example, designate
MX1N5768 for a JANTX screen.
APPLICATIONS / BENEFITS
High Frequency Data Lines
RS-232 & RS-422 Interface Networks
Ethernet: 10 Base T
Computer I/O Ports
LAN
Switching Core Drivers
IEC 61000-4 Compatible (see circuit in figure 1)
61000-4-2 ESD : Air 15kV, contact 8kW
61000-4-4 (EFT) : 40A – 5/50 ns
61000-4-5 (surge): 12A 8/20
μs
MAXIMUM RATINGS
V
BR
Reverse Breakdown Voltage 60 V min (Notes 1 & 2)
I
O
Continuous Forward Current 300 mA (Notes 1 & 3)
I
FSM
Forward Surge Current (tp=1/120 s) 500 mA (Note 1)
o
400 mW Power Dissipation per Junction @ 25 C
500 mW Power Dissipation per Package @ 25
o
C (Note 4)
o
Operating Junction Temperature range –65 to +150 C
Storage Temperature range of –65 to +200
o
C
NOTE 1:
NOTE 2:
NOTE 3:
NOTE 4:
Each Diode
Pulsed: P
W
= 100 ms max; duty cycle <20%
o
o
Derate at 2.4 mA/ C above +25 C
o
o
Derate at 4.0 mW/ C above +25 C
MECHANICAL AND PACKAGING
10-PIN Ceramic Flat Pack
Weight 0.25 grams (approximate)
Marking: Logo, part number, date code and dot
identifying pin #1
Carrier Tubes; 19 pcs (standard)
ELECTRICAL CHARACTERISTICS (Per Diode) @ 25
o
C unless otherwise specified
1N5768
PART
NUMBER
MAXIMUM
FORWARD
VOLTAGE
V
F1
I
F
= 100 mA
(Note 1)
Vdc
MAXIMUM
FORWARD
VOLTAGE
V
F2
I
F
= 500 mA
(Note 1)
Vdc
MAXIMUM
REVERSE
CURRENT
I
R1
V
R
= 40 V
μAdc
MAXIMUM
CAPACITANCE
(PIN TO PIN)
C
t
V
R
= 0 V
F = 1 MHz
pF
MAXIMUM
FORWARD
RECOVERY TIME
t
fr
I
F
= 500 mA
ns
MAXIMUM
REVERSE
RECOVERY TIME
trr
I
F
=
I
R
= 200 mA
i
rr
= 20 mA
R
L
= 100 ohms
ns
1N5768
Copyright
©
2006
01-24-2006 REV B
1
1.5
0.1
4.0
40
20
NOTE 1:
Pulsed: P
W
= 300 µs +/- 50 µs, duty cycle <2%, 90 µs after leading edge.
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1

MX1N5768相似产品对比

MX1N5768 MQ1N5768 MV1N5768 MSP1N5768
描述 Trans Voltage Suppressor Diode, Unidirectional, 8 Element, Silicon, HERMETIC SEALED, CERAMIC, DFP-10 Trans Voltage Suppressor Diode, Unidirectional, 8 Element, Silicon, HERMETIC SEALED, CERAMIC, DFP-10 Trans Voltage Suppressor Diode, Unidirectional, 8 Element, Silicon, HERMETIC SEALED, CERAMIC, DFP-10 Trans Voltage Suppressor Diode, Unidirectional, 8 Element, Silicon, HERMETIC SEALED, CERAMIC, DFP-10
是否无铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合
零件包装代码 DFP DFP DFP DFP
包装说明 R-CDFP-F10 R-CDFP-F10 R-CDFP-F10 R-CDFP-F10
针数 10 10 10 10
Reach Compliance Code compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99
Is Samacsys N N N N
其他特性 HIGH RELIABILITY, LOW CAPACITANCE HIGH RELIABILITY, LOW CAPACITANCE HIGH RELIABILITY, LOW CAPACITANCE HIGH RELIABILITY, LOW CAPACITANCE
最小击穿电压 60 V 60 V 60 V 60 V
配置 COMMON ANODE, 8 ELEMENTS COMMON ANODE, 8 ELEMENTS COMMON ANODE, 8 ELEMENTS COMMON ANODE, 8 ELEMENTS
二极管元件材料 SILICON SILICON SILICON SILICON
二极管类型 TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码 R-CDFP-F10 R-CDFP-F10 R-CDFP-F10 R-CDFP-F10
JESD-609代码 e0 e0 e0 e0
元件数量 8 8 8 8
端子数量 10 10 10 10
最高工作温度 150 °C 150 °C 150 °C 150 °C
最低工作温度 -65 °C -65 °C -65 °C -65 °C
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK FLATPACK FLATPACK FLATPACK
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
极性 UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL UNIDIRECTIONAL
最大功率耗散 0.5 W 0.5 W 0.5 W 0.5 W
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
参考标准 MIL-19500/474 MIL-19500/474 MIL-19500/474 MIL-19500/474
表面贴装 YES YES YES YES
技术 AVALANCHE AVALANCHE AVALANCHE AVALANCHE
端子面层 TIN LEAD TIN LEAD TIN LEAD TIN LEAD
端子形式 FLAT FLAT FLAT FLAT
端子位置 DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Base Number Matches 1 1 1 1

 
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