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SM1SMB5933BT3G

产品描述SM1SMB5933BT3G
产品类别分立半导体    二极管   
文件大小156KB,共6页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
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SM1SMB5933BT3G概述

SM1SMB5933BT3G

SM1SMB5933BT3G规格参数

参数名称属性值
厂商名称ON Semiconductor(安森美)
Reach Compliance Codecompliant
ECCN代码EAR99
Is SamacsysN
Base Number Matches1

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1SMB59xxBT3G Series,
SZ1SMB59xxT3G Series
3 Watt Plastic
Surface Mount
Zener Voltage Regulators
This complete new line of 3 W Zener diodes offers the following
advantages.
Features
http://onsemi.com
Zener Voltage Range
3.3 V to 200 V
ESD Rating of Class 3 (> 16 kV) per Human Body Model
Flat Handling Surface for Accurate Placement
Package Design for Top Side or Bottom Circuit Board Mounting
AEC−Q101 Qualified and PPAP Capable
SZ1SMB59xxT3G
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
Pb−Free Packages are Available*
Mechanical Characteristics:
CASE:
Void-free, transfer-molded plastic
FINISH:
All external surfaces are corrosion resistant and leads are
PLASTIC SURFACE MOUNT
ZENER VOLTAGE
REGULATOR DIODES
3.3−200 V, 3 W DC POWER
SMB
CASE 403A
PLASTIC
Cathode
Anode
readily solderable
MAXIMUM LEAD TEMPERATURE FOR SOLDERING PURPOSES:
MARKING DIAGRAM
260C for 10 Seconds
LEADS:
Modified L−Bend providing more contact area to bond pads
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
MAXIMUM RATINGS
Rating
Maximum Steady State Power
Dissipation @ T
L
= 75C
Measured at Zero Lead Length
Derate Above 75C
Thermal Resistance from Junction−to−Lead
Maximum Steady State Power
Dissipation @ T
A
= 25C (Note )
Derate Above 25C
Thermal Resistance from
Junction−to−Ambient
Operating and Storage Temperature Range
Symbol
P
D
R
qJL
P
D
R
qJA
T
J
, T
stg
Value
3.0
40
25
550
4.4
226
−65
to
+150
Unit
W
mW/C
C/W
mW
mW/C
C/W
C
SZ1SMB59xxBT3G
AYWW
9xxB
G
G
A
Y
WW
9xxB
G
= Assembly Location
= Year
= Work Week
= Device Code (Refer to page 3)
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
1SMB59xxBT3G
Package
SMB
(Pb−Free)
SMB
(Pb−Free)
Shipping
2,500 /
Tape & Reel
2,500 /
Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 board, using recommended footprint.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2012
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
January, 2012
Rev. 8
1
Publication Order Number:
1SMB5913BT3/D
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