100K SERIES, TRIPLE 4 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CQFP24, CERPACK-24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | QFF, QFL24,.4SQ |
| Reach Compliance Code | compliant |
| Is Samacsys | N |
| 系列 | 100K |
| JESD-30 代码 | S-GQFP-F24 |
| JESD-609代码 | e0 |
| 长度 | 9.398 mm |
| 逻辑集成电路类型 | MULTIPLEXER |
| 湿度敏感等级 | 1 |
| 功能数量 | 3 |
| 输入次数 | 4 |
| 输出次数 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | OPEN-EMITTER |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | QFF |
| 封装等效代码 | QFL24,.4SQ |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 包装方法 | RAIL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | -4.5 V |
| 最大电源电流（ICC） | 80 mA |
| Prop。Delay @ Nom-Sup | 2 ns |
| 传播延迟（tpd） | 1.7 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B |
| 座面最大高度 | 2.159 mm |
| 表面贴装 | YES |
| 技术 | ECL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 9.398 mm |
| Base Number Matches | 1 |
| 100371FMQB | 100371DMQB/NOPB | 100371DMQB | 100371FMQB/NOPB | |
|---|---|---|---|---|
| 描述 | 100K SERIES, TRIPLE 4 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CQFP24, CERPACK-24 | 100K SERIES, TRIPLE 4 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CDIP24 | 100K SERIES, TRIPLE 4 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CDIP24, CERDIP-24 | 100K SERIES, TRIPLE 4 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CQFP24, CERPACK-24 |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | QFF, QFL24,.4SQ | DIP, | DIP, DIP24,.4 | QFF, |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| Is Samacsys | N | N | N | N |
| 系列 | 100K | 100K | 100K | 100K |
| JESD-30 代码 | S-GQFP-F24 | R-GDIP-T24 | R-GDIP-T24 | S-GQFP-F24 |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 湿度敏感等级 | 1 | 1 | 1 | 1 |
| 功能数量 | 3 | 3 | 3 | 3 |
| 输入次数 | 4 | 4 | 4 | 4 |
| 输出次数 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | QFF | DIP | DIP | QFF |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | FLATPACK | IN-LINE | IN-LINE | FLATPACK |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 |
| 传播延迟（tpd） | 1.7 ns | 1.7 ns | 1.7 ns | 1.7 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B |
| 座面最大高度 | 2.159 mm | 5.72 mm | 5.72 mm | 2.159 mm |
| 表面贴装 | YES | NO | NO | YES |
| 技术 | ECL | ECL | ECL | ECL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 9.398 mm | 10.16 mm | 10.16 mm | 9.398 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
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