IC,EPROM,64KX8,CMOS,LDCC,32PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor(TI ) |
| Reach Compliance Code | compliant |
| Is Samacsys | N |
| 最长访问时间 | 150 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PQCC-J32 |
| JESD-609代码 | e0 |
| 内存密度 | 524288 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 端子数量 | 32 |
| 字数 | 65536 words |
| 字数代码 | 64000 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 64KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC32,.5X.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.03 mA |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| NMC27C512AV150 | NMC27C512AV200 | NMC27C512AV250 | NMC27C512AQ90 | NMC27C512AQE120 | NMC27C512AV15 | NMC27C512AV20 | |
|---|---|---|---|---|---|---|---|
| 描述 | IC,EPROM,64KX8,CMOS,LDCC,32PIN,PLASTIC | IC,EPROM,64KX8,CMOS,LDCC,32PIN,PLASTIC | IC,EPROM,64KX8,CMOS,LDCC,32PIN,PLASTIC | IC,EPROM,64KX8,CMOS,DIP,28PIN,CERAMIC | IC,EPROM,64KX8,CMOS,DIP,28PIN,CERAMIC | IC,EPROM,64KX8,CMOS,LDCC,32PIN,PLASTIC | IC,EPROM,64KX8,CMOS,LDCC,32PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | compliant | compliant | compliant | unknown | unknown | compliant | compliant |
| 最长访问时间 | 150 ns | 200 ns | 250 ns | 90 ns | 120 ns | 150 ns | 200 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 | R-XDIP-T28 | R-XDIP-T28 | R-PQCC-J32 | R-PQCC-J32 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 32 | 32 | 32 | 28 | 28 | 32 | 32 |
| 字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| 字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C |
| 组织 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QCCJ | QCCJ | DIP | DIP | QCCJ | QCCJ |
| 封装等效代码 | LDCC32,.5X.6 | LDCC32,.5X.6 | LDCC32,.5X.6 | DIP28,.6 | DIP28,.6 | LDCC32,.5X.6 | LDCC32,.5X.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 0.03 mA | 0.03 mA | 0.03 mA | 0.05 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | NO | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | DUAL | DUAL | QUAD | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | - | - | OTP ROM | OTP ROM |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | - | - | 0.0001 A | 0.0001 A |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved