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IS42VM16100G-6TLI

产品描述Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 INCH, LEAD FREE, TSOP2-50
产品类别存储    存储   
文件大小400KB,共29页
制造商Integrated Silicon Solution ( ISSI )
标准
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IS42VM16100G-6TLI概述

Synchronous DRAM, 1MX16, 5.5ns, CMOS, PDSO50, 0.400 INCH, LEAD FREE, TSOP2-50

IS42VM16100G-6TLI规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Integrated Silicon Solution ( ISSI )
零件包装代码TSOP2
包装说明TSOP2, TSOP50,.46,32
针数50
Reach Compliance Codecompliant
ECCN代码EAR99
Is SamacsysN
访问模式DUAL BANK PAGE BURST
最长访问时间5.5 ns
其他特性AUTO/SELF REFRESH
最大时钟频率 (fCLK)166 MHz
I/O 类型COMMON
交错的突发长度1,2,4,8
JESD-30 代码R-PDSO-G50
JESD-609代码e3
长度20.95 mm
内存密度16777216 bit
内存集成电路类型SYNCHRONOUS DRAM
内存宽度16
湿度敏感等级3
功能数量1
端口数量1
端子数量50
字数1048576 words
字数代码1000000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织1MX16
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码TSOP2
封装等效代码TSOP50,.46,32
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度)260
电源1.8 V
认证状态Not Qualified
刷新周期4096
座面最大高度1.2 mm
自我刷新YES
连续突发长度1,2,4,8,FP
最大待机电流0.00001 A
最大压摆率0.055 mA
最大供电电压 (Vsup)1.95 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距0.8 mm
端子位置DUAL
处于峰值回流温度下的最长时间40
宽度10.16 mm
Base Number Matches1

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IS42VM16100G
512K
x
16Bits
x
2Banks Low Power Synchronous DRAM
Description
These IS42VM16100G is a low power 16,777,216 bits CMOS Synchronous DRAM organized as 2 banks of 524,288 words x 16 bits.
These products are offering fully synchronous operation and are referenced to a positive edge of the clock. All inputs and outputs are
synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve high bandwidth. All input and
output voltage levels are compatible with LVCMOS.
Features
JEDEC standard 1.8V power supply.
• Auto refresh and self refresh.
• All pins are compatible with LVCMOS interface.
• 4K refresh cycle / 64ms.
• Programmable Burst Length and Burst Type.
- 1, 2, 4, 8 or Full Page for Sequential Burst.
- 4 or 8 for Interleave Burst.
• Programmable CAS Latency : 2,3 clocks.
• Programmable Driver Strength Control
- Full Strength or 1/2, 1/4 of Full Strength
• Deep Power Down Mode.
• All inputs and outputs referenced to the positive edge of the
system clock.
• Data mask function by DQM.
• Internal dual banks operation.
• Burst Read Single Write operation.
• Special Function Support.
- PASR(Partial Array Self Refresh)
- Auto TCSR(Temperature Compensated Self Refresh)
• Automatic precharge, includes CONCURRENT Auto Precharge
Mode and controlled Precharge.
Copyright © 2010 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its
products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services
described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information
and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or
effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to
its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Rev.A | Mar. 2011
www.issi.com
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