Prescaler, ECL, CDIP16,
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Fairchild |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | compliant |
| Is Samacsys | N |
| JESD-30 代码 | R-XDIP-T16 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | PRESCALER |
| 湿度敏感等级 | 2A |
| 端子数量 | 16 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度(摄氏度) | 250 |
| 表面贴装 | NO |
| 技术 | ECL |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| Base Number Matches | 1 |
| 11C91DCQR | 11C91DCQB | 11C91DCQC | 11C91DMQB | 11C91DMQC | 11C90DCQB | 11C90DCQC | S2010CA2231CHW | S2010CA2640BEB-TR | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Prescaler, ECL, CDIP16, | Prescaler, ECL, CDIP16, | Prescaler, ECL, CDIP16, | Prescaler, ECL, CDIP16, | Prescaler, ECL, CDIP16, | Prescaler, ECL, CDIP16, | Prescaler, ECL, CDIP16, | Fixed Resistor, Thin Film, 0.8W, 2230ohm, 150V, 0.25% +/-Tol, 50ppm/Cel, Surface Mount, 2010, CHIP | Fixed Resistor, Thin Film, 0.8W, 264ohm, 150V, 0.1% +/-Tol, 25ppm/Cel, Surface Mount, 2010, CHIP |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 | 不符合 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | not_compliant |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e4 | e0 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 2 | 2 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C | 150 °C | 150 °C |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | YES | YES |
| 技术 | ECL | ECL | ECL | ECL | ECL | ECL | ECL | THIN FILM | THIN FILM |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Gold (Au) | Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier |
| 是否无铅 | 含铅 | 含铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | 不含铅 | 含铅 |
| 厂商名称 | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | - | - |
| 包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | - | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | , 2010 | CHIP |
| Is Samacsys | N | N | N | N | N | N | N | - | - |
| JESD-30 代码 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | - | - |
| 逻辑集成电路类型 | PRESCALER | PRESCALER | PRESCALER | PRESCALER | PRESCALER | PRESCALER | PRESCALER | - | - |
| 湿度敏感等级 | 2A | 2A | 2A | - | 2A | 2A | 2A | - | - |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | - | - |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | - | - |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | - | - |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | - | - |
| 峰值回流温度(摄氏度) | 250 | 250 | 250 | - | 250 | 250 | 250 | - | - |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | - | - |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | - |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | - |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | - | 30 | 30 | 30 | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
| 筛选级别 | - | 38535Q/M;38534H;883B | MIL-STD-883 Class C | 38535Q/M;38534H;883B | MIL-STD-883 Class C | 38535Q/M;38534H;883B | MIL-STD-883 Class C | - | - |
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