1% Thick Film Chip Resistors
FEATURES
• Temperature Range: -55°C ~ +125°C
• High purity alumina substrate
• Wave or flow solderable
• Excellent high frequency characteristics
• Wrap around termination
• Inner electrode protection
CR1 Series
DERATING CURVE
Rated Load (%)
REEL DIMENSIONS (mm)
¿13 –0.5
50
min.
178
2.0
10 –1
Ambient Temperature (¡C)
PART NUMBERING SYSTEM
2
9
Series
0
1
0
Ohms
K
SERIES, SIZE, WATTAGE, VOLTAGE, AND DIMENSIONS
L
W
D
C
t
Series
290
292
302
304
Case Size
1206
0805
0603
0402
Power
Rating
1/8
1/10
1/10
1/16
Voltage (max.)
W.V.
O.V.
200
400
150
300
50
25
100
50
L
3.1 ± 0.15
2.0 ± 0.15
1.6 ± 0.10
1.00 ± 0.1
Dimensions (mm)
W
C
D
1.55 ± 0.15
0.45 ± 0.2
0.45 ± 0.2
1.25 ± 0.15
0.40 ± 0.2
0.40 ± 0.2
0.8 ± 0.15
0.5 ± 0.05
0.30 ± 0.2
0.2 ± 0.1
0.30 ± 0.2
0.25 ± 0.1
t
0.55 ± 0.10
0.55 ± 0.10
0.45± 0.10
0.35 ± 0.05
XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600036
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
Date Revised: 9/28/05
1% Thick Film Chip Resistors
STANDARD STOCKED VALUES (Ω)
10
10.2
10.5
10.7
11
11.3
11.5
11.8
12.1
12.4
12.7
13
13.3
13.7
14
14.3
14.7
15
15.4
15.8
16.2
16.5
16.9
17.4
17.8
18.2
18.7
19.1
19.6
20
20.5
21
21.5
22.1
22.6
23.2
23.7
24.3
24.9
25.5
26.1
26.7
27.4
28
28.7
29.4
30.1
30.9
31.6
32.4
33.2
34
34.8
35.7
36.5
37.4
38.3
39.2
40.2
41.2
42.2
43.2
44.2
45.3
46.4
47.5
48.7
49.9
51.1
52.3
53.6
54.9
56.2
57.6
59
60.4
61.9
63.4
64.9
66.5
68.1
69.8
71.5
73.2
75
76.8
78.7
80.6
82.5
84.5
86.6
88.7
90.9
93.1
95.3
97.6
100
102
105
107
110
113
115
118
121
124
127
130
133
137
140
143
147
150
154
158
162
165
169
174
178
182
187
191
196
200
205
210
215
221
226
232
237
243
249
255
261
267
274
280
287
294
300
301
309
316
324
332
340
348
357
365
374
383
392
402
412
422
432
CR1 Series
665 1.13K 1.91K 3.16K 5.36K 9.09K 15.4K 26.1K 43.2K 73.2K 124K 210K 348K 590K
681 1.15K 1.96K 3.24K 5.49K 9.31K 15.8K 26.7K 44.2K 75K 127K 215K 357K 604K
698 1.18K 2.0K 3.32K 5.62K 9.53K 16.2K 27.4K 45.3K 76.8K 130K 221K 365K 619K
715 1.21K 2.05K 3.4K 5.76K 9.76K 16.5K 28K 46.4K 78.7K 133K 226K 374K 634K
732 1.24K 2.1K 3.48K 5.9K 10K 16.9K 28.7K 47.5K 80.6K 137K 232K 383K 649K
6.04K
6.19K
6.34K
6.49K
6.65K
6.81K
6.98K
7.15K
7.32K
7.5K
7.68K
7.87K
8.06K
8.25K
8.45K
8.66K
8.87K
10.2K
10.5K
10.7K
11.K
11.3K
11.5K
11.8K
12.1K
12.4K
12.7K
13K
13.3K
13.7K
14.K
14.3K
14.7K
15K
17.4K
17.8K
18.2K
18.7K
19.1K
19.6K
20K
20.5K
21.K
21.5K
22.1K
22.6K
23.2K
23.7K
24.3K
24.9K
25.5K
29.4K
30K
30.1K
30.9K
31.6K
32.4K
33.2K
34.K
34.8K
35.7K
36.5K
37.4K
38.3K
39.2K
40.2K
41.2K
42.2K
48.7K
49.9K
51.1K
52.3K
53.6K
54.9K
56.2K
57.6K
59.0K
60.4K
61.9K
63.4K
64.9K
66.5K
68.1K
69.8K
71.5K
82.5K
84.5K
86.6K
88.7K
90.9K
93.1K
95.3K
97.6K
100K
102K
105K
107K
110K
113K
115K
118K
121K
140K
143K
147K
150K
154K
158K
162K
165K
169K
174K
178K
182K
187K
191K
196K
200K
205K
1
237K
243K
249K
255K
261K
267K
274K
280K
287K
294K
300K
301K
309K
316K
324K
332K
340K
392K
402K
412K
422K
432K
442K
453K
464K
475K
487K
499K
511K
523K
536K
549K
562K
576K
665K
681K
698K
715K
732K
750K
768K
787K
806K
825K
845K
866K
887K
909K
931K
953K
976K
1M
442 750 1.27K 2.15K 3.57K
453 768 1.3K 2.21K 3.65K
464 787 1.33K 2.26K 3.74K
475 806 1.37K 2.32K 3.83K
487 825 1.40K 2.37K 3.92K
499 845 1.43K 2.43K 4.02K
511 866 1.47K 2.49K 4.12K
523 887 1.5K 2.55K 4.22K
536 909 1.54K 2.61K 4.32K
549 931 1.58K 2.67K 4.42K
562 953 1.62K 2.74K 4.53K
576 976 1.65K 2.8K 4.64K
590 1.0K 1.69K 2.87K 4.75K
604 1.02K 1.74K 2.94K 4.87K
619 1.05K 1.78K 3.0K 4.99K
634 1.07K 1.82K 3.01K 5.11K
649 1.1K 1.87K 3.09K 5.23K
CONSTRUCTION
No.
1
2
3
4
5
6
Part Name
Protective coating: Epoxy
Al
2
O
3
high purity alumina substrate: Al 96fi
Resistive element: metal film
Termination (Inner): Ag/Pd
Termination (Between): Ni plating film
Termination (Outer): Sn plating film
4
2
3
4
5
CHARACTERISTICS
Characteristics
Limits
Test Methods
( JIS C 5201-1 )
5.2 Natural resistance change per temp.
degree centigrade.
R
2
-R
1
x10
6
(PPM/°C)
R
1
(t
2
-t
1
)
R
1
: Resistance value at room temperature (t
1
)
R
2
: Resistance value at room temp.plus 100°C (t
2
)
5.5 Permanent resistance change after the
application of a potential of 2.5 times RCWV
for 5 seconds.
5.6 Apply 500V DC between protective coating
and termination for 1 minute
5.7 Apply 500V AC between protective coating
and termination for 1 minute
Temperature
coefficient
1Ω ~ 10Ω
≤
±400 PPM / °C
11Ω ~ 10MΩ
≤
±200 PPM / °C
Short time
overload
Resistance change rate is
± (2.0 % + 0.1Ω) Max.
Insulation
resistance
Dielectric
withstanding
voltage
Terminal bending
1,000M
Ω
or more
No evidence of flashover
mechanical damage,arcing or
insulation break down.
±(1.0% +0.05Ω) Max.
6.1.4 Twist of Test Board:
Y/X=5/90mm for 10 seconds
XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600036
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
Date Revised: 9/28/05
1% Thick Film Chip Resistors
CHARACTERISTICS
(Cont.)
Characteristics
Limits
Test Methods
( JIS C 5201-1 )
7.4 Resistance change after continuous
5 cycles for duty shown below:
Step
Temperature
1
-55°C ±3°C
2
Room temp.
3
+155°C ±2°C
4
Room temp.
CR1 Series
Temperature
cycling
± (1.0% + 0.05Ω) Max.
Time
30 mins
10~15 mins
30 mins
10~15 mins
Load life in
humidity
Resistance change rate is
± (3.0% + 0.1Ω) Max.
7.9 Resistance change after 1,000 hours
(1.5 hours "on", 0.5 hour "off") at RCWV
in a humidity chamber controlled at
40°C ± 2°C and 90 to 95 % relative humidity
7.10 Permanent resistance change after 1,000 hours
operating at RCWV, with duty cycle of
( 1.5 hours "on", 0.5 hour "off" ) at 70°C ± 2°C ambient
Solder bath method
Pre-Heat: 100 ro 105°C, 30 ±5 sec.
Temperature: 265 ± 3°C, 5 +1/-0 sec
Reflow soldering method
Peak: 250 +5/-0°C
230°C or higher, 30 ±10Sec.
Solder iron method
Bit temperature: 350° ±10°C
Application time of soldering iron: 3 +1/-0 seconds
Load life
Resistance change rate is
± (3.0% + 0.1Ω) Max.
Soldering Heat
Electrical characteristics shall be satisfied.
Without distinct deformation in
appearance.
Solderability
95% Coverage min.
6.5 Test temperature of solder: 245° ±3°C
Dipping them solder: 2~3 seconds
XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600036
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
Date Revised: 9/28/05
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
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:
304-665K 302-4.87K 292-46.4 290-37.4 304-115K 304-41.2K 290-7.5K 290-53.6 290-825 302-576K 304-825K
304-13.7 292-5.11K 290-5.11K 304-13.3 302-47.5 292-90.9K 304-178K 304-158K 290-90.9K 304-30.1K 290-
604K 304-69.8K 302-69.8K 302-30.1K 292-100K 304-88.7 292-124K 292-102K 304-30.9K 302-30.9K 304-174K
302-499K 304-150K 304-154K 302-12.1 302-12.4 290-47.5K 292-47.5K 302-71.5K 292-20.5K 304-71.5K 290-
20.5K 304-41.2 302-28K 292-665K 292-59K 292-27.4 292-31.6 302-12.7 302-182K 290-1.5K 290-1.3K 302-
137K 304-226K 292-210K 292-698 292-634 302-18.2K 292-619 290-18.2K 292-18.2K 302-133K 302-787 302-
768 304-18.2K 292-113K 304-17.8K 302-17.8K 304-124K 304-162K 304-17.4K 292-110K 292-118K 302-17.4K
290-17.8K 292-17.8K 292-158K 292-150K 290-17.4K 292-17.4K 304-121K 292-154K 290-24.9 290-24.3 304-
105K 304-12.7 304-12.4 304-100K 304-107K 304-12.1 290-52.3 302-5.49K 302-442K 304-5.49K 292-93.1 292-
133K 304-2.61K 302-2.61K 302-8.25K
NXP MCU
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