SFX
Vishay Electro-Films
Thin Film, Top-Contact Meghom Resistor
CHIP
RESISTORS
FEATURES
•
Wire bondable
Product may not
be to scale
•
Megohm resistance range: 0.51 MΩ to 20 MΩ
•
Chip size: 0.040 inches square
•
Reduced hybrid size
•
Resistor material: tantalum nitride, self-passivating
•
Oxidized silicon substrate
The SFX series resistor chips extends the range of available
resistance to 20 MΩ These offer one of the best
combinations of small size and high value available.
The SFXs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The SFXs are 100 % electrically tested and
visually inspected to MIL-STD-883.
APPLICATIONS
The SFX series megohm resistor chips are designed for use in hybrid packages which require small-size high-value resistors.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
Tightest Standard Tolerance Available
0.1 %
± 50 ppm/°C
± 100 ppm/°C
± 250 ppm/°C
± 350 ppm/°C
0.5 %
PROCESS CODE
CLASS H*
059
054
017
018
*MIL-PRF-38534 inspection criteria
CLASS K*
155
156
158
157
510 kΩ
2 MΩ 3.3 MΩ 10 MΩ
20 MΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
Moisture Resistance, MIL-STD-202
Method 106, (Passivated only)
Stability, 1000 h, + 125 °C, 10 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202,
Method 107, Test Condition F
High Temperature Exposure, + 150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at + 70 °C (Derated to Zero at + 175 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
- 12 dB typ.
± 0.5 % max.
ΔR/R
± 1.0 % max.
ΔR/R
- 55 °C to + 125 °C
± 0.25 % max.
ΔR/R
± 0.5 % max.
ΔR/R
400 V
10
12
min.
100 V max.
20 mW
± 0.25 % max.
ΔR/R
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44
For technical questions, contact: efi@vishay.com
Document Number: 61018
Revision: 12-Mar-08
SFX
Thin Film, Top-Contact Meghom Resistor
Vishay Electro-Films
DIMENSIONS
in inches
0.040
CHIP
RESISTORS
0.005
0.037
0.005
SCHEMATIC
MECHANICAL SPECIFICATIONS
in inches
PARAMETER
Chip Size
Chip Thickness
Chip Substrate Material
Resistor Material
Bonding Pad Size
Number of Pads
Pad Material
Backing
Options:
0.040 x 0.040 ± 0.003 (1.0 x 1.0 ± 0.075 mm)
0.010 ± 0.002 (0.254 ± 0.050 mm)
Oxidized silicon, 10 kÅ minimum SiO
2
Tantalum nitride, self-passivating
0.005 x 0.005 (0.127 x 0.127 mm)
2
10 kÅ minimum aluminum
None, lapped semiconductor silicon
Gold backing for eutectic die attach
Resistance values above 20M are available in 0.055 inches square size
0.030 inch square size also available with different values and TCR restrictions.
Consult Applications Engineer
ORDERING INFORMATION
Example: 100 % visual, 5 MΩ ± 1 %, ± 250 ppm/°C TCR, Aluminum Pads, Class H Visual inspection
W
INSPECTION/
PACKAGING
W = 100 % visually inspected
parts, per MIL-STD-883
X = Sample, visually inspected
parts loaded in matrix trays
(4 % AQL)
SFX
PRODUCT
FAMILY
017
PROCESS
CODE
See Process Code
table
5000
RESISTANCE
VALUE
Use the first 4
significant digits
of the resistance
3
MULTIPLIER
CODE
2
= 100
3
= 1000
4
= 10 000
F
TOLERANCE
CODE
B
= 0.1 %
C
= 0.2 %
D
= 0.5 %
F
= 1.0 %
G
= 2.0 %
H
= 2.5 %
J
= 5.0 %
K
= 10 %
M
= 20 %
L
= 25 %
*Coating standard
Document Number: 61018
Revision: 12-Mar-08
For technical questions, contact: efi@vishay.com
www.vishay.com
45
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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1
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