Audio Single Chip Receiver, FM, PDIP20, PLASTIC, DIP-20
| 参数名称 | 属性值 |
| 厂商名称 | YAGEO(国巨) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 商用集成电路类型 | AUDIO SINGLE CHIP RECEIVER |
| 解调类型 | FM |
| JESD-30 代码 | R-PDIP-T20 |
| 长度 | 26.695 mm |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 标称输出电压（调频） | 480 mV |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.064 mm |
| 信噪比Nom（FM） | 73 dB |
| 最大压摆率 | 7 mA |
| 最大供电电压 (Vsup) | 8 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 表面贴装 | NO |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| SA605N | SA605D | NE605D | NE605N | |
|---|---|---|---|---|
| 描述 | Audio Single Chip Receiver, FM, PDIP20, PLASTIC, DIP-20 | Audio Single Chip Receiver, FM, PDSO20, PLASTIC, SOL-20 | Audio Single Chip Receiver, FM, PDSO20, PLASTIC, SOL-20 | Audio Single Chip Receiver, FM, PDIP20, PLASTIC, DIP-20 |
| 厂商名称 | YAGEO(国巨) | YAGEO(国巨) | YAGEO(国巨) | YAGEO(国巨) |
| 零件包装代码 | DIP | SOIC | SOIC | DIP |
| 包装说明 | DIP, | SOP, | SOP, | DIP, |
| 针数 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 商用集成电路类型 | AUDIO SINGLE CHIP RECEIVER | AUDIO SINGLE CHIP RECEIVER | AUDIO SINGLE CHIP RECEIVER | AUDIO SINGLE CHIP RECEIVER |
| 解调类型 | FM | FM | FM | FM |
| JESD-30 代码 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 |
| 长度 | 26.695 mm | 12.8 mm | 12.8 mm | 26.695 mm |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | 70 °C |
| 标称输出电压（调频） | 480 mV | 480 mV | 480 mV | 480 mV |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SOP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.064 mm | 2.65 mm | 2.65 mm | 4.064 mm |
| 信噪比Nom（FM） | 73 dB | 73 dB | 73 dB | 73 dB |
| 最大压摆率 | 7 mA | 7 mA | 7 mA | 7 mA |
| 最大供电电压 (Vsup) | 8 V | 8 V | 8 V | 8 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 表面贴装 | NO | YES | YES | NO |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 7.5 mm | 7.5 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
模拟电子
NXP MCU
无线连接
嵌入式系统
Linux开发
聊聊、笑笑、闹闹
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
