EDO DRAM, 4MX4, 50ns, CMOS, PDSO24, 0.300 INCH, TSOP2-24
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Integrated Silicon Solution ( ISSI ) |
| 零件包装代码 | TSOP2 |
| 包装说明 | TSOP2, |
| 针数 | 24 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 访问模式 | EDO PAGE |
| 最长访问时间 | 50 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| JESD-30 代码 | R-PDSO-G24 |
| JESD-609代码 | e0 |
| 长度 | 17.14 mm |
| 内存密度 | 16777216 bit |
| 内存集成电路类型 | EDO DRAM |
| 内存宽度 | 4 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 24 |
| 字数 | 4194304 words |
| 字数代码 | 4000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 4MX4 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP2 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| IS41C44002C-50TI | IS41C44002C-50JLI | IS41C44002C-50TLI | IS41C44002C-50JI | IS41LV44002C-50TLI | IS41LV44002C-50TI | |
|---|---|---|---|---|---|---|
| 描述 | EDO DRAM, 4MX4, 50ns, CMOS, PDSO24, 0.300 INCH, TSOP2-24 | EDO DRAM, 4MX4, 50ns, CMOS, PDSO24, 0.300 INCH, SOJ-24 | EDO DRAM, 4MX4, 50ns, CMOS, PDSO24, 0.300 INCH, ROHS COMPLIANT, TSOP2-24 | EDO DRAM, 4MX4, 50ns, CMOS, PDSO24, 0.300 INCH, SOJ-24 | EDO DRAM, 4MX4, 50ns, CMOS, PDSO24, 0.300 INCH, ROHS COMPLIANT, TSOP2-24 | EDO DRAM, 4MX4, 50ns, CMOS, PDSO24, 0.300 INCH, TSOP2-24 |
| 是否无铅 | 含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 符合 | 符合 | 不符合 | 符合 | 不符合 |
| 厂商名称 | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
| 零件包装代码 | TSOP2 | SOJ | TSOP2 | SOJ | TSOP2 | TSOP2 |
| 包装说明 | TSOP2, | SOJ, | TSOP2, | SOJ, | TSOP2, | TSOP2, |
| 针数 | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | EDO PAGE | EDO PAGE | EDO PAGE | EDO PAGE | EDO PAGE | EDO PAGE |
| 最长访问时间 | 50 ns | 50 ns | 50 ns | 50 ns | 50 ns | 50 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| JESD-30 代码 | R-PDSO-G24 | R-PDSO-J24 | R-PDSO-G24 | R-PDSO-J24 | R-PDSO-G24 | R-PDSO-G24 |
| JESD-609代码 | e0 | e3 | e3 | e0 | e3 | e0 |
| 长度 | 17.14 mm | 17.175 mm | 17.14 mm | 17.175 mm | 17.14 mm | 17.14 mm |
| 内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
| 内存集成电路类型 | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 |
| 字数 | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| 字数代码 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 4MX4 | 4MX4 | 4MX4 | 4MX4 | 4MX4 | 4MX4 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP2 | SOJ | TSOP2 | SOJ | TSOP2 | TSOP2 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 3.76 mm | 1.2 mm | 3.76 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | MATTE TIN | MATTE TIN | TIN LEAD | MATTE TIN | TIN LEAD |
| 端子形式 | GULL WING | J BEND | GULL WING | J BEND | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 40 | 40 | NOT SPECIFIED | 40 | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| Is Samacsys | N | N | N | N | N | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
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