FXPQ3115BV
2
I C precision pressure sensor with altimetry
Rev. 5 — 28 May 2020
Product data sheet
1
General description
The FXPQ3115BV is a compact, piezoresistive, absolute pressure sensor with an I C
digital interface. FXPQ3115BV has a wide operating range of 20 kPa to 110 kPa. This
sensor is ideal for inhalers, continuous positive airway pressure (CPAP) masks, or
other medical devices coming in contact with a patient's airway. The MEMS and ASIC
die are coated with a biomedically approved gel. The gel is a nontoxic, nonallergenic
elastomer which meets all United States Pharmacopeia (USP) biological testing class
VI requirements. The gel properties allow uniform pressure transmission to the MEMS
diaphragm.
A high-resolution ADC provides fully compensated and digitized outputs for pressure in
Pascals and temperature in °C. The compensated output is available as either barometric
pressure in Pascals or as an altitude in meters. The internal processing in FXPQ3115BV
removes compensation and unit conversion load from the system MCU, simplifying
system design.
FXPQ3115BV's advanced ASIC has multiple user programmable modes such as power
saving, interrupt and autonomous data acquisition modes, including programmed
acquisition cycle timing, and poll-only modes. Typical active supply current is 40 μA per
measurement-second.
2
2
•
•
•
•
•
•
•
Features and benefits
Operating range: 20 kPa to 110 kPa absolute pressure
Calibrated range: 50 kPa to 110 kPa absolute pressure
Calibrated temperature output: −40 °C to 85 °C
2
I C digital output interface
Fully compensated internally
Precision ADC resulting in 1.5 Pa of effective resolution
Direct reading
–
Pressure: 20-bit measurement (Pascals)
–
20 kPa to 110 kPa
–
Temperature: 12-bit measurement (°C)
–
–40 °C to 85 °C
•
Programmable interrupts
•
Autonomous data acquisition
–
Embedded 32-sample FIFO
–
Data logging up to 12 days using the FIFO
–
One-second to nine-hour data acquisition rate
•
1.95 V to 3.6 V supply voltage, internally regulated
•
1.6 V to 3.6 V digital interface supply voltage
•
Operating temperature from −40 °C to +85 °C
NXP Semiconductors
2
I C precision pressure sensor with altimetry
FXPQ3115BV
3
Applications
•
•
•
•
•
•
Inhalers/nebulizers
Medical tablets
Health activity monitors
Oxygen concentrators
CPAP machine and mask
Spyrometry
4
Ordering information
Shipping
Tray
Package
98ASA002260D
Number of ports
None Single
●
●
—
—
—
—
—
—
Pressure Type
Absolute
●
●
—
—
Digital
interface
●
●
Table 1. Ordering information
Device number
FXPQ3115BV
FXPQ3115BVT1
Dual Gauge Differential
Tape and reel 98ASA002260D
5
Block diagram
PRESSURE AND TEMPERATURE SENSOR
A
R3
R1
D
R2
V
G
Rx
B
MUX
GAIN
AAF
ADC
DIGITAL
SIGNAL
PROCESSING
DIGITAL
INTERFACE
SDL
SCL
INT1
INT2
PRT
TEMPERATURE
SENSOR
C
VOLTAGE REFERENCES
AND REGULATORS
OSCILLATORS,
CLOCK
GENERATORS
TRIM LOGIC
SENSOR
CONFIGURATION
AND OUTPUT
DATA REGISTERS
GND
CAP
V
DD
V
DDIO
aaa-024033
Figure 1. Block diagram
FXPQ3115BV
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2020. All rights reserved.
Product data sheet
Rev. 5 — 28 May 2020
2 / 51
NXP Semiconductors
2
I C precision pressure sensor with altimetry
FXPQ3115BV
6
Pinning information
6.1 Pinning
FXPQ3115BV
V
DD
1
8
SCL
CAP
2
7
SDL
GND
3
6
INT1
V
DDIO
4
5
INT2
Transparent top view
aaa-027833
Figure 2. 8-pin LGA pinout
6.2 Pin description
Table 2. Pin description
Symbol
V
DD
CAP
GND
V
DDIO
INT2
INT1
SDL
SCL
Pin
1
2
3
4
5
6
7
8
Description
V
DD
power supply connection (1.95 V to 3.6 V)
External capacitor
Ground
Digital interface power supply (1.62 V to 3.6 V)
Pressure interrupt 2
Pressure interrupt 1
I C serial data
I C serial clock
2
2
FXPQ3115BV
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2020. All rights reserved.
Product data sheet
Rev. 5 — 28 May 2020
3 / 51
NXP Semiconductors
2
I C precision pressure sensor with altimetry
FXPQ3115BV
7
System connections
V
DD
SCL
1
100 nF
10 µF
8
2
100 nF
7
SDL
FXPQ3115BV
3
6
INT1
V
DDIO
4
5
INT2
aaa-027832
Figure 3. Typical application diagram
The device power is supplied through the V
DD
line. Power supply decoupling capacitors
(100 nF ceramic plus 10 μF bulk or 10 μF ceramic) should be placed as near as possible
to pin 1 of the device. A second 100 nF capacitor is used to bypass the internal regulator.
The functions, threshold, and the timing of the interrupt pins (INT1 and INT2) are user
2
programmable through the I C interface.
8
Handling and board mount recommendations
The sensor die is sensitive to light exposure. Direct light exposure through the port hole
can lead to varied accuracy of pressure measurement. Avoid such exposure to the port
during normal operation.
8.1 Methods of handling
Components can be picked from the carrier tape using either the vacuum assist or the
mechanical type pickup heads. A vacuum assist nozzle type is most common due to its
lower cost of maintenance and ease of operation. The recommended vacuum nozzle
configuration should be designed to make contact with the device directly on the metal
cover and avoid vacuum port location directly over the vent hole in the metal cover of the
device. Multiple vacuum ports within the nozzle may be required to effectively handle the
device and prevent shifting during movement to placement position.
Vacuum pressure required to adequately support the component should be
approximately 25 in Hg (85 kPa). This level is typical of in-house vacuum supply.
Pickup nozzles are available in various sizes and configurations to suit a variety of
component geometries. To select the nozzle best suited for the specific application,
NXP recommends that the customer consult their pick and place equipment supplier to
determine the correct nozzle. In some cases it may be necessary to fabricate a special
nozzle depending on the equipment and speed of operation.
Tweezers or other mechanical forms of handling that have a sharp point are not
recommended since they can inadvertently be inserted into the vent hole of the device.
This can lead to a puncture of the MEMS element that will render the device inoperable.
FXPQ3115BV
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2020. All rights reserved.
Product data sheet
Rev. 5 — 28 May 2020
4 / 51
NXP Semiconductors
2
I C precision pressure sensor with altimetry
FXPQ3115BV
8.2 Board mount recommendations
Components can be mounted using solder paste stencil, screen printed or dispensed
onto the PCB pads prior to placement of the component. The volume of solder paste
applied to the PCB is normally sufficient to secure the component during transport to the
subsequent reflow soldering process. Use of adhesives to secure the component is not
recommended, but where necessary can be applied to the underside of the device.
Solder pastes are available in variety of metal compositions, particle size, and flux types.
The solder paste consists of metals and flux required for a reliable connection between
the component lead and the PCB pad. Flux aids the removal of oxides that may be
present on PCB pads and prevents further oxidation from occurring during the solder
process.
The use of a No-Clean (NC) flux is recommended for exposed cavity components.
Using pressure spray, wire brush, or other methods of cleaning is not recommended
since it can puncture the MEMS device and render it unusable. If cleaning of the PCB
is performed, Water Soluble (WS) flux can be used. However, it is recommended the
component cavity is protected by adhesive Kapton tape, vinyl cap, or other means
prior to the cleaning process. This covering prevents damage to the MEMS device,
contamination, and foreign materials from being introduced into device cavity as result of
cleaning processes.
Ultrasonic cleaning is not recommended as the frequencies can damage wire bond
interconnections and the MEMS device.
9
Mechanical and electrical specifications
9.1 Terminology
9.1.1 Resolution
The resolution of a pressure sensor is the minimum change of pressure that can be
reliably measured. The usable resolution of the device is programmable, enabling the
user to choose a compromise between acquisition speed, power consumption, and
resolution that best fits the application. To simplify the programming, the data is always
reported in the same format with differing number of usable bits.
9.1.2 Accuracy
9.1.2.1 Offset
The offset is defined as the output signal obtained when the reference pressure
(a vacuum for an absolute pressure sensor) is applied to the sensor. Offset error
affects absolute pressure measurements but not relative pressure measurements. An
altitude measurement is the pressure value in comparison to sea level, a barometric
measurement is the pressure value read by the sensor. That is, a measurement of total
pressure seen (for example 70 kPa), or total height (for example 3000 m) above sea
level. A change in the offset affects the pressure value or height seen above sea level
as it shifts the sea level base reference. An absolute pressure measurement is not the
same as relative pressure measurement, where the pressure is compared when raising
or lowering pressure in shorter intervals. This would be a walk up a hill, measuring the
pressure and altitude difference from start to finish. In the relative case, the offset shifts
FXPQ3115BV
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2020. All rights reserved.
Product data sheet
Rev. 5 — 28 May 2020
5 / 51
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