*Customer:
Pb Free
SPECIFICATION
ITEM
MODEL
Revision No.
CHIP LED DEVICE
HBTGFR421-S
[Contents]
1. Features
2. Absolute maximum ratings
3. Electro-optical characteristics
4. Characteristic Diagrams
5. Soldering profile
6. Outline dimension
7. Packing
8. Reel packing structure
9. Precaution for use
Customer
Approved by
Approved by
Approved by
Supplier
Drawn by
Checked by
Approved by
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
Seoul Semiconductor
HBTGFR421-S
- 1/7-
1. Features
Full-color lighting
Package : 1.6×1.5×0.5mm, Flat molding
2. Absolute Maximum Ratings
Parameter
Power Dissipation
Symbol
P
d
Color
Red
Green
Blue
Red
Green
Blue
Red
Green
Blue
5
-30 ~ +85
-40 ~ +100
Value
72
68
30
20
50
35
(Ta=25℃)
Unit
½
Forward Current
I
F
I
FM*1
V
R
T
opr
T
stg
㎃
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
㎃
V
℃
℃
*1 I
FM
conditions: Pulse width Tw≤ 0.1ms, Duty ratio≤ 1/10
3. Electro-optical Characteristics
Parameter
Forward Voltage
Symbol
V
F
I
R
I
V
λ
Condition
I
F
=10㎃
V
R
=5V
I
F
=10㎃
I
F
=20㎃
I
F
=20㎃
I
F
=20㎃
Color
Red
Green
Blue
Red
Green
Blue
Red
Green
Blue
Red
Green
Blue
Red
Green
Blue
Red
Green
Blue
Min
1.7
2.7
2.7
-
-
-
45
80
25
615
510
465
-
-
-
-
-
-
Typ
2.2
3.1
3.1
0.1
0.1
0.1
70
140
50
625
525
470
20
35
25
150
150
150
Max
2.4
3.4
3.4
10
10
10
-
-
-
635
530
475
-
-
-
-
-
-
(Ta=25℃)
Unit
V
Reverse Current
Luminous Intensity
*2
Dominant
Wavelength
Spectral Bandwidth
Viewing angle
*3
㎂
mcd
d
㎚
Δλ
㎚
2θ
1/2
˚
*2 The luminous intensity I
V
is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package.
*3
θ
1/2
is the off-axis where the luminous intensity is 1/2 the peak intensity.
[Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within
the maximum ratings shown above. All measurements were made under the standardized environment of SSC.
(Tolerance: V
F
±0.1V,
I
V
±10%, λ
d
±2nm)
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
HBTGFR421-S
- 2/7-
4. Characteristic Diagrams
Forward Current vs. Forward Voltage
Luminous Intensity vs. Forward Current
100
180
160
Relative Intensity I
V
[%]
140
120
100
80
60
40
Forward Current I
F
[mA]
10
1
RED
GREEN
BLUE
0.1
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
20
0
0
5
10
15
20
25
30
RED
GREEN
BLUE
35
40
Forward Voltage V
F
[V]
Forward Current I
F
[mA]
Forward Current Derating Curve
Radiation Diagram
40
35
30
25
20
15
10
5
0
-25
90
Forward current I
F
[mA]
.0
Red : 0.42mA/ C
o
120
60
.8
.6
.4
Blue & Green : 0.145mA/ C
o
150
30
.2
75
o
0
25
50
100
.0
180
0.5
0.5
0
Ambient temperature Ta[ C]
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
HBTGFR421-S
- 3/7-
5. Soldering Profile
Reflow Soldering Conditions/ Profile
(1) Lead Solder
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 240℃max. for 5 seconds max.
LED Surface temperature
°C
Operation heating
240
150
~
Pre-heating
Temperature
rise: 5°C/sec.
Cooling:
-5°C/sec.
120
0
60 to 120 sec.
5sec. max
(2) Lead-Free Solder
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 255℃max. for 20 seconds max.
LED Surface temperature
°C
Operation heating
255
(+5)
150
~
120
0
Pre-heating
Temperature
rise: 5°C/sec.
Cooling:
-5°C/sec.
60 to 120 sec.
10 to 20 sec.
(3) Hand Soldering conditions
-Not more than 3 seconds @MAX280℃, under Soldering iron.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
HBTGFR421-S
- 4/7-
6. Outline Dimension
Anode(Common)
0.4
1.5
3
4
Marking
(0.18)
Resin
0.2
1
Tolerance:
±0.1,
Unit:
㎜
0.8
0.2
1.8
1.1
1.6
1.2
0.8
Green
PCB
2
0.8
1
0.2
0.5
±0.05
0.6
2
0.4
3
4
Cathode
7. Packing
1.75
±0.1
±0.05
4.0
1.5
+0.1
-0
±0.1
1.75
2.0
±0.05
Blue
Red
0.2
±0.05
±0.05
3.5
4.0
±0.1
0.5
±0.05
1.73
±0.05
(2.75)
8.0
±0.2
0.7
±0.05
180
+0
-3
11.4
9
±0.3
Pb
Pb-free
(-)
(+)
2
±0.2
+0.2
-0
22
13
±0.2
Label
60
Tolerance:
±0.2,
Unit:
㎜
(1) Quantity : 4000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10pitches to be
±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off
from the carrier tape at 10˚ angle to be the carrier tape.
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
HBTGFR421-S
- 5/7-
2.4
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