MC10H103NSHRP概述

Gate, ECL10K, PDIP16,

MC10H103NSHRP规格参数

	MC10H103NSHRP	MC10H103JSHRP	MC10H103NL	MC10H103N	MC10H103J
描述	Gate, ECL10K, PDIP16,	Gate, ECL10K, CDIP16,	Gate, ECL10K, PQCC20,	OR Gate, ECL Series, 4-Func, 2-Input, ECL, PDIP16,	OR Gate, ECL Series, 4-Func, 2-Input, ECL, CDIP16,
是否Rohs认证	不符合	不符合	不符合	不符合	不符合
厂商名称	Monolithic Memories	Monolithic Memories	Monolithic Memories	Monolithic Memories	Monolithic Memories
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
JESD-30 代码	R-PDIP-T16	R-XDIP-T16	S-PQCC-J20	R-PDIP-T16	R-GDIP-T16
JESD-609代码	e0	e0	e0	e0	e0
端子数量	16	16	20	16	16
最高工作温度	70 °C	70 °C	70 °C	75 °C	75 °C
封装主体材料	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
封装代码	DIP	DIP	QCCJ	DIP	DIP
封装等效代码	DIP16,.3	DIP16,.3	LDCC20,.4SQ	DIP16,.3	DIP16,.3
封装形状	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE
施密特触发器	NO	NO	NO	NO	NO
表面贴装	NO	NO	YES	NO	NO
技术	ECL10K	ECL10K	ECL10K	ECL	ECL
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE
端子节距	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm
端子位置	DUAL	DUAL	QUAD	DUAL	DUAL
Is Samacsys	N	-	N	N	-
Base Number Matches	1	1	1	1	-
认证状态	-	-	Not Qualified	Not Qualified	Not Qualified

器件捷径: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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