EE PLD, 10ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 最大时钟频率 | 55.5 MHz |
| JESD-30 代码 | R-PDIP-T24 |
| 长度 | 31.915 mm |
| 专用输入次数 | 12 |
| I/O 线路数量 | 8 |
| 端子数量 | 24 |
| 最高工作温度 | 75 °C |
| 最低工作温度 | |
| 组织 | 12 DEDICATED INPUTS, 8 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 可编程逻辑类型 | EE PLD |
| 传播延迟 | 10 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 | 5.25 V |
| 最小供电电压 | 4.75 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| GAL20V8A-10LNC | GAL20V8A-10LVC | GAL20V8A-10LJC | GAL20V8A-15LJM | GAL20V8A-15LJI | GAL20V8A-15LJC | GAL20V8A-20LJM | GAL20V8A-12LJC | |
|---|---|---|---|---|---|---|---|---|
| 描述 | EE PLD, 10ns, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24 | EE PLD, 10ns, PQCC28, PLASTIC, LCC-28 | EE PLD, 10ns, CDIP24, CERAMIC, DIP-24 | EE PLD, 15ns, CDIP24, CERAMIC, DIP-24 | EE PLD, 15ns, CDIP24, CERAMIC, DIP-24 | EE PLD, 15ns, CDIP24, CERAMIC, DIP-24 | EE PLD, 20ns, CDIP24, CERAMIC, DIP-24 | EE PLD, 12ns, CDIP24, CERAMIC, DIP-24 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP | QLCC | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | DIP, | QCCJ, | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, | DIP, DIP24,.3 | DIP, DIP24,.3 |
| 针数 | 24 | 28 | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 最大时钟频率 | 55.5 MHz | 55.5 MHz | 55.5 MHz | 41.6 MHz | 41.6 MHz | 41.6 MHz | 33.3 MHz | 48 MHz |
| JESD-30 代码 | R-PDIP-T24 | S-PQCC-J28 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 |
| 专用输入次数 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| I/O 线路数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 24 | 28 | 24 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 75 °C | 75 °C | 75 °C | 125 °C | 85 °C | 75 °C | 125 °C | 75 °C |
| 组织 | 12 DEDICATED INPUTS, 8 I/O | 12 DEDICATED INPUTS, 8 I/O | 12 DEDICATED INPUTS, 8 I/O | 12 DEDICATED INPUTS, 8 I/O | 12 DEDICATED INPUTS, 8 I/O | 12 DEDICATED INPUTS, 8 I/O | 12 DEDICATED INPUTS, 8 I/O | 12 DEDICATED INPUTS, 8 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | QCCJ | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 10 ns | 10 ns | 10 ns | 15 ns | 15 ns | 15 ns | 20 ns | 12 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 4.57 mm | 5.715 mm | 5.715 mm | 5.715 mm | 5.715 mm | 5.715 mm | 5.715 mm |
| 最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V |
| 最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | MILITARY | INDUSTRIAL | COMMERCIAL EXTENDED | MILITARY | COMMERCIAL EXTENDED |
| 端子形式 | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 11.43 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| Is Samacsys | N | N | N | N | N | N | N | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 是否无铅 | - | - | 含铅 | 含铅 | 含铅 | - | 含铅 | 含铅 |
| 是否Rohs认证 | - | - | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 |
| 架构 | - | - | PAL-TYPE | PAL-TYPE | PAL-TYPE | - | PAL-TYPE | PAL-TYPE |
| JESD-609代码 | - | - | e0 | e0 | e0 | - | e0 | e0 |
| 输入次数 | - | - | 20 | 20 | 20 | - | 20 | 20 |
| 输出次数 | - | - | 8 | 8 | 8 | - | 8 | 8 |
| 产品条款数 | - | - | 64 | 64 | 64 | - | 64 | 64 |
| 封装等效代码 | - | - | DIP24,.3 | DIP24,.3 | DIP24,.3 | - | DIP24,.3 | DIP24,.3 |
| 峰值回流温度（摄氏度） | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | - | - | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 端子面层 | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
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