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LY62L1024SL-55LLI

产品描述存储器接口类型:Parallel 存储器容量:1Mb (128K x 8) 工作电压:2.7V ~ 3.6V 存储器类型:Non-Volatile
产品类别存储    SRAM存储器   
文件大小700KB,共18页
制造商Lyontek
官网地址http://www.lyontek.com.tw/index.html
下载文档 详细参数 选型对比 全文预览

LY62L1024SL-55LLI概述

存储器接口类型:Parallel 存储器容量:1Mb (128K x 8) 工作电压:2.7V ~ 3.6V 存储器类型:Non-Volatile

LY62L1024SL-55LLI规格参数

参数名称属性值
存储器构架(格式)SRAM
存储器接口类型Parallel
存储器容量1Mb (128K x 8)
工作电压2.7V ~ 3.6V
存储器类型Non-Volatile

文档预览

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LY62L1024
Rev. 1.9
128K X 8 BIT LOW POWER CMOS SRAM
REVISION HISTORY
Revision
Rev. 1.0
Rev. 1.1
Rev. 1.2
Description
Initial Issue
Revised Icc
Deleted L grade
Added SL grade
Added I
SB1
/I
DR
values when T
A
= 25
and T
A
= 40
Revised
FEATURES
&
ORDERING INFORMATION
Lead free
and green package available
to
Green package available
Added packing type in
ORDERING INFORMATION
Revised V
TERM
to V
T1
and V
T2
Deleted T
SOLDER
in
ABSOLUTE MAXIMUN RATINGS
Revised
PACKAGE OUTLINE DIMENSION
in page 9 & 10
Revised
PACKAGE OUTLINE DIMENSION
in page 10/11/12/13
Revised
ORDERING INFORMATION
in page 14
Revised
ORDERING INFORMATION
Deleted E grade
Added -45ns Spec.
Revised
ORDERING INFORMATION
Revised
PIN CONFIGURATION
in page 2
Deleted
32 pin 600 mil P-DIP Package Outline Dimension
in page 12
Deleted
32-pin 600 mil P-DIP
in
FEATURES
Deleted
WRITE CYCLE
Notes :
1.WE#, CE# must be high or CE2 must be low during all address transitions
in page 7
Issue Date
Jul.25.2004
Aug.13.2004
Mar.30.2009
Rev. 1.3
Rev. 1.4
Rev. 1.5
Rev. 1.6
Rev. 1.7
Dec.18.2009
May.7.2010
Aug.25.2010
Dec.10.2010
Feb.26.2015
Rev. 1.8
Rev. 1.9
Jun.17.2016
Jun.28.2016
Lyontek Inc.
reserves the rights to change the specifications and products without notice.
2F, No.17, Industry E. Rd. II, Science-Based Industrial Park, Hsinchu 300, Taiwan.
TEL: 886-3-6668838
FAX: 886-3-6668836
0

LY62L1024SL-55LLI相似产品对比

LY62L1024SL-55LLI LY62L1024LL-45SLT LY62L1024GL-55LLI LY62L1024GL-70LLI LY62L1024LL-55LLI LY62L1024RL-35LL LY62L1024RL-55LLI
描述 存储器接口类型:Parallel 存储器容量:1Mb (128K x 8) 工作电压:2.7V ~ 3.6V 存储器类型:Non-Volatile Standard SRAM, Standard SRAM, 128KX8, 55ns, CMOS, PBGA36, Standard SRAM, 128KX8, 70ns, CMOS, PBGA36, Standard SRAM, 128KX8, 55ns, CMOS, PDSO32, Standard SRAM, 128KX8, 35ns, CMOS, PDSO32, Standard SRAM, 128KX8, 55ns, CMOS, PDSO32,
是否Rohs认证 - 符合 符合 符合 符合 符合 符合
包装说明 - TSOP1, TFBGA, BGA36,6X8,30 TFBGA, BGA36,6X8,30 TSOP1, TSSOP32,.8,20 LSSOP, TSSOP32,.56,20 LSSOP, TSSOP32,.56,20
Reach Compliance Code - compliant compliant compliant compliant compliant compliant
最长访问时间 - 45 ns 55 ns 70 ns 55 ns 35 ns 55 ns
JESD-30 代码 - R-PDSO-G32 R-PBGA-B36 R-PBGA-B36 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32
长度 - 18.4 mm 8 mm 8 mm 18.4 mm 11.8 mm 11.8 mm
内存密度 - 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
内存集成电路类型 - STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
内存宽度 - 8 8 8 8 8 8
功能数量 - 1 1 1 1 1 1
端子数量 - 32 36 36 32 32 32
字数 - 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
字数代码 - 128000 128000 128000 128000 128000 128000
工作模式 - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 - 70 °C 85 °C 85 °C 85 °C 70 °C 85 °C
最低工作温度 - - -40 °C -40 °C -40 °C - -40 °C
组织 - 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8
封装主体材料 - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 - TSOP1 TFBGA TFBGA TSOP1 LSSOP LSSOP
封装形状 - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 - SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
并行/串行 - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
座面最大高度 - 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.25 mm 1.25 mm
最大供电电压 (Vsup) - 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) - 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) - 3 V 3 V 3 V 3 V 3 V 3 V
表面贴装 - YES YES YES YES YES YES
技术 - CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 - COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
端子形式 - GULL WING BALL BALL GULL WING GULL WING GULL WING
端子节距 - 0.5 mm 0.75 mm 0.75 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 - DUAL BOTTOM BOTTOM DUAL DUAL DUAL
处于峰值回流温度下的最长时间 - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 - 8 mm 6 mm 6 mm 8 mm 8 mm 8 mm
Objectid - - 8316047353 8316047357 8316047369 8316047387 8316047393
ECCN代码 - - EAR99 EAR99 EAR99 EAR99 EAR99
I/O 类型 - - COMMON COMMON COMMON COMMON COMMON
输出特性 - - 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装等效代码 - - BGA36,6X8,30 BGA36,6X8,30 TSSOP32,.8,20 TSSOP32,.56,20 TSSOP32,.56,20
电源 - - 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
认证状态 - - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大待机电流 - - 0.00001 A 0.00001 A 0.00001 A 0.000005 A 0.00001 A
最小待机电流 - - 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
最大压摆率 - - 0.03 mA 0.025 mA 0.03 mA 0.035 mA 0.03 mA

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