NSR20F40NXT5G
Schottky Barrier Diode
These Schottky barrier diodes are optimized for low forward
voltage drop and low leakage current and are offered in a Chip Scale
Package (CSP) to reduce board space. The low thermal resistance
enables designers to meet the challenging task of achieving higher
efficiency and meeting reduced space requirements.
Features
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•
•
•
•
•
Very Low Forward Voltage Drop
−
550 mV @ 2.0 A
Low Reverse Current
−
15
mA
@ 10 V VR
2.0 A of Continuous Forward Current
Power Dissipation of 665 mW with Minimum Trace
ESD Rating
−
Human Body Model: Class 3B
ESD Rating
−
Machine Model: Class C
•
Very High Switching Speed
•
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
40 V SCHOTTKY
BARRIER DIODE
1
CATHODE
2
ANODE
2
MARKING
DIAGRAM
PIN 1
1
20F40
YYY
•
•
•
•
•
•
•
•
•
•
LCD and Keypad Backlighting
Camera Photo Flash
Buck and Boost dc−dc Converters
Reverse Voltage and Current Protection
Clamping & Protection
Mobile Handsets
MP3 Players
Digital Camera and Camcorders
Notebook PCs & PDAs
GPS
DSN2
(0603)
CASE 152AB
20F40
YYY
= Specific Device Code
= Year Code
Markets
ORDERING INFORMATION
Device
NSR20F40NXT5G
Package
Shipping†
DSN2
5000 / Tape & Reel
(Pb−Free)
MAXIMUM RATINGS
Rating
Reverse Voltage
Forward Current (DC)
Forward Surge Current
(60 Hz @ 1 cycle)
Symbol
V
R
I
F
I
FSM
I
FRM
ESD
Value
40
2.0
28
4.0
>8
> 400
Unit
V
A
A
A
kV
V
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Repetitive Peak Forward Current
(Pulse Wave = 1 sec, Duty Cycle = 66%)
ESD Rating:
Human Body Model
Machine Model
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
©
Semiconductor Components Industries, LLC, 2013
October, 2013
−
Rev. 2
1
Publication Order Number:
NSR20F40/D
NSR20F40NXT5G
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance
Junction−to−Ambient (Note 1)
Total Power Dissipation @ T
A
= 25°C
Thermal Resistance
Junction−to−Ambient (Note 2)
Total Power Dissipation @ T
A
= 25°C
Storage Temperature Range
Junction Temperature
Symbol
R
qJA
P
D
R
qJA
P
D
T
stg
T
J
Min
Typ
Max
213
586
80
1.56
−40
to +125
+150
Unit
°C/W
mW
°C/W
W
°C
°C
1. Mounted onto a 4 in square FR−4 board 50 mm sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
2. Mounted onto a 4 in square FR−4 board 1 in sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Characteristic
Reverse Leakage
(V
R
= 10 V)
(V
R
= 40 V)
Forward Voltage
(I
F
= 1.0 A)
(I
F
= 2.0 A)
100,000
I
R
, REVERSE CURRENT (mA)
10,000
1000
100
10
1
0.1
0.01
0.001
0
5
10
15
20
25
30
35
40
125°C
75°C
25°C
−25°C
Symbol
I
R
Min
Typ
Max
15
150
0.47
0.55
Unit
mA
V
F
V
150°C
I
F
, FORWARD CURRENT (A)
1
125°C
0.1
150°C
0.01
75°C
25°C
−25°C
0.001
0
0.1
0.2
0.3
0.4
0.5
0.6
V
R
, REVERSE VOLTAGE (V)
V
F
, FORWARD VOLTAGE (V)
Figure 1. Reverse Current vs. Reverse Voltage
400
350
C, CAPACITANCE (pF)
300
250
200
150
100
50
0
0
5
10
15
20
25
Figure 2. Forward Current vs. Forward Voltage
T
A
= 25°C
30
35
40
V
R
, REVERSE VOLTAGE (V)
Figure 3. Capacitance
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2
NSR20F40NXT5G
PACKAGE DIMENSIONS
DSN2, 1.6x0.8, 0.9P, (0603)
CASE 152AB
ISSUE B
0.05 C
D
A B
E
TOP VIEW
0.05 C
A
0.05 C
A1
SIDE VIEW
0.05 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
DIM
A
A1
b
D
E
L
L2
L3
MILLIMETERS
MIN
MAX
0.25
0.31
−−−
0.05
0.55
0.65
1.60 BSC
0.80 BSC
1.45
1.55
0.90
1.00
0.25
0.35
CATHODE BAND MONTH CODING
C
SEATING
PLANE
DEC
SEP
JUN
MAR
FEB
JAN
NOV OCT
0.05 C A B
L
L/2
b
XXXX
YYY
XXXX
Y09
DEVICE CODE
YEAR CODE
1
0.05 C A B
L2
L3
BOTTOM VIEW
(EXAMPLE)
MOUNTING FOOTPRINT*
1.70
0.52
PIN 1
0.70
1.05
DIMENSIONS: MILLIMETERS
INDICATES AUG 2009
0.80
See Application Note AND8464/D for more mounting details
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
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NSR20F40/D