CM1693-04DE,
CM1693-06DE,
CM1693-08DE
L-C LCD and Camera EMI
Filter Array with ESD
Protection
Product Description
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8
1
uDFN8
DE SUFFIX
CASE 517BC
1
12
1
The CM1693 is a family of pi−style EMI filter arrays with ESD
protection, which integrates four, six or eight filters (C−L−C) into
a small−form factor, uDFN 0.40 mm pitch package. Each EMI filter
channel is implemented as a 3−pole L−C filter, where the component
values are 10 pF−26 nH−12 pF. The CM1693’s roll−off frequency at
−6
dB attenuation is 300 MHz and can be used in applications where
the data rates are as high as 140 Mbps. The CM1693 also provides
greater than
−30
dB attenuation over the 800 MHz to 6 GHz frequency
range. The device includes ESD diodes on every pin that provide
a very high level of protection for sensitive electronic components
against possible electrostatic discharge (ESD). The ESD protection
diodes connected to the filter ports are designed and characterized to
safely dissipate ESD strikes of
±18
kV, which is beyond the maximum
requirement of the IEC61000−4−2 international standard.
This device is particularly well suited for wireless handsets, mobile
LCD modules and PDAs because of its small package format and
easy−to−use pin assignments. In particular, the CM1693 is ideal for
EMI filtering and protecting data and control lines for the LCD display
and camera interface in mobile handsets.
The CM1693 is housed in space saving, low profile, 0.40 mm pitch
uDFN packages in a RoHS compliant, Pb−Free format.
Features
16
uDFN12
DE SUFFIX
CASE 517BD
uDFN16
DE SUFFIX
CASE 517BE
ELECTRICAL SCHEMATIC
Filter +
ESDn*
26 nH
10 pF
12 pF
Filter +
ESDn*
GND
1 of 4, 6 or 8 EMI/RFI Filter Channels
with Integrated ESD protection
* See Package/Pinout Diagram for expanded pin information
MARKING DIAGRAM
P93 MG
G
1
P936 MG
G
P938 MG
G
•
4, 6 or 8 Channels of EMI Filtering with Integrated ESD Protection
•
Pi−Style EMI Filters in a Capacitor−Inductor−Capacitor (C−L−C)
•
•
•
Network
+18 kV ESD Protection on Each Channel
(IEC 61000−4−2 Level 4, Contact Discharge)
Greater than
−35
dB Attenuation (Typical) at 1GHz
uDFN Lead−Free Package with 0.40 mm Lead Pitch:
♦
4−Ch. = 8−Lead uDFN
♦
6−Ch. = 12−Lead uDFN
♦
8−Ch. = 16−Lead uDFN
uDFN Package size:
♦
8−Lead: 1.70 mm x 1.35 mm
♦
12−Lead: 2.50 mm x 1.35 mm
♦
16−Lead: 3.30 mm x 1.35 mm
Increased Robustness Against Vertical Impacts During
Manufacturing Process
These Devices are Pb−Free and are RoHS Compliant
1
1
XXXX = Specific Device Code
M
= Month Code
G
= Pb−Free Package
(*Note: Microdot may be in either location)
ORDERING INFORMATION
Device
CM1693−04DE
CM1693−06DE
CM1693−08DE
Package
uDFN−8
(Pb−Free)
uDFN−12
(Pb−Free)
uDFN−16
(Pb−Free)
Shipping
†
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
•
•
•
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Applications
•
LCD and Camera Data Lines in Mobile Handsets
•
I/O Port Protection for Mobile Handsets, Notebook
Computers, PDAs etc.
•
Handheld PCs/PDAs
•
LCD and Camera Modules
•
EMI Filtering for Data Ports in Cell Phones, PDAs
or Notebook Computers.
•
Wireless Handsets
1
©
Semiconductor Components Industries, LLC, 2013
May, 2013
−
Rev. 3
Publication Order Number:
CM1693/D
CM1693−04DE, CM1693−06DE, CM1693−08DE
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Storage Temperature Range
Current per Inductor
DC Package Power Rating
Rating
–65 to +150
30
500
Units
°C
mA
mW
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
–40 to +85
Units
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS
(Note 1)
Symbol
L
C
TOTAL
V
DIODE
I
LEAK
V
SIG
Channel Inductance
Total Channel Capacitance
Standoff Voltage
Diode Leakage Current (reverse bias)
Signal Clamp Voltage
Positive Clamp
Negative Clamp
In−system ESD Withstand Voltage
Contact Discharge per IEC 61000−4−2 Level 4
Dynamic Resistance
Positive
Negative
Roll−off Frequency at
−6
dB Attenuation
Z
SOURCE
= 50
W,
Z
LOAD
= 50
W
At 2.5 VDC Reverse Bias,
1 MHz, 30 mVAC
I
DIODE
= 10
mA
V
DIODE
= +3.3 V
I
LOAD
= 10 mA
I
LOAD
= –10 mA
(Notes 2, 3 and 4)
5.6
–1.5
±18
2.3
0.9
300
17.6
5.5
0.1
6.8
–0.8
1.0
9.0
−0.4
Parameter
Conditions
Min
Typ
26
22
26.4
Max
Units
nH
pF
V
mA
V
V
ESD
R
DYN
kV
W
f
R
MHz
1. T
A
= 25
°
C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin (i.e. if ESD is applied to pin A1 then clamping voltage is
measured at pin C1). Unused pins are left open.
4. These parameters are guaranteed by design and characterization.
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CM1693−04DE, CM1693−06DE, CM1693−08DE
MECHANICAL DETAILS
uDFN−08, uDFN−12 and uDFN−16 Mechanical Specifications, 0.4mm
The 8−lead, 12−lead and 16−lead, 0.4 mm pitch uDFN package dimensions are presented below.
Table 5. TAPE AND REEL SPECIFICATIONS
Pocket Size (mm)
Part Number
CM1693−04DE
CM1693−06DE
CM1693−08DE
Package Size (mm)
1.70 x 1.35 x 0.50
2.50 x 1.35 x 0.50
3.30 x 1.35 x 0.50
B
0
x A
0
x K
0
1.95 x 1.60 x 0.60
2.75 x 1.60 x 0.60
3.50 x 1.55 x 0.70
Tape Width
†
W
8 mm
8 mm
12 mm
Reel
Diameter
178 mm (7″)
178 mm (7″)
178 mm (7″)
Qty per
Reel
3000
3000
3000
P
0
4 mm
4 mm
4 mm
P
1
4 mm
4 mm
4 mm
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
10 Pitches Cumulative
Top
Cover
Tape
P
0
Tolerance On Tape
±0.2
mm
A
0
W
B
0
K
0
For Tape Feeder Reference
Only Including Draft
Concentric Around B
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
Embossment
Î
Î
Î
Î
P
1
Center Lines
of Cavity
User Direction of Feed
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