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25AA256T-I/SN: 产品描述存储器接口类型：SPI 存储器容量：256Kb (32K x 8) 工作电压：1.8V ~ 5.5V 存储器类型：Non-Volatile 256-Kbit(32K x 8bit)，SPI接口，工作电压：1.8V to 5.5V; 产品类别存储存储; 文件大小800KB，共32页; 制造商Microchip(微芯科技); 官网地址https://www.microchip.com; 标准

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25AA256T-I/SN概述

存储器接口类型：SPI 存储器容量：256Kb (32K x 8) 工作电压：1.8V ~ 5.5V 存储器类型：Non-Volatile 256-Kbit(32K x 8bit)，SPI接口，工作电压：1.8V to 5.5V

25AA256T-I/SN规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
零件包装代码	SOIC
包装说明	0.150 INCH, PLASTIC, MS-012, SOIC-8
针数	8
Reach Compliance Code	compliant
ECCN代码	EAR99
Factory Lead Time	10 weeks 1 day
最大时钟频率 (fCLK)	10 MHz
数据保留时间-最小值	200
耐久性	1000000 Write/Erase Cycles
JESD-30 代码	R-PDSO-G8
JESD-609代码	e3
长度	4.9 mm
内存密度	262144 bit
内存集成电路类型	EEPROM
内存宽度	8
湿度敏感等级	3
功能数量	1
端子数量	8
字数	32768 words
字数代码	32000
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	32KX8
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP8,.25
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
并行/串行	SERIAL
峰值回流温度（摄氏度）	260
电源	2/5 V
认证状态	Not Qualified
座面最大高度	1.75 mm
串行总线类型	SPI
最大待机电流	0.000001 A
最大压摆率	0.006 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	1.8 V
标称供电电压 (Vsup)	2.5 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Matte Tin (Sn)
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	40
宽度	3.91 mm
最长写入周期时间 (tWC)	5 ms
写保护	HARDWARE/SOFTWARE
Base Number Matches	1

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25AA256/25LC256

256K SPI Bus Serial EEPROM

Device Selection Table

Part Number

25LC256

25AA256

Range

2.5-5.5V

1.8-5.5V

Page Size

64 Byte

Temp. Ranges

I, E

Packages

P, SN, SM, ST, MF

Features:

• Max. Clock 10 MHz

• Low-Power CMOS Technology:

- Max. Write Current: 5 mA at 5.5V, 10 MHz

- Read Current: 6 mA at 5.5V, 10 MHz

- Standby Current: 1

A

at 5.5V

• 32,768 x 8-bit Organization

• 64-Byte Page

• Self-Timed Erase and Write Cycles (5 ms max.)

• Block Write Protection:

- Protect none, 1/4, 1/2 or all of array

• Built-In Write Protection:

- Power-on/off data protection circuitry

- Write enable latch

- Write-protect pin

• Sequential Read

• High Reliability:

- Endurance: 1,000,000 erase/write cycles

- Data retention: > 200 years

- ESD protection: > 4000V

• Temperature Ranges Supported:

- Industrial (I):

-40C to +85C

- Automotive (E):

-40°C to +125°C

• Pb-Free and RoHS Compliant

Description:

The Microchip Technology Inc. 25AA256/25LC256

(25XX256*) are 256 Kbit Serial Electrically Erasable

PROMs. The memory is accessed via a simple Serial

Peripheral Interface (SPI) compatible serial bus. The

bus signals required are a clock input (SCK) plus

separate data in (SI) and data out (SO) lines. Access to

the device is controlled through a Chip Select (CS)

input.

Communication to the device can be paused via the

hold pin (HOLD). While the device is paused,

transitions on its inputs will be ignored, with the

exception of Chip Select, allowing the host to service

higher priority interrupts.

The 25XX256 is available in standard packages includ-

ing 8-lead PDIP and SOIC, and advanced packaging

including 8-lead DFN and 8-lead TSSOP.

Package Types (not to scale)

DFN

(MF)

CS 1

SO 2

WP 3

HOLD

SCK

PDIP/SOIC

(P, SN, SM)

HOLD

SCK

Pin Function Table

Name

SCK

HOLD

Function

Chip Select Input

Serial Data Output

Write-Protect

Ground

Serial Data Input

Serial Clock Input

Hold Input

Supply Voltage

HOLD

Rotated TSSOP

(ST)

SCK

TSSOP

(ST)

HOLD

SCK

* 25XX256 is used in this document as a generic part number

for the 25AA256/25LC256 devices.



2003-2013 Microchip Technology Inc.

DS21822G-page 1

25AA256T-I/SN相似产品对比

	25AA256T-I/SN	25AA256T-E/MF	25AA256T-E/ST	25AA256-E/ST	25AA256-E/P	25AA256T-E/SM	25LC256T-I/SNRVB	25LC256-I/SNRVB	25AA256/S16K	25AA256/WF16K
描述	存储器接口类型：SPI 存储器容量：256Kb (32K x 8) 工作电压：1.8V ~ 5.5V 存储器类型：Non-Volatile 256-Kbit(32K x 8bit)，SPI接口，工作电压：1.8V to 5.5V	eeprom 256k, 32k X 8, 1.8V ser EE ext	eeprom 256k, 32k X 8, 1.8V ser EE ext	eeprom 256k, 32k X 8, 1.8V ser EE ext	eeprom 256k, 32k X 8, 1.8V ser EE ext	eeprom 256k, 32k X 8, 1.8V ser EE ext	EEPROM, 32KX8, Serial, CMOS, PDSO8	EEPROM, 32KX8, Serial, CMOS, PDSO8	IC EEPROM 256K SPI 10MHZ WAFER	IC EEPROM 256K SPI 10MHZ WAFER
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	EEPROM	EEPROM
是否无铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	-	-	-	-
是否Rohs认证	符合	符合	符合	符合	符合	符合	-	-	-	-
零件包装代码	SOIC	DFN	TSSOP	TSSOP	DIP	SOIC	-	-	-	-
包装说明	0.150 INCH, PLASTIC, MS-012, SOIC-8	6 X 5 MM, PLASTIC, DFN-8	4.40 MM, PLASTIC, MO-153, TSSOP-8	4.40 MM, PLASTIC, MO-153, TSSOP-8	0.300 INCH, PLASTIC, MS-001, DIP-8	0.208 INCH, EIAJ, PLASTIC, SOIC-8	SOP,	SOP,	-	-
针数	8	8	8	8	8	8	-	-	-	-
Reach Compliance Code	compliant	compli	compli	compli	compli	compli	compliant	compliant	-	-
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	-	-	-	-
Factory Lead Time	10 weeks 1 day	9 weeks	24 weeks	24 weeks	6 weeks	27 weeks	-	-	-	-
最大时钟频率 (fCLK)	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz	-	-
数据保留时间-最小值	200	200	200	200	200	200	-	-	-	-
耐久性	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	-	-	-	-
JESD-30 代码	R-PDSO-G8	R-PDSO-N8	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	-	-
JESD-609代码	e3	e3	e3	e3	e3	e3	-	-	-	-
长度	4.9 mm	5.99 mm	4.4 mm	4.4 mm	9.46 mm	5.28 mm	4.9 mm	4.9 mm	-	-
内存密度	262144 bit	262144 bi	262144 bi	262144 bi	262144 bi	262144 bi	262144 bit	262144 bit	-	-
内存集成电路类型	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	-	-
内存宽度	8	8	8	8	8	8	8	8	-	-
功能数量	1	1	1	1	1	1	1	1	-	-
端子数量	8	8	8	8	8	8	8	8	-	-
字数	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	-	-
字数代码	32000	32000	32000	32000	32000	32000	32000	32000	-	-
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	-
最高工作温度	85 °C	125 °C	125 °C	125 °C	125 °C	125 °C	85 °C	85 °C	-	-
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-	-
组织	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	-	-
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-
封装代码	SOP	VSON	TSSOP	TSSOP	DIP	SOP	SOP	SOP	-	-
封装等效代码	SOP8,.25	SOLCC8,.25	TSSOP8,.25	TSSOP8,.25	DIP8,.3	SOP8,.3	-	-	-	-
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	-
封装形式	SMALL OUTLINE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	-	-
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	-	-
峰值回流温度（摄氏度）	260	260	260	260	NOT APPLICABLE	260	-	-	-	-
电源	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	-	-	-	-
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	-	-	-
座面最大高度	1.75 mm	1 mm	1.1 mm	1.1 mm	4.32 mm	2.03 mm	1.75 mm	1.75 mm	-	-
串行总线类型	SPI	SPI	SPI	SPI	SPI	SPI	SPI	SPI	-	-
最大待机电流	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	-	-	-	-
最大压摆率	0.006 mA	0.006 mA	0.006 mA	0.006 mA	0.006 mA	0.006 mA	-	-	-	-
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	-	-
最小供电电压 (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	2.5 V	2.5 V	-	-
标称供电电压 (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	4.5 V	5 V	-	-
表面贴装	YES	YES	YES	YES	NO	YES	YES	YES	-	-
温度等级	INDUSTRIAL	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	-	-
端子面层	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn) - annealed	-	-	-	-
端子形式	GULL WING	NO LEAD	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	-	-
端子节距	1.27 mm	1.27 mm	0.65 mm	0.65 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	-	-
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	-	-
处于峰值回流温度下的最长时间	40	40	40	40	NOT APPLICABLE	40	-	-	-	-
宽度	3.91 mm	4.92 mm	3 mm	3 mm	7.62 mm	5.21 mm	3.91 mm	3.9 mm	-	-
最长写入周期时间 (tWC)	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	-	-
写保护	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	-	-	-	-
Base Number Matches	1	1	1	1	1	-	1	1	-	-

25AA256T-I/SN

25AA256T-I/SN概述

25AA256T-I/SN规格参数

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