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25AA256/S16K: 产品描述IC EEPROM 256K SPI 10MHZ WAFER; 产品类别存储; 文件大小800KB，共32页; 制造商Microchip(微芯科技); 官网地址https://www.microchip.com; 标准

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25AA256/S16K概述

IC EEPROM 256K SPI 10MHZ WAFER

25AA256/S16K规格参数

参数名称	属性值
存储器类型	非易失
存储器格式	EEPROM
技术	EEPROM
存储容量	256Kb （32K x 8）
时钟频率	10MHz
写周期时间 - 字，页	5ms
存储器接口	SPI
电压 - 电源	1.8 V ~ 5.5 V
工作温度	0°C ~ 70°C（TA）
安装类型	表面贴装
封装/外壳	模具
供应商器件封装	模具

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25AA256/25LC256

256K SPI Bus Serial EEPROM

Device Selection Table

Part Number

25LC256

25AA256

Range

2.5-5.5V

1.8-5.5V

Page Size

64 Byte

Temp. Ranges

I, E

Packages

P, SN, SM, ST, MF

Features:

• Max. Clock 10 MHz

• Low-Power CMOS Technology:

- Max. Write Current: 5 mA at 5.5V, 10 MHz

- Read Current: 6 mA at 5.5V, 10 MHz

- Standby Current: 1

A

at 5.5V

• 32,768 x 8-bit Organization

• 64-Byte Page

• Self-Timed Erase and Write Cycles (5 ms max.)

• Block Write Protection:

- Protect none, 1/4, 1/2 or all of array

• Built-In Write Protection:

- Power-on/off data protection circuitry

- Write enable latch

- Write-protect pin

• Sequential Read

• High Reliability:

- Endurance: 1,000,000 erase/write cycles

- Data retention: > 200 years

- ESD protection: > 4000V

• Temperature Ranges Supported:

- Industrial (I):

-40C to +85C

- Automotive (E):

-40°C to +125°C

• Pb-Free and RoHS Compliant

Description:

The Microchip Technology Inc. 25AA256/25LC256

(25XX256*) are 256 Kbit Serial Electrically Erasable

PROMs. The memory is accessed via a simple Serial

Peripheral Interface (SPI) compatible serial bus. The

bus signals required are a clock input (SCK) plus

separate data in (SI) and data out (SO) lines. Access to

the device is controlled through a Chip Select (CS)

input.

Communication to the device can be paused via the

hold pin (HOLD). While the device is paused,

transitions on its inputs will be ignored, with the

exception of Chip Select, allowing the host to service

higher priority interrupts.

The 25XX256 is available in standard packages includ-

ing 8-lead PDIP and SOIC, and advanced packaging

including 8-lead DFN and 8-lead TSSOP.

Package Types (not to scale)

DFN

(MF)

CS 1

SO 2

WP 3

HOLD

SCK

PDIP/SOIC

(P, SN, SM)

HOLD

SCK

Pin Function Table

Name

SCK

HOLD

Function

Chip Select Input

Serial Data Output

Write-Protect

Ground

Serial Data Input

Serial Clock Input

Hold Input

Supply Voltage

HOLD

Rotated TSSOP

(ST)

SCK

TSSOP

(ST)

HOLD

SCK

* 25XX256 is used in this document as a generic part number

for the 25AA256/25LC256 devices.



2003-2013 Microchip Technology Inc.

DS21822G-page 1

25AA256/S16K相似产品对比

	25AA256/S16K	25AA256T-E/MF	25AA256T-E/ST	25AA256-E/ST	25AA256-E/P	25AA256T-E/SM	25LC256T-I/SNRVB	25LC256-I/SNRVB	25AA256/WF16K	25AA256T-I/SN
描述	IC EEPROM 256K SPI 10MHZ WAFER	eeprom 256k, 32k X 8, 1.8V ser EE ext	eeprom 256k, 32k X 8, 1.8V ser EE ext	eeprom 256k, 32k X 8, 1.8V ser EE ext	eeprom 256k, 32k X 8, 1.8V ser EE ext	eeprom 256k, 32k X 8, 1.8V ser EE ext	EEPROM, 32KX8, Serial, CMOS, PDSO8	EEPROM, 32KX8, Serial, CMOS, PDSO8	IC EEPROM 256K SPI 10MHZ WAFER	存储器接口类型：SPI 存储器容量：256Kb (32K x 8) 工作电压：1.8V ~ 5.5V 存储器类型：Non-Volatile 256-Kbit(32K x 8bit)，SPI接口，工作电压：1.8V to 5.5V
技术	EEPROM	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	EEPROM	CMOS
是否无铅	-	不含铅	不含铅	不含铅	不含铅	不含铅	-	-	-	不含铅
是否Rohs认证	-	符合	符合	符合	符合	符合	-	-	-	符合
零件包装代码	-	DFN	TSSOP	TSSOP	DIP	SOIC	-	-	-	SOIC
包装说明	-	6 X 5 MM, PLASTIC, DFN-8	4.40 MM, PLASTIC, MO-153, TSSOP-8	4.40 MM, PLASTIC, MO-153, TSSOP-8	0.300 INCH, PLASTIC, MS-001, DIP-8	0.208 INCH, EIAJ, PLASTIC, SOIC-8	SOP,	SOP,	-	0.150 INCH, PLASTIC, MS-012, SOIC-8
针数	-	8	8	8	8	8	-	-	-	8
Reach Compliance Code	-	compli	compli	compli	compli	compli	compliant	compliant	-	compliant
ECCN代码	-	EAR99	EAR99	EAR99	EAR99	EAR99	-	-	-	EAR99
Factory Lead Time	-	9 weeks	24 weeks	24 weeks	6 weeks	27 weeks	-	-	-	10 weeks 1 day
最大时钟频率 (fCLK)	-	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz	10 MHz	-	10 MHz
数据保留时间-最小值	-	200	200	200	200	200	-	-	-	200
耐久性	-	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	-	-	-	1000000 Write/Erase Cycles
JESD-30 代码	-	R-PDSO-N8	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	-	R-PDSO-G8
JESD-609代码	-	e3	e3	e3	e3	e3	-	-	-	e3
长度	-	5.99 mm	4.4 mm	4.4 mm	9.46 mm	5.28 mm	4.9 mm	4.9 mm	-	4.9 mm
内存密度	-	262144 bi	262144 bi	262144 bi	262144 bi	262144 bi	262144 bit	262144 bit	-	262144 bit
内存集成电路类型	-	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	-	EEPROM
内存宽度	-	8	8	8	8	8	8	8	-	8
功能数量	-	1	1	1	1	1	1	1	-	1
端子数量	-	8	8	8	8	8	8	8	-	8
字数	-	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	-	32768 words
字数代码	-	32000	32000	32000	32000	32000	32000	32000	-	32000
工作模式	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS
最高工作温度	-	125 °C	125 °C	125 °C	125 °C	125 °C	85 °C	85 °C	-	85 °C
最低工作温度	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C
组织	-	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	-	32KX8
封装主体材料	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
封装代码	-	VSON	TSSOP	TSSOP	DIP	SOP	SOP	SOP	-	SOP
封装等效代码	-	SOLCC8,.25	TSSOP8,.25	TSSOP8,.25	DIP8,.3	SOP8,.3	-	-	-	SOP8,.25
封装形状	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
封装形式	-	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	-	SMALL OUTLINE
并行/串行	-	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	-	SERIAL
峰值回流温度（摄氏度）	-	260	260	260	NOT APPLICABLE	260	-	-	-	260
电源	-	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	-	-	-	2/5 V
认证状态	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	-	-	Not Qualified
座面最大高度	-	1 mm	1.1 mm	1.1 mm	4.32 mm	2.03 mm	1.75 mm	1.75 mm	-	1.75 mm
串行总线类型	-	SPI	SPI	SPI	SPI	SPI	SPI	SPI	-	SPI
最大待机电流	-	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	-	-	-	0.000001 A
最大压摆率	-	0.006 mA	0.006 mA	0.006 mA	0.006 mA	0.006 mA	-	-	-	0.006 mA
最大供电电压 (Vsup)	-	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	-	5.5 V
最小供电电压 (Vsup)	-	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	2.5 V	2.5 V	-	1.8 V
标称供电电压 (Vsup)	-	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	4.5 V	5 V	-	2.5 V
表面贴装	-	YES	YES	YES	NO	YES	YES	YES	-	YES
温度等级	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL
端子面层	-	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn) - annealed	-	-	-	Matte Tin (Sn)
端子形式	-	NO LEAD	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	-	GULL WING
端子节距	-	1.27 mm	0.65 mm	0.65 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	-	1.27 mm
端子位置	-	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	-	DUAL
处于峰值回流温度下的最长时间	-	40	40	40	NOT APPLICABLE	40	-	-	-	40
宽度	-	4.92 mm	3 mm	3 mm	7.62 mm	5.21 mm	3.91 mm	3.9 mm	-	3.91 mm
最长写入周期时间 (tWC)	-	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	-	5 ms
写保护	-	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	-	-	-	HARDWARE/SOFTWARE
Base Number Matches	-	1	1	1	1	-	1	1	-	1

25AA256/S16K

25AA256/S16K概述

25AA256/S16K规格参数

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25AA256/S16K相似产品对比

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