FREQUENCY
QEN62
Plastic J LEAD SMD XO – Communications Equipment Application
Specification (Rev-F)
Electrical Characteristics ......................................................P01
Mechanical Characteristics ...................................................P02
Ordering Information .............................................................P03
Suggested Reflow Soldering profile ......................................P03
Tape Drawing........................................................................P04
Reel Drawing ........................................................................P04
Frequency
QEN62
Plastic J LEAD SMD XO – Communications Equipment Application
Specification (rev-F)
February 06
th
, 2006
Electrical Characteristics
Electrical Parameters
Frequency range
Output logic
Operating temperature
range
(see table 1)
Storage temperature
range
Power supply voltage
(Vcc)
Frequency Stability
(see note 1)
Unit
MHz
Minimum
1
Typical
Maximum
66.667
Test conditions
HCMOS / TTL Output
°C
°C
V
± ppm
± ppm
mA
-55
+3.3
50
-10 to +70
-40 to +85
+125
+5.0
100
5
Refer to Ordering
Information
Refer to Ordering
Information
Ref at 25°C
Refer to Ordering
Information
Aging (First Year)
Input current
(see table 2)
Output load
HCMOS load
TTL load
pF
LS-TTL
%
ns
ns
15
1
40/60
30
10
Refer to Ordering
Information
Duty cycle
Rise & Fall time
Start-up time
8
10
From 10% Vcc to
90% Vcc
From 10% Vcc to
90% Vcc
Note 1:
Include 25°C tolerance, operating temperature range, input voltage change (±5%), load change
(±10%), first year aging, shock and vibration.
Table 1 : Stability Codes
± 50ppm
± 100ppm
-10 to +70°C
B
A
- 40 to +85°C
F
D
Table 2 : Input Current
Frequency
range (MHz)
1.000 to 23.99
24.00 to 49.99
50.00 to 66.667
Vcc=5V
Cl=15 pF
20 mA
30 mA
40 mA
Vcc=3.3V
Cl=15pF
15 mA
20 mA
30 mA
1
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
Frequency
QEN62
Plastic J LEAD SMD XO – Communications Equipment Application
Specification (rev-F)
February 06
th
, 2006
Mechanical Characteristics
BOTTOM VIEW
#4
#3
1.27
SUGGESTED PAD
9.8
max
3.81
1.27
#1
14.0 max
#2
3.0
5.8
3.0
4.7
max
0.52
5.08
1.52
7.62
0.25
min
#1
#2
#3
#4
Pin connections
Tri state
Ground
Output
+Vcc
Tri state function
Pin #1
Output (Pin #3)
Open
Active
“1”
Active
“0”
High Z
Line 1
Line 2
Line 3
Marking
QEN62 + stability/supply voltage/output code
Frequency in MHz (6 digits)
Date code (YYWW)+Manugacturing code
Example for QEN62AAB / 3.6864MHz
Line 1 : QEN62AAB
Line 2 : 3.6864
Line 3 : 0547-N
2
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
Frequency
QEN62
Plastic J LEAD SMD XO – Communications Equipment Application
Specification (rev-F)
February 06
th
, 2006
Ordering Information
QEN62
A
Part numbering system
A
B
3.6864MHZ
Package type
SMD Package
QEN62 :
Plastic J Lead
SMD
Temperature Stability
A
:
± 100ppm vs -10 to +70°C
Supply
Voltage
A
: + 5.0V
D
: +3.3V
Output
A
: HCMOS 15pF
B
: HCMOS 30pF
Nominal Frequency
(MHz)
Please enter the nominal
frequency
B
: ± 50ppm vs -10 to +70°C
D
: ± 100ppm vs -40 to +85°C
F
: ± 50ppm vs -40 to +85°C
Suggested Reflow Soldering Profile
3
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
Frequency
QEN62
Plastic J LEAD SMD XO – Communications Equipment Application
Specification (rev-F)
February 06
th
, 2006
Tape Drawing
Item
Pitch of components
Pitch of sprocket hole
Length from hole center to component center
Width of carrier tape
Width of adhesive tape
Height of component hole
Width of component hole
Gap of hold down tape and carrier tape
Diameter of sprocket hole
Diameter of feed hole
Total of tape thickness
Code
P
Po
P1
W
W0
A
B
W2
Do
D1
K
Dimension
12
4.0
2.0
24.0
11.5
14.65
9.60
1.75
∅
1.55
∅
1.55
5.60
Tolerance
± 0.1
± 0.1
± 0.1
± 0.3
± 0.1
± 0.1
± 0.1
± 0.1
± 0.05
± 0.25
± 0.1
Reel Drawing
1.5
25
Multiple
: 1Kpcs per Reel
Ø20.2
Ø13
Unit : mm
Ø100
Ø330
4
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
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