Enhanced product, 16/32 bit RISC flash MCU, Arm Cortex-R5F, EMAC, FlexRay 337-NFBGA -55 to 125
| 参数名称 | 属性值 |
| GPIO | 168 |
| I2C | 2 |
| Rating | Catalog |
| UART(SCI) | 4 |
| MibSPI | 5 |
| Approx. price(US$) | 65.00 | 1ku |
| CPU | Arm-Cortex - R5F |
| HET channels | 64 |
| SCI/LIN | 4/2 |
| FlexRay | 2-ch |
| TI functional safety category | Functional safety compliant |
| RAM(KB) | 512 |
| Data flash(KB) | 128 |
| PWM(Ch) | 14 |
| EMIF | 16-bit |
| Operating temperature range(C) | -55 to 125 |
| Frequency(MHz) | 300 |
| ADC | 2 x 12-Bit (41ch) |
| CAN(#) | 4 |
| Ethernet MAC | 10/100 |
| Package Group | NFBGA|337 |
| Flash (KB) | 4096 |
| TMS570LC4357-EP | TMS5704357BGWTEP | V62/18606-01XF | |
|---|---|---|---|
| 描述 | Enhanced product, 16/32 bit RISC flash MCU, Arm Cortex-R5F, EMAC, FlexRay 337-NFBGA -55 to 125 | Enhanced product, 16/32 bit RISC flash MCU, Arm Cortex-R5F, EMAC, FlexRay 337-NFBGA -55 to 125 | Enhanced product, 16/32 bit RISC flash MCU, Arm Cortex-R5F, EMAC, FlexRay 337-NFBGA -55 to 125 |
| Brand Name | - | Texas Instruments | Texas Instruments |
| 包装说明 | - | NFBGA-337 | LFBGA, |
| Reach Compliance Code | - | not_compliant | not_compliant |
| 具有ADC | - | YES | YES |
| 位大小 | - | 32 | 32 |
| 最大时钟频率 | - | 80 MHz | 80 MHz |
| DAC 通道 | - | NO | NO |
| DMA 通道 | - | YES | YES |
| JESD-30 代码 | - | S-PBGA-B337 | S-PBGA-B337 |
| JESD-609代码 | - | e0 | e0 |
| 长度 | - | 16 mm | 16 mm |
| 湿度敏感等级 | - | 3 | 3 |
| I/O 线路数量 | - | 145 | 168 |
| 端子数量 | - | 337 | 337 |
| 片上程序ROM宽度 | - | 8 | 8 |
| 最高工作温度 | - | 125 °C | 125 °C |
| 最低工作温度 | - | -55 °C | -55 °C |
| PWM 通道 | - | YES | YES |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | LFBGA | LFBGA |
| 封装形状 | - | SQUARE | SQUARE |
| 封装形式 | - | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | - | 220 | 220 |
| RAM（字节） | - | 524288 | 524288 |
| ROM可编程性 | - | FLASH | FLASH |
| 座面最大高度 | - | 1.4 mm | 1.4 mm |
| 速度 | - | 300 MHz | 300 MHz |
| 最大供电电压 | - | 1.32 V | 1.32 V |
| 最小供电电压 | - | 1.14 V | 1.14 V |
| 标称供电电压 | - | 1.2 V | 1.2 V |
| 表面贴装 | - | YES | YES |
| 技术 | - | CMOS | CMOS |
| 温度等级 | - | MILITARY | MILITARY |
| 端子面层 | - | Tin/Lead (Sn/Pb) | TIN LEAD |
| 端子形式 | - | BALL | BALL |
| 端子节距 | - | 0.8 mm | 0.8 mm |
| 端子位置 | - | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | 20 |
| 宽度 | - | 16 mm | 16 mm |
| uPs/uCs/外围集成电路类型 | - | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
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